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Micro-chimney and thermosiphon die-level cooling 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0319505 (2009-01-08)
등록번호 US8006747 (2011-08-15)
발명자 / 주소
  • Chrysler, Gregory M.
  • Maveety, James G.
출원인 / 주소
  • Intel Corporation
대리인 / 주소
    Pillsbury Winthrop Shaw Pittman LLP
인용정보 피인용 횟수 : 1  인용 특허 : 67

초록 ▼

A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the loc

대표청구항 ▼

What is claimed is: 1. A method for dissipating heat from a localized area, the method comprising:providing a semiconductor die with at least one conduit directly within the semiconductor die, the conduit being proximate to the localized area within the semiconductor die, the conduit being at least

이 특허에 인용된 특허 (67)

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이 특허를 인용한 특허 (1)

  1. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
    상세보기

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