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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Radio frequency wave reducing material and methods for manufacturing same

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B32B-003/06   
미국특허분류(USC) 428/099; 428/192
출원번호 US-0267957 (2005-11-04)
등록번호 US8029881 (2011-09-19)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Haynes and Boone LLP
인용정보 피인용 횟수 : 2  인용 특허 : 98
초록
▼

An improved radio frequency wave attenuating wall (ceiling or floor) or door material comprises a laminated structure having as an integral part thereof one or more layers of a viscoelastic material which also functions as a glue and one or more electrically conducting layers. An electrically conducting material such as tape or a formed metal channel provides an electrical connection between the electrically conducting material and an exposed outer surface of the laminated structure. In one embodiment the electrically conducting material is paint. In one...

대표
청구항
▼

What is claimed is: 1. A laminated structure used for constructing RF attenuating walls, floors, or ceilings comprising:two external layers of a material;at least one internal electrically conductive constraining layer;two or more internal layers of a viscoelastic glue separated by said at least one internal electrically conductive constraining layer; andan electrically conductive tape in electrical contact with said electrically conductive constraining layer and extending out from at least one edge of said structure, said electrically conductive tape be...

이 특허에 인용된 특허 (98)

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이 특허를 인용한 특허 피인용횟수: 2

  1. Tinianov, Brandon D.; Surace, Kevin J.. Acoustical sound proofing material with improved fire resistance and methods for manufacturing same. USP2013038397864.
  2. Blades, Michael N.; Watt, John M.; Yakowenko, John E.; Broud, Todd D.; O'Leary, Keith R.; Cusa, Stephen A.; Quiros, Mauricio; Randall, Brian G.; Weir, Richard P.. Sound damping wallboard and method of forming a sound damping wallboard. USP2018039909304.

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