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Multiple chip module cooling system and method of operation thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0834137 (2010-07-12)
등록번호 US8018718 (2011-08-30)
발명자 / 주소
  • Goth, Gary F.
  • Kearney, Daniel J.
  • Lucas, Paul M.
  • Porter, Donald W.
출원인 / 주소
  • International Business Machines Corporation
대리인 / 주소
    Cantor Colburn LLP
인용정보 피인용 횟수 : 30  인용 특허 : 7

초록

Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said secon

대표청구항

What is claimed is: 1. A cooling system for a computer having a first processor and a second processor, the system comprising:a first cooling loop thermally coupled to said first processor, said first cooling loop having a first expansion valve fluidly coupled with a first compressor and a first tem

이 특허에 인용된 특허 (7)

  1. Bettridge,James M.; Ford,Thomas K.; Turek,James R., Cabinet for computer devices with air distribution device.
  2. Goth Gary F. ; Loparco John J., Center feed parallel flow cold plate dual refrigeration systems.
  3. Novotny,Shlomo, Cooling failure mitigation for an electronics enclosure.
  4. Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cooling system with auxiliary thermal buffer unit for cooling an electronics module.
  5. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
  6. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  7. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.

이 특허를 인용한 특허 (30)

  1. Lu, Qiao, Aircraft galley refrigeration system with multi-circuit heat exchanger.
  2. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s).
  3. Barringer, Wayne A.; Graybill, David P.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Steffes, James J.; Weber, Jr., Gerard V., Apparatus for adjusting coolant flow resistance through liquid-cooled electronics racks.
  4. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration apparatus and method with controlled coolant heat load.
  6. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling.
  7. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  8. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks.
  10. Kearney, Daniel J.; Levesque, Rejean P.; Muller, K. Paul; Vogel, Andrew H.; Yashchin, Emmanuel, Cooling system control and servicing based on time-based variation of an operational variable.
  11. Kearney, Daniel J.; Levesque, Rejean P.; Muller, K. Paul; Vogel, Andrew H.; Yashchin, Emmanuel, Cooling system control and servicing based on time-based variation of an operational variable.
  12. Chainer, Timothy J.; Coico, Patrick A.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Directly connected heat exchanger tube section and coolant-cooled structure.
  13. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  14. Chainer, Timothy J.; David, Milnes P.; Iyengar, Madhusudan K.; Parida, Pritish R.; Schmidt, Roger R.; Schultz, Mark D., Dynamically limiting energy consumed by cooling apparatus.
  15. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  16. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  17. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader.
  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Heat exchange assembly with integrated heater.
  19. Goth, Gary F.; Kostenko, William P.; Mullady, Robert K.; Vandeventer, Allan C., Multimodal cooling apparatus for an electronic system.
  20. Johnson, Scott T., Multiple liquid loop cooling for electronics.
  21. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Pressure control unit and method facilitating single-phase heat transfer in a cooling system.
  22. Shelnutt, Austin; Bailey, Edmond; Mills, Richard, System and method for cooling information handling resources.
  23. Shelnutt, Austin; Bailey, Edmond; Mills, Richard, System and method for cooling information handling resources.
  24. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., System and method for facilitating parallel cooling of liquid-cooled electronics racks.
  25. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  26. Chainer, Timothy J.; Graybill, David P.; Iyengar, Madhusudan K.; Kamath, Vinod; Kochuparambil, Bejoy J.; Schmidt, Roger R.; Steinke, Mark E., Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system.
  27. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, refrigeration cooling of an electronic component.
  28. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component.
  29. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration method facilitating cooling of an electronic component.
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Vapor-compression refrigeration apparatus with backup air-cooled heat sink and auxiliary refrigerant heater.
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