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Extended pad life for ECMP and barrier removal 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-011/02
출원번호 US-0695484 (2007-04-02)
등록번호 US8012000 (2011-08-23)
발명자 / 주소
  • Wang, Yuchun
  • Ewald, Robert A.
  • Hsu, Wei-Yung
  • Chen, Liang-Yuh
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Sheridan, L.L.P.
인용정보 피인용 횟수 : 1  인용 특허 : 59

초록

A method and apparatus for extending a polishing article lifetime on a polishing tool with multiple platens is described. The apparatus includes an advanceable roll to roll platen with multiple embodiments of a polishing article to be used thereon. The polishing article is adapted to perform a polis

대표청구항

The invention claimed is: 1. A polishing article for a roll to roll polishing system, comprising:a linear strip wound on a supply roll, the linear strip comprising a first conductive layer disposed on a second conductive layer with a dielectric layer therebetween, wherein the first conductive layer

이 특허에 인용된 특허 (59)

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  25. Datta Madhav (Yorktown Heights NY) Romankiw Lubomyr T. (Briarcliff Manor NY), Electrochemical tool for uniform metal removal during electropolishing.
  26. Wardle Frank Peter,GB2, Electrode for electrochemical machining, method of electrochemical machining with said electrode, a bearing and a metho.
  27. Uzoh Cyprian E., Electroetch and chemical mechanical polishing equipment.
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  29. Sun, Lizhong; Liu, Feng Q.; Neo, Siew; Tsai, Stan; Chen, Liang-Yuh, Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP.
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  31. Shendon Norman ; Sherwood Michael ; Lee Harry, Fluid-pressure regulated wafer polishing head.
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  53. Cook, Lee Melbourne; James, David B.; Roberts, John V. H., Polishing pad for electrochemical mechanical polishing.
  54. Chopra, Dinesh, Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies.
  55. Fawcett, Clyde A.; Crkvenac, T. Todd; Prygon, Kenneth A.; Foster, Bernard, Porous polyurethane polishing pads.
  56. Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q. ; Somekh Sasson ; Tolles Robert D., Radially oscillating carousel processing system for chemical mechanical polishing.
  57. Arai Hatsuyuki,JPX ; Wang Xu Jin,JPX, Surface polishing pad.
  58. Meikle Scott ; Schultz Laurence D., Under-pad for chemical-mechanical planarization of semiconductor wafers.
  59. Tobin Jim, Wafer transfer station for a chemical mechanical polisher.

이 특허를 인용한 특허 (1)

  1. Barthelmes, Juergen; Ruether, Robert; Kurtz, Olaf; Danker, Michael, Ni-P layer system and process for its preparation.
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