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Insert molded actuator components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B29C-045/14
출원번호 US-0458718 (2006-07-20)
등록번호 US8007704 (2011-08-15)
발명자 / 주소
  • Smith, Timothy J.
  • Wang, Tzu-Yu
  • Eskridge, Adam Z.
출원인 / 주소
  • Honeywell International Inc.
대리인 / 주소
    Seager, Tufte & Wickhem LLC
인용정보 피인용 횟수 : 4  인용 특허 : 94

초록

The present invention relates to electrostatically actuated device components and methods of making the same. In an embodiment, the invention includes a method of making an electrostatically actuated device component including providing a multilayered structure comprising a first layer comprising a

대표청구항

We claim: 1. A method of making an electrostatically actuated device component for an electrostatically actuated device, comprising:providing a multilayered structure comprising a first layer comprising a first polymer;a second layer comprising a conductive material, the second layer disposed over t

이 특허에 인용된 특허 (94)

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이 특허를 인용한 특허 (4)

  1. Lynch, Stephen B.; Filson, John B.; Zadesky, Stephen P.; Weber, Douglas J., Attachment features for housings.
  2. Kubiak, Michael, Housing for a semiconductor chip and semiconductor chip with a housing.
  3. Andersson, Olov; Eriksson, Jonas; Graichen, Andreas, Hybride part and method of manufacture.
  4. Lynch, Stephen Brian; Filson, John Benjamin; Zadesky, Stephen Paul; Weber, Douglas, Methods and systems for forming housings from multi-layer materials.
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