$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Microelectronic contact structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/00
출원번호 US-0577444 (2009-10-12)
등록번호 US8033838 (2011-09-27)
발명자 / 주소
  • Eldridge, Benjamin N.
  • Grube, Gary W.
  • Khandros, Igor Y.
  • Mathieu, Gaetan L.
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Kirton & McConkie
인용정보 피인용 횟수 : 14  인용 특허 : 674

초록

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact

대표청구항

What is claimed is: 1. A microelectronic spring contact element, comprising:an elongate member having a base portion, a contact portion opposite the base portion, and a central body portion connected at one end to the base portion and at an opposite end to the contact potion, wherein a width of the

이 특허에 인용된 특허 (674)

  1. Derryberry Lesli A. (Dallas TX) Williams Charles E. (Dallas TX), A chip carrier and mounting structure connected to the chip carrier.
  2. Lin Tsen-Hwang (Dallas TX), Accelerometer.
  3. Reimann Hans (Sunnyvale CA), Accelerometer chip.
  4. Abraham Bruce C. (Limekiln PA) Fegley Charles R. (Laureldale PA), Adapting contacts for connection thereto.
  5. Bradley Robert F. (New Buffalo MI), Adhesive component means for attaching electrical components to conductors.
  6. Adamopoulos Eleftherios (Bronx NY) Kim Jungihl (Seoul NY KRX) Lee Kang-Wook (Yorktown Heights NY) Oh Tae S. (Cheongryang NY KRX) O\Toole Terrence R. (Hopewell Junction NY) Purushothaman Sampath (York, Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier.
  7. Eklund ; Sr. Ralph H. (1111 Morse Ave. ; No. 235 Sunnyvale CA 94086), Adjustable holder assembly for positioning a vacuum chuck.
  8. Bower Robert W. (Davis CA) Ismail Mohd S. (West Sacramento CA), Aligned wafer bonding.
  9. Cipolla Thomas M. (Hopewell Junction NY) Horton Raymond R. (Dover Plains NY) Murphy Philip (New Fairfield CT) Palmer Michael J. (Walden NY), Alignment device.
  10. Sickafus Edward N. (Grosse Ile MI), Analog display device with micro-motor drive means.
  11. Cooper,Timothy E.; Eldridge,Benjamin N.; Reynolds,Carl V.; Shenoy,Ravindra Vaman, Apparatus and method for limiting over travel in a probe card assembly.
  12. Kobayashi Mituo (Aioi JPX) Usuda Osamu (Tatsuno JPX) Sano Yoshihiko (Hyogo JPX) Atsumi Koichiro (Yokohama JPX), Apparatus and method for manufacturing semiconductor device.
  13. Lightbody James D. (32600 Fairmount Blvd. Pepper Pike OH 44124) Lightbody William S. (32600 Fairmount Blvd. Pepper Pike OH 44124), Apparatus and method for testing circuit boards.
  14. Interrante Mario J. (New Paltz NY) Berger Michael (Gardiner NY) Handford Edward F. (Wurtsboro NY) Tas Eugene (Stanfordville NY), Apparatus and methods for making simultaneous electrical connections.
  15. Doemens Guenter (Holzkirchen DEX) Rose Thomas (Munich DEX), Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards.
  16. Goto Kaoru (Tokyo JPX), Apparatus for inspecting internal circuit of semiconductor device.
  17. Shibata Junichirou (Urawa JPX), Apparatus for testing IC elements.
  18. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.
  19. Bonelli Riccardo (Hamburg DEX) Plohn Gunter (Bad Schwartau DEX), Apparatus for testing of integrated circuits.
  20. Kasukabe Susumu (Yokohama JPX) Ookubo Masasi (Yokohama JPX) Akiba Yutaka (Fujisawa JPX) Tanaka Minoru (Yokohama JPX) Yokono Hitoshi (Toride JPX), Apparatus for testing semiconductor device.
  21. Benedetto William E. (Succasunna NJ) Moran Joseph M. (Berkeley Heights NJ), Apparatus having a buckling beam probe assembly.
  22. Grabbe Dimitry G. (Middletown PA), Area array connector.
  23. Lychyk George S. (River Forest IL) Neese Wayne E. (Hoffman Estates IL), Arrangement for mounting dual-in-line packaged integrated circuits to thick/thin film circuits.
  24. Arnio Barbara E. (Middletown CT) Burdick Lynn E. (Hampton CT) Owens Mark J. (Vernon CT) St. Lawrence Mike (Thompson CT) Simpson Scott S. (Woodstock CT), Array connector.
  25. Johnson Randall E. (Carrollton TX) Drumm James M. (Dallas TX), Assembly of semiconductor chips.
  26. Kuroda Ryo (Machida JPX) Miyazaki Toshihiko (Hiratsuka JPX) Sakai Kunihiro (Isehara JPX) Takimoto Kiyoshi (Isehara JPX), Atomic force microscope with a plurality of cantilevers for recording/reproducing information.
  27. Mulholland Wayne A. (Plano TX) Quinn Daniel J. (Carrollton TX) Bond Robert H. (Carrollton TX) Olla Michael A. (Flower Mound TX), Automatic assembly of integrated circuits.
  28. Black Thomas J. (38 Maureen Dr. Smithfield RI 02917), Automatic test system.
  29. Char Kookrin (Palo Alto CA) Geballe Theodore H. (Woodside CA) Moeckly Brian H. (Palo Alto CA), Barrier layers for oxide superconductor devices and circuits.
  30. Petlock ; Jr. William (819 N. Concord St. Santa Ana CA 92701), Bellows-type electrical test contact.
  31. Westphal Glenn H. ; Wadsworth Mark V., Bolometer array spectrometer.
  32. Chang Li-Hsin (Chandler AZ), Bonding pad with circular exposed area and method thereof.
  33. Hill William H. (Rancho Santa Fe CA), Bonding tool and clamp assembly and wire handling method.
  34. Aoki Tsutomu (Tokyo JPX), Bump forming method.
  35. Overman David L. (Silver Spring MD) Granfors Roland A. (Gaithersburg MD), Cantilever beam G-switch.
  36. Toda Akitoshi (Tokyo JPX) Matsuyama Katsuhiro (Tokyo JPX), Cantilever chip for scanning probe microscope.
  37. Yasue Takao (Itami JPX) Nishioka Tadashi (Itami JPX), Cantilever for atomic force microscope and method of manufacturing the cantilever.
  38. Lee Seung S. (Richmond CA) White Richard M. (Berkeley CA) Pisano Albert P. (Berkeley CA), Cantilever pressure transducer.
  39. Tomura Yoshihiro (Hirakata JPX) Bessho Yoshihiro (Higashiosaka JPX), Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary.
  40. Fisher ; Jr. John R. (Plainsboro NJ), Cast solder leads for leadless semiconductor circuits.
  41. Trabucco Robert T. (Los Altos CA), Casting of raised bump contacts on a substrate.
  42. Morris James B. (Bloomington MN), Ceramic IC package attachment apparatus.
  43. Grabbe Dimitry G. (Lisbon Falls ME), Ceramic chip carrier with lead frame having removable rim.
  44. Grassauer Willie K. (Mapleton OR), Chip carrier alignment device and alignment method.
  45. Allen Leslie J. (Swindon CA GB2) Cherian Gabe (Fremont CA) Diaz Stephen H. (Los Altos CA), Chip carrier mounting device.
  46. Beene Gary L. (Allen TX) Petrovich Thomas D. (Richardson TX) Williams Charles E. (Dallas TX), Chip carrier with interconnects on lid.
  47. Allen Leslie J. (Swindon CA GB2) Cherian Gabe (Fremont CA) Diaz Stephen H. (Los Altos CA), Chip mounting device.
  48. Derryberry Lesli A. (Dallas TX) Williams Charles E. (Dallas TX), Circuit board with a chip carrier and mounting structure connected to the chip carrier.
  49. Carey David H. (Austin TX) Whalen Barry H. (Austin TX), Compact adapter package providing peripheral to area translation for an integrated circuit chip.
  50. Murphy Patrick K. (Spring TX), Compact, wireless apparatus for electrically testing printed circuit boards.
  51. Ohkubo Masao (Tokyo JPX) Yoshimitsu Yasuro (Tokyo JPX), Complex probe card for testing a semiconductor wafer.
  52. Pai Deepak K. (Burnsville MN) Julik Michael J. (Burnsville MN) Fluhrer Robert W. (Burnsville MN), Compliant S-leads for chip carriers.
  53. Kwon Oh-Kyong (Richardson TX) Malhi Satwinder (Garland TX) Hashimoto Masahi (Garland TX), Compliant contact pad.
  54. Grabbe Dimitry G. (Middletown PA), Compliant interconnection and method therefor.
  55. Sobota ; Jr. Stephen M. (Mainland PA), Compliant lead clip.
  56. Missele Carl (Elgin IL), Compliant solder interconnection.
  57. DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA), Compliant thermal connectors and assemblies incorporating the same.
  58. Wasserman Norman (Columbus OH), Component mounting apparatus.
  59. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.
  60. Ohno Yasuhide (Kawasaki JPX) Ohzeki Yoshio (Kawasaki JPX), Composite lead frame and semiconductor device using the same.
  61. Grube,Gary W.; Khandros,Igor Y.; Mathieu,Gaetan L., Composite microelectronic spring structure and method for making same.
  62. Patraw Nils E. (Redondo Beach CA), Compressive pedestal for microminiature connections.
  63. Patraw Nils E. (Redondo Beach CA), Compressive pedestal for microminiature connections.
  64. Legal Dennis Andrew, Configurable probe card for automatic test equipment.
  65. Iinuma Yoshio (Tokorozawa JPX), Connecting structure for a display device.
  66. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.
  67. Noro Takanobu (Yokohama JPX) Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Kanda Naoya (Yokohama JPX) Sakaguchi Suguru (Yokohama JPX) Murata Akira (Tokyo JPX), Connecting structure of electronic part and electronic device using the structure.
  68. Svendsen ; Leo G. (Redwood City CA) Leary Rebecca A. (Milpitas CA) Geschwind Gary I. (Palo Alto CA), Connection to a component for use in an electronics assembly.
  69. Boegh-Petersen Allan (Flongvaenget 14 Hedehusene DK-2640 DKX), Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circu.
  70. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Kim Jungihl (Chappaqua NY) Mayr Wolfgang (Poughkeepsie NY) Shaw Jane M. (Ridgefield CT) Walker George F. (New York NY), Connector assembly for chip testing.
  71. Anhalt John W. (Orange CA) Goodman David S. (Mission Viejo CA) Selvin Gerald J. (Huntington Beach CA), Connector assembly for making multiple connections in a thin space.
  72. Grabbe Dimitry G. (Middletown PA), Connector contact.
  73. Reid Gilbert R. (Norristown PA), Connector for pin type integrated circuit packages.
  74. Patraw Nils E. (Redondo Beach CA), Connector system for coupling to an integrated circuit chip.
  75. Morlion Danny L. C. (Ghent BEX) Schoss Udo H. (Hattingten DEX), Contact assembly with grounding conductor support.
  76. Bohlen Harald (Boeblingen DEX) Kas Gerhard (Moetzingen DEX) Greschner Johann (Pliezhausen DEX) Keyser Joachim H. (Wildberg DEX) Klcke Werner (Boeblingen DEX), Contact device for releasably connecting electrical components.
  77. Reichart Manfred,DEX ; Braun Gerhard,DEX, Contact element support in particular for a thin smart card connector.
  78. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact for an electrical contactor assembly.
  79. Krger Gustave (Herrenberg DEX), Contact for multicontact probe assembly.
  80. Shino Katsuhide (Kyoto JPX), Contact pin.
  81. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact probe assembly having rotatable contacting probe elements.
  82. Reichardt Manfred (Weinsberg DEX) Bleier Robert (Untergruppenbach DEX), Contact spring, set of contact springs and chipcard reader using said contact springs.
  83. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Alec Madsen ; Gaetan L. Mathieu, Contact structures with blades having a wiping motion.
  84. Buechele Alvin W. (Lagrangeville NY) Cochran Thomas J. (Lagrangeville NY) Hodge Philo B. (Roxbury CT), Contactor and probe assembly for electrical test apparatus.
  85. Krger Gustav (Herrenberg DEX) Hinnerwisch Sven (Nufringen DEX), Contactor for an electronic tester.
  86. Lao Binneg Y. (Rancho Palos Verdes CA) Rowe David A. (Redondo Beach CA), Coplanar and stripline probe card apparatus.
  87. Matta Farid (Mountain View CA) Douglas Kevin C. (San Mateo CA), Demountable tape-automated bonding system.
  88. Scheingold William Samuel (Palmyra PA) Purdy Harold Lawrence (Hummelstown PA) Youngfleish Frank Christian (Harrisburg PA), Device for connecting leadless integrated circuit package to a printed circuit board.
  89. Greive Martin (Heidelberg DEX) Ruf Bernd (Weiterstadt DEX), Device for facilitating sheet separation or singling.
  90. Herandez Jorge M. (1920 E. Jarvis Mesa AZ 85202) Simpson Scott S. (Senexet Rd. Woodstock CT 06281) Hyslop Michael S. (4147 W. Victoria La. Chandler AZ 85226), Device for interconnecting integrated circuit packages to circuit boards.
  91. Duerig Urs T. (Ruschlikon CHX) Gimzewski James K. (Zurich CHX) Pohl Wolfgang D. (Adliswil CHX), Direct access storage unit using tunneling current techniques.
  92. Landis Richard C. (Shelton CT), Direct interconnection for use between a semiconductor and a pin connector or the like.
  93. Wood Alan G. (Boise ID) Corbett Tim J. (Boise ID) Chadwick Gary L. (Boise ID) Huang Chender (Boise ID) Kinsman Larry D. (Boise ID), Discrete die burn-in for non-packaged die.
  94. Corbett Tim J. (Boise ID) Wood Alan G. (Boise ID), Discrete die burn-in for nonpackaged die.
  95. Ikeda Tsutomu (Hachiohji JPX) Yamamoto Keisuke (Yamato JPX) Nakayama Masaru (Atsugi JPX) Yagi Takayuki (Machida JPX) Kawada Haruki (Yokohama JPX), Displacement element, cantilever probe and information processing apparatus using cantilever probe.
  96. Aton Thomas J. (Dallas TX) Rincon Rey M. (Dallas TX), Disposable high performance test head.
  97. Crowley Richard N. (Aloha OR), Driven guard probe card.
  98. Mastrangelo Carlos H. (Ann Arbor MI), Dry-release method for sacrificial layer microstructure fabrication.
  99. Collins David R. (Eau Claire WI) Nebel Mary A. (Chippewa Falls WI) Strangfeld Bruce A. (Eau Claire WI), Dual contact beam assembly for an IC test fixture.
  100. Baumberger John G. (Johnson City NY) Kershaw James J. (Endwell NY) Petrozello James R. (Endicott NY), Dual element electrical contact and connector assembly utilizing same.
  101. Whitney Julie G., Duplicative detector sensor.
  102. Wei I-Yuan (Hershey PA) Miller John R. (Harrisburg PA), Durable plating for electrical contact terminals.
  103. Beaman Brian S. (Hyde Park NY), Elastomeric area array interposer.
  104. Hsia Liang-Choo (Mastic Beach NY) McAndrew Thomas P. (Macungie PA) Stuebner Fred E. (La Grangeville NY), Elastomeric connectors for electronic packaging and testing.
  105. Watanabe Yutaka (Hadano JPX) Kobayashi Fumiyuki (Sagamihara JPX) Sekibata Masao (Kunitachi JPX) Kuroda Shigeo (Ome JPX) Yasukawa Akio (Ibaraki JPX) Sekine Shigejiro (Hadano JPX), Electric component part having lead terminals.
  106. Zifcak Mark S. (Putnam CT) Kosa Bruce G. (Woodstock CT), Electrical circuit board interconnect.
  107. Roespel Gustav (Unterhaching DEX) Scheffler Horst (Munich DEX), Electrical coil and method of producing the same.
  108. Volz Keith L. (Jamestown NC) Deak Frederick R. (Kernersville NC) Renn Robert M. (Pfafftown NC) Johnson David C. (Winston Salem NC) Irlbeck Robert D. (Greensboro NC), Electrical connections between printed circuit boards and integrated circuits surface mounted thereon.
  109. Feigenbaum Haim (Irvine CA) Crumly William R. (Anaheim CA) Schreiber Christopher M. (Newport Beach CA), Electrical connections with shaped contacts.
  110. Lamp Richard W. (Mendham NJ), Electrical connector employing conductive rectilinear elements.
  111. Shah Arun J. (Hanover Park IL) McClung David W. (Bridgeview IL) Hopfer Albert N. (Park Ridge IL) Linderman Richard J. (Wood Dale IL) Zafar Saeed (Park Ridge IL), Electrical connectors and IC chip tester embodying same.
  112. Tsuda Toshio (Habikino JPX) Horio Yasuhiko (Osaka JPX) Bessho Yoshihiro (Kadoma JPX) Ishida Toru (Hirakata JPX), Electrical contact bump and a package provided with the same.
  113. Rozmus John J. (1030 Derwydd Lane Berwyn PA 19312), Electrical contacts.
  114. DiFrancesco Louis (Hayward CA), Electrical interconnect using particle enhanced joining of metal surfaces.
  115. Difrancesco Louis (Hayward CA), Electrical interconnect using particle enhanced joining of metal surfaces.
  116. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
  117. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA), Electrical socket.
  118. Yamamoto, Susumu; Sato, Kazuyoshi, Electrically conductive composite material.
  119. Angelopoulos Marie (Briarcliff Manor) Huang Wu-Song (Poughkeepsie) Kaplan Richard D. (Wappingers Falls NY) Le Corre Marie-Annick (St. Fargeau Ponthierry FRX) Perreault Stanley E. (Wappingers Falls NY, Electrically conductive polymeric.
  120. Angelopoulos Marie (Briarcliff Manor) Huang Wu-Song (Poughkeepsie) Kaplan Richard D. (Wappingers Falls NY) Le Corre Marie-Annick (St Fargeau Ponthierry FRX) Perreault Stanley E. (Wappingers Falls NY), Electrically conductive polymeric materials and uses thereof.
  121. Angelopoulos Marie (Briarcliff Manor) Huang Wu-Song (Poughkeepsie) Kaplan Richard D. (Wappingers Falls NY) Le Corre Marie-Annick (St Fargeau Ponthierry FRX) Perreault Stanley E. (Wappingers Falls NY), Electrically conductive polymeric materials and uses thereof.
  122. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Electrically isolated released microstructures.
  123. Tayebati Parviz, Electrically tunable optical filter utilizing a deformable multi-layer mirror.
  124. Worley Eugene R. (Irvine CA), Electro-micro-mechanical shutters on transparent substrates.
  125. Ono Tadaaki (Hyogo JPX), Electrode structure of a semiconductor device which uses a copper wire as a bonding wire.
  126. Ho Chih-Ming (Rancho Palos Verdes CA) Miu Denny K. (Valencia CA) Leu Jeremy Tzong-Shyng (Plainsboro NJ) Miller Raanan (Pasadena CA) Desai Amish (Pasadena CA) Liu Chang (Pasadena CA) Tsao Tom (Pasaden, Electromagnetically actuated micromachined flap.
  127. Schroeder Jon M. (Apt. 1013 ; 9815 Copper Creek Austin TX 78729), Electronic circuit chip connection assembly and method.
  128. Niinou Koichi (Kyoto JPX), Electronic circuit component and mounting method therefor.
  129. Spinelli Thomas S. (Attleboro MA) Manns William G. (Dallas TX) Weirauch Donald F. (Dallas TX), Electronic circuit interconnection system.
  130. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
  131. Spinelli, Thomas S.; Manns, William G.; Weirauch, Donald F., Electronic circuit interconnection system.
  132. Morse Robert Spitler (La Mesa CA), Electronic circuit package and method of brazing.
  133. Takamatsu Toshiaki (Tenri JPX) Funada Fumiaki (Yamatokoriyama JPX) Yasuda Shuhei (Nara JPX) Matsuura Masataka (Tenri JPX), Electronic component with plurality of terminals thereon.
  134. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY), Electronic package assembly method.
  135. Prinz Fritz B. (5801 Northumberland St. Pittsburgh PA 15217) Weiss Lee E. (6558 Darlington Rd. Pittsburgh PA 15217) Siewiorek Daniel P. (1259 Bellerock St. Pittsburgh PA 15217), Electronic packages and smart structures formed by thermal spray deposition.
  136. Masaaki Hayama JP; Noboru Mohri JP; Keiichi Nakao JP, Electronic part fabricated by intaglio printing and a method for fabricating the same.
  137. Hosokawa Takashi (Hitachi JPX) Inoue Hirokazu (Ibaraki JPX) Sawahata Mamoru (Hitachi JPX) Fukuoka Masaki (Hitachi JPX), Electronic parts loaded module including thermal stress absorbing projecting electrodes.
  138. Damon Neil F. (Ft. Pierce FL) Rydwansky ; Jr. Frank C. (Quincy MA), Electronic socket having spring probe contacts.
  139. Noyori Masaharu (Neyagawa JPX) Fujimoto Hiroaki (Neyagawa JPX), Electronics circuit device and method of making the same.
  140. Fillion Raymond A. (Niskayuna NY) Woinarowski Robert J. (Ballston Lake NY) Gdula Michael (Knox NY) Cole Herbert S. (Burnt Hills NY) Wildi Eric J. (Niskayuna NY) Daum Wolfgang (Schenectady NY), Embedded substrate for integrated circuit modules.
  141. Doo Ven Y. (San Jose CA), Epitaxially extended polycrystalline structures utilizing a predeposit of amorphous silicon with subsequent annealing.
  142. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
  143. Trabucco Robert T. (Los Altos CA), Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device pa.
  144. Elarde Vito D. (6429 Lance Ct. San Diego CA 92120), Fabrication of a printed circuit board with metal-filled channels.
  145. Minetti Richard H. (Allentown PA), Fabrication of circuit packages using solid phase solder bonding.
  146. Freyman Bruce J. (Sunrise FL) Miles Barry M. (Plantation FL) Flaugher Jill L. (Margate FL), Fabrication of pad array carriers from a universal interconnect structure.
  147. Jones Gary W. (Raleigh NC), Field emission device comprising dielectric overlayer.
  148. Greschner Johann,DEX ; Pleshko Peter ; Schmid Gerhard,DEX, Field emission device with series resistor tip and method of manufacturing.
  149. Grabbe Dimitry G. (Middletown PA), Field emitter array integrated circuit chip interconnection.
  150. Jones Gary W. (Raleigh NC), Field emitter structure and method of making the same.
  151. Takekawa Kouichi (Tokyo JPX) Urushima Michitaka (Tokyo JPX), Film carrier semiconductor device.
  152. Caddock ; Jr. Richard E. (Winchester OR), Film-type heat sink-mounted power resistor combination having only a thin encapsulant, and having an enlarged internal h.
  153. Shea Paul Y. (Irvine CA), Fine line flexible cable fabrication process.
  154. Hasegawa Yoshiei (7-9 ; Wakamatsu 6-chome Sagamihara-shi ; Kanagawa-ken JPX), Fixed probe board.
  155. Stierman Roger J. (Richardson Garland TX) Lessard Robert J. (Garland TX), Fixture and a method for plating contact bumps for integrated circuits.
  156. Stierman Roger J. (Richardson TX) Lessard Robert J. (Garland TX), Fixture and a method for plating contact bumps for integrated circuits.
  157. Stierman Roger J. (Richardson TX) McCauley Archie N. (Little Elm TX) Zart Robert C. (Dallas TX), Fixture for plating tall contact bumps on integrated circuit.
  158. Stierman Roger J. (Richardson TX) McCauley Archie N. (Little Elm TX) Zart Robert C. (Dallas TX), Fixture for plating tall contact bumps on integrated circuit.
  159. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Dudek Thomas J. (Poughkeepsie NY) Lanzetta Alphonso P. (Marlboro NY) Shih Da-Yuan (Poughkeepsie NY) Tkazyik William J. (Hyde Park NY) Walker , Flex circuit card elastomeric cable connector assembly.
  160. Mendenhall David W. (Greenville RI) Goff Jay T. (Cranston RI), Flex dot wafer probe.
  161. Steitz Richard R. (Chippewa Falls WI) August Melvin C. (Chippewa Falls WI) Christie Diane M. (Eau Claire WI) Dowdle Deanna M. (Northfield MN) Dudley Dean B. (Prior Lake MN) Nelson Stephen E. (Chippew, Flexible automated bonding method and apparatus.
  162. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
  163. Canestaro Michael J. (Endicott NY) Summa William J. (Endwell NY), Flexible electrical connection and method of making same.
  164. Freyman Bruce J. (Sunrise FL) Miles Barry M. (Plantation FL) Flaugher Jill L. (Margate FL), Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate.
  165. Clementi Robert J. (Binghamton NY) Gazdik Charles E. (Endicott NY) Lafer William (Chenango Bridge NY) Lovesky Roy L. (Vestal NY) McBride Donald G. (Binghamton NY) Munson Joel V. (Port Crane NY) Skarv, Flexible film semiconductor chip carrier.
  166. McLellan Neil R. (Garland TX), Flexible film semiconductor package.
  167. Smith John W. ; Haba Belgacem, Flexible lead structures and methods of making same.
  168. Olson William L. (Lindenhurst IL) Currier David W. (Algonquin IL) Klosowiak Tomasz L. (Glenview IL) Fulcher Mark (Hanover Park IL), Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape.
  169. Carey David H. (Austin TX), Flip substrate for chip mount.
  170. Baumberger John G. (Johnson City NY) Petrozello James R. (Endicott NY), Fluid pressure actuated connector.
  171. Bergstrom John S. (Williamsburg VA) Sulouff ; Jr. Robert E. (Williamsburg VA), Folded cantilever beam accelerometer.
  172. Guckel Henry (Madison WI) Christenson Todd R. (Madison WI) Skrobis Kenneth (Madison WI), Formation of microstructures using a preformed photoresist sheet.
  173. Guckel Henry (Madison WI) Christenson Todd R. (Madison WI) Skrobis Kenneth (Madison WI), Formation of microstructures using a preformed photoresist sheet.
  174. Gazdik Charles E. (Endicott NY) McBride Donald G. (Binghamton NY) Seraphim Donald P. (Vestal NY) Toole Patrick A. (Westport CT), Full panel electronic packaging structure.
  175. Kwon Oh-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX) Born Eng C. (Richardson TX), Full wafer integrated circuit testing device.
  176. Allen Mark G. ; Ahn Chong-Hyuk, Fully integrated magnetic micromotors and methods for their fabrication.
  177. Allen Mark G. ; Ahn Chong-Hyuk, Fully integrated magnetic micromotors and methods for their fabrication.
  178. Freyman Bruce J. (Sunrise FL) Miles Barry M. (Plantation FL) Juskey Frank J. (Coral Springs FL), Grounding an ultra high density pad array chip carrier.
  179. Bostock Peter A. (Atherton CA) Haygood David K. (Cupertino CA) Nicholson Kenneth R. (Cupertino CA) Nordling J. Michael (Santa Clara CA) Soni Pravin L. (Union City CA), Heat recoverable soldering device.
  180. Lindsey, Scott E.; Miller, Charles A.; Royster, David M.; Wenzel, Stuart W., Helical microelectronic contact and method for fabricating same.
  181. Hemler Paul F. (Arnold MD) Rohr William A. (Buffalo NY), Hermetic chip carrier compliant soldering pads.
  182. Braun Robert E. (Norristown PA), Hermetic integrated circuit package for high density high power applications.
  183. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yaun, High density cantilevered probe for electronic devices.
  184. Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.
  185. Grabbe Dimitry G. (Middletown PA), High density electrical connector system.
  186. Cragon Harvey (Austin TX) Hutchins Charles L. (Sugar Land TX), High density integrated circuit package.
  187. Wojnarowski Robert J. (Ballston Lake NY) Eichelberger Charles W. (Schenectady NY) Kornrumpf William P. (Albany NY), High density interconnect structure including a chamber.
  188. Cole ; Jr. Herbert S. (Burnt Hills NY) Rose James W. (Guilderland NY), High density interconnect structure including a spacer structure and a gap.
  189. Chatterjee Pallab K. (Dallas TX), High density micropackage for IC chips.
  190. Babuka, Robert; Piechota, John L.; Poch, Leonard J., High density planar interconnected integrated circuit package.
  191. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.
  192. Whann Welton B. (San Diego CA) Elizondo Paul M. (Escondido CA), High density probe card.
  193. Whann Welton B. (San Diego CA) Elizondo Paul M. (Escondido CA), High density probe card.
  194. Subramanian Eswar (Phoenix AZ), High density probe card for testing electrical circuits.
  195. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.
  196. Ainslie Norman G. (Croton-on-Hudson NY) Krzanowski James E. (Watertown MA) Palmateer Paul H. (Wappingers Falls NY), High melting point process for Au:Sn:80:20 brazing alloy for chip carriers.
  197. Jacobs Scott L. (Chester VA) Nihal Perwaiz (Hopewell Junction NY) Ozmat Burhan (Peekskill NY) Schnurmann Henri D. (Monsey NY), High performance integrated circuit packaging structure.
  198. Barbour Donald R. (Poughkeepsie NY) Lemke Guido A. (Hopewell Junction NY) Magdo Steven (Hopewell Junction NY), High performance semiconductor package assembly.
  199. Kwon On-Kyong (Plano TX) Hashimoto Masashi (Garland TX) Malhi Satwinder (Garland TX), High performance test head and method of making.
  200. Bratschun William R. (LaGrange IL), Hybrid circuit connector assembly.
  201. Yamamoto, Toshio, Hybrid integrated circuit device.
  202. Huff Bernard G. (Mission Hills KS), Hydraulic stunner apparatus.
  203. Takahashi Osamu (Sendai JPX) Yoshida Kazuo (Sendai JPX), IC test instrument.
  204. Kledzik Kenneth J. (Boise ID), Inherently impedance matched multiple integrated circuit module.
  205. Oki Shinichi (Osaka JPX) Nagao Koichi (Osaka JPX) Nakata Yoshiro (Kyoto JPX), Inspecting method for semiconductor devices.
  206. Marcantonio Gabriel (Nepean CAX), Integrated circuit chip package.
  207. Tai King L. (Berkeley Heights NJ), Integrated circuit chip-and-substrate assembly.
  208. Ciccio Joseph A. (Winchester MA) Thun Rudolf E. (Carlisle MA) Fardy Harry J. (Chelmsford MA), Integrated circuit device package interconnect means.
  209. Variot Patrick (San Jose CA) Chia Chok J. (Campbell CA) Trabucco Robert T. (Los Altos CA), Integrated circuit having a coplanar solder ball contact array.
  210. Mallik Debendra (Chandler AZ) Bhattacharyya Bidyut K. (Chandler AZ), Integrated circuit having a two-dimensional lead grid array.
  211. Fritz Galen F. (Plano TX), Integrated circuit interconnect leads releasably mounted on film.
  212. Adams Anthony L. (McKinney TX), Integrated circuit package having interconnected leads adjacent the package ends.
  213. Smith Kenneth R. (Aloha OR), Integrated circuit package, and method of forming an integrated circuit package.
  214. Schwartz Rodney E. (Tempe AZ) Wirick Glenn M. (Phoenix AZ) Rogers Gary B. (Mesa AZ), Integrated circuit probe card inspection system.
  215. Rios Juan P. (Austin TX), Integrated circuit test socket.
  216. Ghezzo Mario (Ballston Lake NY) Yakymyshyn Christopher P. (Raleigh NC) Saia Richard J. (Schenectady NY) Polla Dennis L. (Raleigh NC), Integrated microelectromechanical polymeric photonic switch.
  217. Ghezzo Mario (Ballston Lake NY) Yakymyshyn Christopher P. (Raleigh NC) Duggal Anil R. (Schenectady NY), Integrated microelectromechanical polymeric photonic switching arrays.
  218. Robillard David R. (Westboro MA) Michaels Robert L. (Marlboro MA), Integrated test and assembly device.
  219. Robillard David R. (Westboro MA) Michals Robert L. (Marlboro MA), Integrated test and assembly device.
  220. Bajorek Christopher H. (Los Gatos CA) Fontana Robert E. (San Jose CA) Snyder Clint D. (Monte Sereno CA) Thompson David A. (San Jose CA) Williams Mason L. (San Jose CA) Yeack-Scranton Celia E. (San Jo, Integrated transducer-suspension assembly for vertical recording.
  221. Bartlett James L. ; Chang Mau Chung F. ; Higgins J. Aiden ; Marcy ; 5th Henry O. ; Mehrotra Deepak ; Pedrotti Kenneth D. ; Pehlke David R. ; Seabury Charles W. ; Tham J. L. Julian ; Yao Jun J., Integrated variable gain power amplifier and method.
  222. Chang Cheng-Cheng (Palo Alto CA), Interconnect structure for integrated circuits.
  223. Chakravorty Kishore K. (Issaquah WA) Tanielian Minas H. (Bellevue WA), Interconnect structures having tantalum/tantalum oxide layers.
  224. Walter Jackie A. (Sunnyvale CA), Interconnect tape for use in tape automated bonding.
  225. Davis Daniel A. (Canton MI) Henritzy Charles L. (Grosse Pointe Farms MI), Interconnection construction to thick film substrate.
  226. Polonio John D. (20965 SW. Blaine Ter. Beaverton OR 97006), Interconnection mechanisms for electronic components.
  227. Carlomagno William D. (Redwood City CA) Cummings Dennis E. (Placerville CA) Gliga Alexandru S. (San Jose CA), Interconnection of electronic components.
  228. Behun John R. (Poughkeepsie NY) Call Anson J. (Poughkeepsie NY) Cappo Francis F. (Wappingers Falls NY) Cole Marie S. (Wappingers Falls NY) Hoebener Karl G. (Georgetown TX) Klingel Bruno T. (Hopewell , Interconnection structure and test method.
  229. Leedy Glenn (1061 E. Mountain Dr. Santa Barbara CA 93108), Interconnection structure for integrated circuits and method for making same.
  230. Sado Ryoichi (Saitama JPX), Interconnectors.
  231. Frost Keith A. (Redding CA) Harns Timothy (Palo Cedro CA) Simmons Ronald D. (Redding CA), Interface system for interfacing a device tester to a device under test.
  232. Rostoker Michael D. (San Jose CA) Pasch Nicholas F. (Pacifica CA) Zelayeta Joe (Saratoga CA), Interior bond pad arrangements for alleviating thermal stresses.
  233. Bargain Raymond (Sartrouville FRX) Riverie Jean (Limours FRX) Ollivier Jean-Francois (Versailles FRX), Intermediate connector for use between a printed circuit card and a substrate for electronic circuits.
  234. Patraw Nils E. (Redondo Beach CA), Inverted chip carrier.
  235. Chen Liang-Yu (Ithaca NY) MacDonald Noel C. (Ithaca NY), Isolated tungsten microelectromechanical structures.
  236. Chance Dudley A. (Danbury CT) Kopcsay Gerard V. (Yorktown Heights NY), LSI Chip carrier with buried repairable capacitor with low inductance leads.
  237. Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.
  238. Kister January (Palo Alto CA), Large scale protrusion membrane for semiconductor devices under test with very high pin counts.
  239. Cross Michael A. (Severna Park MD), Laser-arc apparatus and method for controlling plasma cloud.
  240. Khandros,Igor Y.; Miller,Charles A.; Wenzel,Stuart W., Layered microelectronic contact and method for fabricating same.
  241. Grabbe Dimitry (Lisbon Falls ME) Patterson Ronald (Dauphin PA), Lead frame and chip carrier housing.
  242. Kitano Makoto (Tsuchiura JPX) Nishimura Asao (Ushiku JPX) Yaguchi Akihiro (Ibaraki JPX) Kawai Sueo (Ibaraki JPX) Hoshi Akio (Isesaki JPX) Shimizu Ichio (Gunma JPX), Lead frame and semiconductor device using the same.
  243. Kurtz John A. (Gorham ME) Cousens Donald E. (Saco ME), Lead frame wire bonding by preheating.
  244. Mallik Debendra (Chandler AZ) Bhattacharyya Bidyut K. (Chandler AZ), Lead grid array integrated circuit.
  245. Derfiny Dennis J. (Clarendon Hills IL) Ceccoli Joseph D. (Mesa AZ) Baxter Emery E. (Tempe AZ), Leadform for use with surface mounted components.
  246. McDevitt ; Jr. John E. (Cumberland RI), Leadless grid array socket.
  247. Mullen ; III William B. (Boca Raton FL) Urbish Glenn F. (Coral Springs FL) Freyman Bruce J. (Plantation FL), Leadless pad array chip carrier.
  248. Kee David R. (Richardson TX), Leads for semiconductor chip assembly and method.
  249. Olsen Beverly L. (Brookfield CT) Ouano Augustus C. (Santa Cruz CA), Lift-off masking method.
  250. Little Michael J., Light valve target comprising electrostatically-repelled micro-mirrors.
  251. Mathieu,Gaetan L.; Eldridge,Benjamin N.; Grube,Gary W., Lithographic contact elements.
  252. Chiu Anthony M. (Richardson TX), Low cost erasable programmable read only memory package.
  253. Chiu Anthony M. (Richardson TX), Low cost erasable programmable read only memory package.
  254. McShane Michael B. (Austin TX), Low cost integrated circuit bonding process.
  255. Papae Donald J. (Hopewell Junction NY) Schomaker Donald F. (Poughkeepsie NY) Sorna Michael A. (Poughkeepsie NY), Low inductance side mount decoupling test structure.
  256. Hiesbock Heinz G. (Modling ATX) Bartl Karl (Vienna ATX), Low phosphorus containing band-shaped and/or filamentary material.
  257. Fjelstad Joseph, Low profile socket for microelectronic components and method for making the same.
  258. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Low resistance probe for semiconductor.
  259. Lee Li-Lien (Pittsburgh PA) Lambeth David N. (Pittsburgh PA) Laughlin David E. (Pittsburgh PA), Magnetic recording medium with B2 structured underlayer and a cobalt-based magnetic layer.
  260. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Making and testing an integrated circuit using high density probe points.
  261. Saito Shigeki (Fukui JPX) Hosokawa Takao (Tsuruga JPX) Mae Masataka (Fukui JPX), Manufacturing method for an electronic component.
  262. Kasukabe Susumu (Yokohama JPX) Takagi Ryuichi (Tokyo JPX), Manufacturing method of a probe head for semiconductor LSI inspection apparatus.
  263. Crumly William R. (Anaheim CA), Membrane connector with stretch induced micro scrub.
  264. Kister January ; Lobacz Jerzy, Membrane for holding a probe tip in proper location.
  265. Huff Richard E. (Belmont CA), Membrane probe contact bump compliancy system.
  266. Liu Ken K. F. (Saratoga CA) Min Byoung-Youl (Cupertino CA) Moti Robert J. (San Jose CA) Husain Syed A. (Milpitas CA), Membrane probing of circuits.
  267. Liu Ken Kuang-Fu ; Min Byoung-Youl ; Sano Kunio,JPX ; Sato Takashi,JPX, Membrane probing of circuits.
  268. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.
  269. Krajewski Nicholas J. (Chippewa Falls WI) Johnson David J. (Chippewa Falls WI) Kunstmann Arthur O. (Weyerhauser WI), Memory metal electrical connector.
  270. Schroeder Jack A. (Scottsdale AZ) Winkler Ernel R. (Mesa AZ), Metallization and bonding means and method for VLSI packages.
  271. Miller ; Jr. Grady A. (Grand Prairie TX), Method and apparatus for applying solder preforms.
  272. Throssel Fred, Method and apparatus for mounting, inspecting and adjusting probe card needles.
  273. Takahashi Hiroyuki (Kyoto JPX) Fujino Shinichi (Kyoto JPX) Sakamoto Kazuhiro (Kyoto JPX) Hirano Tomoyasu (Yanagawa JPX), Method and apparatus for performing wire bonding by using solder wire.
  274. Hembree David R. (Boise ID) Farnworth Warren M. (Nampa ID) Wood Alan G. (Boise ID), Method and apparatus for testing an unpackaged semiconductor die.
  275. Akiyama Yukiharu (Koganei JPX) Oshima Yoshio (Tokorozawa JPX), Method and apparatus for wire bonding.
  276. Akiyama, Yukiharu; Oshima, Yoshio, Method and apparatus for wire bonding.
  277. Okumura Hiroshi (Kyoto JPX), Method and apparatus for wire bonding.
  278. Fogal Rich (Boise ID) Huang Chender (Boise ID) Ball Mike (Boise ID), Method and apparatus for wire bonding semiconductor dice to a leadframe.
  279. Eldridge Benjamin N. (Danville CA) Mathieu Gaetan L. (Livermore CA), Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires.
  280. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer.
  281. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY) Welles ; II Kenneth B. (Schenectady NY), Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer.
  282. Seare Jerry G. (Salt Lake City UT) Smith-Wilson Patricia A. (North Salt Lake UT) VanWagoner Kurt (Layton UT) Mattey Jean A. (Midvale UT) Snyder Eileen K. (Sandy UT) Wahlstrom Candace C. (Salt Lake Ci, Method and system for generating statistically-based medical provider utilization profiles.
  283. Takehashi Shinitsu (Shijonawate JPX) Hatada Kenzo (Katano JPX) Fujimoto Hiroaki (Hirakata JPX), Method for bonding lead with electrode of electronic device.
  284. Flammer Wieland (Cleebronn DEX) Weber Roland (Heilbronn-Bockingen DEX) Weiher Gerhard (Brackenheim DEX) Troner Jakob (Heilbronn-Bockingen DEX), Method for contacting contact areas located on semiconductor bodies.
  285. Fillion Raymond A. (Niskayuna NY) Wojnarowski Robert J. (Ballston Lake NY) Gdula Michael (Knox NY) Cole Herbert S. (Burnt Hills NY) Wildi Eric J. (Niskayuna NY) Daum Wolfgang (Schenectady NY), Method for fabricating an integrated circuit module.
  286. Kim Sang Y. (Kyoungki-do KRX), Method for fabricating low resistance contacts of semiconductor device.
  287. Jain Kailash C. (Sterling Heights MI) Abraham Jacob A. (Champaign IL), Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such m.
  288. Farnworth Warren M. (Boise ID) Duesman Kevin (Boise ID) Heitzeberg Ed (Boise ID), Method for fabricating wafer-scale integration wafers and method for utilizing defective wafer-scale integration wafers.
  289. Keller Christopher G. (Albany CA), Method for fabrication of high vertical aspect ratio thin film structures.
  290. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.
  291. Kitamura Yoshihiro (Tokyo JPX), Method for forming a bump by bonding a ball on an electrode of an electronic device and apparatus for forming the same.
  292. Farnworth Warren M. (Nampa ID) Akram Salman (Boise ID) Wood Alan G. (Boise ID), Method for forming contact pins for semiconductor dice and interconnects.
  293. Lakritz, Mark N.; Ordonez, Jose; Tubiola, Peter J., Method for forming elongated solder connections between a semiconductor device and a supporting substrate.
  294. Ho Yu Q. (Kanata CAX) Jolly Gurvinder (Orleans CAX) Emesh Ismail T. (Cumberland CAX), Method for forming interconnect structures for integrated circuits.
  295. Karavakis Konstantine (Cupertino CA) DiStefano Thomas H. (Monte Sereno CA) Fjelstad Joseph (Sunnyvale CA), Method for making a flexible lead for a microelectronic device.
  296. Khandros, Igor Y.; Mathieu, Gaetan L.; Reynolds, Carl V., Method for making a socket to perform testing on integrated circuits.
  297. Koopman Nicholas George (Hopewell Junction NY), Method for making conduction-cooled circuit package.
  298. Hocker G. Benjamin (Minnetonka MN) Burns David W. (Minneapolis MN) Akinwande Akintunde I. (Bloomington MN) Horning Robert D. (Burnsville MN) Mirza Amir R. (Golden Valley MN) Stratton Thomas G. (Rosev, Method for making diaphragm-based sensors and apparatus constructed therewith.
  299. Welbourn Anthony D. (Ipswich GB2) McLaughlin Judith C. (Ipswich GB2), Method for making micromechanical switch.
  300. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Method for manufacturing a probe.
  301. Saito Tamio (Tokyo JPX), Method for manufacturing multilayer circuit substrate.
  302. Grabbe Dimitry G. (Lisbon Falls ME), Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure.
  303. Eldridge,Benjamin N.; Grube,Gary W.; Khandros,Igor Y.; Mathieu,Gaetan L., Method for mounting a plurality of spring contact elements.
  304. Littlebury Hugh W. (Chandler AZ), Method for parallel testing of semiconductor devices.
  305. Faley Timothy L. (Midland MI) Mills Michael E. (Midland MI) Teramoto Yoshihiko (Ohtsu MI JPX) Turek Douglas E. (Midland MI) Yabuki Kazuyuki (Ohtsu JPX), Method for preparing polybenzoxazole or polybenzothiazole fibers.
  306. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.
  307. Wilson Arthur M. (Richardson TX), Method for producing an integrated circuit product having a polyimide film interconnection structure.
  308. Khoury Theodore A. ; Jones Mark R. ; Frame James W., Method for producing contact structures.
  309. Igor Y. Khandros ; Thomas H. Dozier ; Gary W. Grube ; Gaetan L. Mathieu, Method for shaping spring elements.
  310. Braun Carol (Clifton VA) Correia George C. (Warrenton VA) Konecke-Lease Sheila (Leesburg VA) Cummings Richard W. (Dumfries VA), Method of aligning and mounting solder balls to a substrate.
  311. Ohno Hideshi (Sayama JPX), Method of assembling semiconductor integrated circuit.
  312. Bitaillou Alex (Bretigny sur Orge FRX) Masson Jean (Noisy/Ecole FRX) Lemoine Jean-Marie (Saint-Michel-sur-Orge FRX), Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate.
  313. Conru H. Ward (Essex Junction VT) Gons Stephen E. (Camp Hill PA) Osborne ; Jr. Gordon C. (Burlington VT) Phelps ; Jr. Douglas W. (Burlington VT) Starr Stephen G. (Essex Junction VT) Ward William C. (, Method of bonding gold or gold alloy wire to lead tin solder.
  314. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of burning-in semiconductor devices.
  315. Cragon Harvey G. (Austin TX) Hutchins Charles L. (Sugar land TX), Method of electrically connecting integrated circuits by edge-insertion in grooved support members.
  316. Greschner Johann,DEX ; Pleshko Peter ; Schmid Gerhard,DEX, Method of fabricating a field emission device.
  317. Tracy ; John M., Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components.
  318. Brown Richard (Union County NJ), Method of fabricating an electronic circuit including an aperture through the substrate thereof.
  319. Wiech ; Jr. Raymond E. (4659 Pescadero Ave. San Diego CA 92107), Method of fabricating complex micro-circuit boards and substrates.
  320. Chakravorty Kishore K. (Issaquah WA) Tanielian Minas H. (Bellevue WA), Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers.
  321. Bindra Perminder S. (South Salem NY) Cuomo Jerome J. (Lincolndale NY) Gall Thomas P. (Endwell NY) Ingraham Anthony P. (Endicott NY) Kang Sung K. (Chappaqua NY) Kim Jungihl (Chappaqua NY) Lauro Paul (, Method of fabricating nendritic materials.
  322. Hasegawa Miki (Kyoto JPX) Kuriyama Chojiro (Kyoto JPX), Method of forming a ball end for a solder wire.
  323. Matsushita Akira (Zyouyou JPX) Konishi Hidekazu (Ibaraki JPX), Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device.
  324. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.
  325. Tsuda Toshio (Habikino JPX) Horio Yasuhiko (Osaka JPX) Bessho Yoshihiro (Kadoma JPX) Ishida Toru (Hirakata JPX), Method of forming an electrical contact bump.
  326. Squitieri Vincent (Billerica MA) Lynn William Joseph (Groveland MA), Method of forming an interconnector.
  327. Saito Masayuki (Yokohama JPX) Niitsuma Akira (Yokohama JPX) Ohdaira Hirosi (Chigasaki JPX) Tanuma Chiaki (Tokyo JPX) Mori Miki (Kawasaki JPX), Method of forming bump electrode and electronic circuit device.
  328. Sweis Jason (Sunnyvale CA) Gilleo Kenneth B. (West Kingston RI), Method of forming interface between die and chip carrier.
  329. Albrecht Thomas R. (Stanford CA) Akamine Shinya (Stanford CA) Carver Thomas E. (Mountain View CA) Zdeblick Mark J. (Los Altos Hills CA), Method of forming microfabricated cantilever stylus with integrated pyramidal tip.
  330. Grebe Kurt R. (24 Van Nydeck Ave. Beacon NY 12508), Method of forming multi-chip module with high density interconnections.
  331. Gorrell Robin E. ; Fischer Paul J., Method of forming raised metallic contacts on electrical circuits for permanent bonding.
  332. Hatada Kenzo (Katano JPX), Method of joining beam leads with projections to device electrodes.
  333. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Method of making a contact structure with a distinctly formed tip structure.
  334. Runyon Ronnie J. (Kokomo IN), Method of making a flex circuit interconnect for a microprocessor emulator and a method of testing.
  335. Rai Akiteru (Osaka JPX) Yamamura Keiji (Nara JPX) Nukii Takashi (Nara JPX), Method of making a hybrid semiconductor device.
  336. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), Method of making a micromechanical electric shunt.
  337. DiStefano Thomas H. (Bronxville NY) Ehrenberg Scott G. (Fishkill NY) Khandros Igor Y. (Peekskill NY), Method of making a multi-layer circuit assembly.
  338. Yee Ian Y. K. (Austin TX), Method of making a multilevel electrical airbridge interconnect.
  339. Bednarz George A. (Austin TX), Method of making a post molded cavity package with internal dam bar for integrated circuit.
  340. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.
  341. Hudak John James (5245 Hayledge Ct. Columbus MD 21045) Mountain David Jerome (505 N. Chapelgate La. Baltimore MD 21229), Method of making a thin conformal high-yielding multi-chip module.
  342. Zdeblick Mark (Los Altos Hills CA) Albrecht Thomas R. (Stanford CA), Method of making an integrated scanning tunneling microscope.
  343. Freyman Bruce J. (N. Lauderdale FL) Dorinski Dale (Coral Springs FL) Shurboff John (Coral Springs FL), Method of making an ultra high density pad array chip carrier.
  344. Toda Akitoshi (Tokyo JPX), Method of making cantilever chip for scanning probe microscope.
  345. Elles Richard J. (Philadelphia PA) Ely Razon (Hatboro PA) Vilenski Dan (Horsham PA), Method of making constant bonding wire tail lengths.
  346. Buchoff Leonard S. (Bloomfield NJ) Kosiarski Joseph P. (Englishtown NJ) Dalamangas Chris A. (Union NJ), Method of making electrically conductive connector.
  347. Abrams Richard L. (Pacific Palisades CA) Pinnow Douglas A. (Pacific Palisades CA), Method of making hermetic coaxial cable.
  348. Altman Leonard F. (Coral Springs FL) Flaugher Jill L. (Margate FL) Suppelsa Anthony B. (Coral Springs FL) Mullen ; III William B. (Boca Raton FL), Method of making high density solder bumps and a substrate socket for high density solder bumps.
  349. Wang Scott W. (Sunnyvale CA) Thomas Mammen (San Jose CA) Ko Wen C. (San Jose CA), Method of making improved lateral polysilicon diode by treating plasma etched sidewalls to remove defects.
  350. Hatton Richard L. (558 Eton Dr. Barrington IL 60010), Method of making inductance.
  351. Fontana ; Jr. Robert E. (San Jose CA) Thompson David A. (San Jose CA) Williams ; III Mason L. (San Jose CA) Yeack-Scranton Celia E. (San Jose CA), Method of making integral transducer-suspension assemblies for longitudinal recording.
  352. Liu Nan-Chou D. (Chutung TWX), Method of making low capacitance field emission device.
  353. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.
  354. Eldridge,Benjamin N.; Mathieu,Gaetan L.; Reynolds,Carl V., Method of making microelectronic spring contact array.
  355. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
  356. DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA) Karavakis Konstantine N. (Cupertino CA) Kovac Zlata (Los Gatos CA) Fjelstad Joseph (Sunnyvale CA), Method of making multilayer circuit.
  357. Cuneo Edward A. (Westminster CA) Montei Harold R. (Rowland Heights CA) Olivieri Michael (Alta Loma CA), Method of making pressure point contact system.
  358. Chino Toyoji (Osaka JPX) Matsuda Kenichi (Osaka JPX) Shibata Jun (Osaka JPX), Method of making semiconductor device with air-bridge interconnection.
  359. Nelson Gregory H. (Gilbert AZ) Lebow Sanford (Westlake Village CA) Nogavich Eugene (Gilbert AZ), Method of manufacture interconnect device.
  360. Kimura Mitsuru (Tokyo JPX) Nakakita Shoji (Tokyo JPX), Method of manufacturing a multichip package with increased adhesive strength.
  361. Tada Tetsuo (Hyogo JPX) Takagi Ryouichi (Hyogo JPX), Method of manufacturing a probing card for wafer testing.
  362. Shimada Yasuhiro (Atsugi JPX) Okamura Yoshimasa (Tokyo JPX) Takamatsu Osamu (Atsugi JPX) Nakayama Masaru (Atsugi JPX) Yanagisawa Yoshihiro (Isehara JPX), Method of manufacturing a tip for scanning tunneling microscope using peeling layer.
  363. Miura Norio (Gunma JPX), Method of manufacturing an inductance element.
  364. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  365. Guckel Henry (Madison WI) Christenson Todd R. (Madison WI) Skrobis Kenneth J. (Madison WI), Method of manufacturing micromechanical devices.
  366. Nagao Koichi,JPX ; Nakata Yoshiro,JPX ; Oki Shinichi,JPX, Method of manufacturing probe card.
  367. Aigoo Seiichiro (15-13 ; Negishi 3-chome Taito-Ku ; Tokyo 110 JPX), Method of manufacturing semiconductor device with plated bump.
  368. Klatskin ; Jerome Barnard ; Rosen ; Arye, Method of manufacturing semiconductor devices having a copper heat capacitor and/or copper heat sink.
  369. Kubena Randall L. (Agoura CA) Atkinson Gary M. (Thousand Oaks CA), Method of manufacturing single-wafer tunneling sensor.
  370. Saia Richard J. (Schenectady NY) Ghezzo Mario (Ballston Lake NY) Bagepalli Bharat S. K. (Schenectady NY) Durocher Kevin M. (Waterford NY), Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches.
  371. Saia Richard Joseph (Schenectady NY) Ghezzo Mario (Ballston Lake NY) Bagepalli Bharat Sampath Kumar (Schenectady NY) Durocher Kevin Matthew (Waterford NY), Method of micromachining electromagnetically actuated current switches with polyimide reinforcement seals, and switches.
  372. Zavracky Paul M., Method of monolithically fabricating a microspectrometer with integrated detector.
  373. Fritz Galen F. (Plano TX), Method of mounting integrated circuit interconnect leads releasably on film.
  374. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
  375. Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA), Method of packaging and powering integrated circuit chips and the chip assembly formed thereby.
  376. Smith Kenneth R. (Aloha OR) Johnston Kent H. (Beaverton OR) LaRue George S. (Beaverton OR) Mueller Robert A. (Portland OR) Tabor Steven A. (Aptos CA), Method of packaging integrated circuit chips, and integrated circuit package.
  377. Ootsuki Hideaki (Amagasaki JPX) Takada Mitsuyuki (Amagasaki JPX) Kokogawa Toru (Amagasaki JPX) Takasago Hayato (Amagasaki JPX), Method of packaging semiconductor device.
  378. Quate Calvin F. (Stanford CA) Minne Stephen Charles (Danville IL), Method of performing lithography using cantilever array.
  379. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  380. Yoshida Toshiki (Huntingdon Valley PA) Kyomasu Ryuichi (Tokyo JPX) Satoh Toshihiro (Tokyo JPX), Method of preventing short-circuiting of bonding wires.
  381. Adams Arthur C. (Berkeley Heights NJ) Pfeiffer Loren N. (Harding Township ; Morris County NJ) West Kenneth W. (Mendham NJ), Method of producing SOI devices.
  382. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.
  383. Guckel Henry (Madison) Christenson Todd R. (Madison WI), Method of producing micromachined differential pressure transducers.
  384. van de Pas Hermanus A. (Nijmegen NLX) Knobbout Huibert A. (Nijmegen NLX), Method of providing raised electrical contacts on electronic microcircuits.
  385. Leedy Glenn J. (Santa Barbara CA), Method of repairing an integrated circuit structure.
  386. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
  387. Prokopp Manfred (Am Felder 27 D-6980 Wertheim-Reicholzheim DEX), Method of testing circuit boards and the like.
  388. Pasiecznik ; Jr. John, Method of testing integrated circuits.
  389. Shiba Takeshi (Ono JPX) Shimizu Toshiaki (Ono JPX) Yanase Fumihiro (Ono JPX), Method of thermal diffusion alloy plating for steel wire on continuous basis.
  390. Grube,Gary W.; Mathieu,Gaetan L.; Eldridge,Benjamin N.; Sofield,Chadwick D., Method to build robust mechanical structures on substrate surfaces.
  391. Joseph Fjelstad, Methods and structures for electronic probing arrays.
  392. Saia Richard J. (Schenectady NY) Durocher Kevin M. (Waterford NY) Gorczyca Thomas B. (Schenectady NY) Ghezzo Mario (Ballston Lake NY), Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated component.
  393. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
  394. Frazier A. Bruno, Methods for preparing devices having metallic hollow microchannels on planar substrate surfaces.
  395. Arney Susanne C. (Ithaca NY) MacDonald Noel C. (Ithaca NY) Yao Jun J. (Ithaca NY), Methods of fabricating integrated, aligned tunneling tip pairs.
  396. Jones Gary Wayne (Raleigh NC) Sune Ching-Tzong (Raleigh NC), Methods of making vertical microelectronic field emission devices.
  397. Fendley Richard L. (Indianapolis IN) Hoenig Gerhard E. (Indianapolis IN) Poehlmann George (Indianapolis IN) Prendergast ; Jr. John M. (Indianapolis IN), Methods of solid-phase bonding mating members through an interposed pre-shaped compliant medium.
  398. Yao Jun J. (Thousand Oaks CA), Micro electromechanical RF switch.
  399. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
  400. Fan Long-Shen (San Jose CA) Zappe Hans H. (San Jose CA), Micro-miniature structures and method of fabrication thereof.
  401. Rothenberger Richard E. (5 State Dr. Harrisburg PA 17112), Micro-power connector.
  402. Carver Thomas E. (Mountain View CA), Microcasting of microminiature tips.
  403. Shaw Kevin A. (Ithaca NY) Adams Scott G. (Ithaca NY) MacDonald Noel C. (Ithaca NY), Microelectromechanical lateral accelerometer.
  404. DiStefano Thomas H. ; Smith John W., Microelectronic assemblies with multiple leads.
  405. Distefano Thomas H. (Monte Sereno CA) Kovac Zlata (Los Gatos CA) Grange John (Cupertino CA), Microelectronic bonding with lead motion.
  406. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structure and method of making same.
  407. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  408. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  409. Fjelstad Joseph (Sunnyvale CA) Smith John W. (Palo Alto CA) Distefano Thomas H. (Monte Sereno CA) Zaccardi James (Sunnyvale CA) Walton A. Christian (Belmont CA), Microelectronic contacts with asperities and methods of making same.
  410. DiStefano Thomas H. (Monte Sereno CA) Smith John W. (Palo Alto CA), Microelectronic mounting with multiple lead deformation and bonding.
  411. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
  412. Eldridge, Benjamin N.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V., Microelectronic spring contact elements.
  413. Grube, Gary W.; Mathieu, Gaetan L., Microelectronic spring contact repair.
  414. Grube, Gary W., Microelectronic spring with additional protruding member.
  415. DiStefano Thomas H. (Monte Sereno CA) Smith ; Jr. John W. (Austin TX), Microelectronics unit mounting with multiple lead bonding.
  416. Albrecht Thomas R. (Stanford CA) Akamine Shinya (Stanford CA) Carver Thomas E. (Mountain View CA) Zdeblick Mark J. (Los Altos CA), Microfabricated cantilever stylus with integrated pyramidal tip.
  417. Field Leslie A. (Portola Valley CA) Ruby Richard C. (Menlo Park CA), Micromachined bi-material signal switch.
  418. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
  419. Norling Brian L. (Mill Creek WA), Micromachined thermal switch.
  420. Ghezzo Mario (Ballston Lake NY) Saia Richard J. (Schenectady NY) Bagepalli Bharat S. (Schenectady NY) Imam Imdad (Schenectady NY) Polla Dennis L. (Brooklyn Park ; MN), Micromachining methods for making micromechanical moving structures including multiple contact switching system.
  421. Reed Michael L. (Pittsburgh PA) Weiss Lee E. (Pittsburgh PA), Micromechanical barb and method for making the same.
  422. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), Micromechanical electric shunt and encoding devices made therefrom.
  423. Muller Richard S. (Kensington CA) Fan Longsheng (Berkeley CA) Tai Yu C. (Albany CA), Micromechanical elements and methods for their fabrication.
  424. Guckel Henry (Madison WI) Klein Jonathan L. (Madison WI) Earles Thomas L. (Madison WI), Micromechanical magnetically actuated devices.
  425. Ghezzo Mario (Ballston Lake NY) Saia Richard J. (Schenectady NY) Bagepalli Bharat S. (Schenectady NY) Imam Imdad (Schenectady NY) Polla Dennis L. (Brooklyn Park MN), Micromechanical moving structures including multiple contact switching system.
  426. Bayer Thomas (Sindelfingen DEX) Greschner Johann (Pliezhausen DEX), Micromechanical sensor and sensor fabrication process.
  427. Bongianni Wayne L. (408 Colleen Ct. Los Alamos NM 87544), Microminiature coaxial cable and methods manufacture.
  428. Marcus Robert B. (133 Colchester Rd. Murray Hill NJ 07974) Carr William N. (W. Milford NJ), Microprobe.
  429. Sugihara Osamu (Nagasaka JPX), Microprobe provided circuit substrate and method for producing the same.
  430. Smart Wilson H. ; Subramanian Kumar, Microsampling device and method of construction.
  431. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructure and single mask, single-crystal process for fabrication thereof.
  432. Yagi Takayuki (Yokohama JPX) Akaike Masatake (Atsugi JPX), Microstructure, process for manufacturing thereof and devices incorporating the same.
  433. Shaw Kevin A. ; Zhang Z. Lisa ; MacDonald Noel C., Microstructures and single mask, single-crystal process for fabrication thereof.
  434. Lee Abraham P. ; Krulevitch Peter A. ; Northrup M. Allen ; Trevino Jimmy C., Microvalve.
  435. Gibson Peter J. (Crawley GB2), Microwave detector arrangement.
  436. Coughlin Charles P. (Chelsea NY), Modular test probe.
  437. Hernandez Jorge M. (Mesa AZ) Simpson Scott (Woodstock CT), Molded integrated circuit package incorporating heat sink.
  438. Mehta Mahendra C. (Palm Beach Gardens FL), Mounting of semiconductor chips on a plastic substrate.
  439. Thevenin Gilles (14d rue RenCoty 71100 Chalon-sur-Saone FRX), Mounting panel for removable elements.
  440. Yamamoto Tsuyoshi (Yokohama JPX) Okada Nobuhide (Kawasaki JPX) Kawamura Yasuo (Hachioji JPX), Mounting structure of flat-lead package-type electronic component.
  441. DiStefano Thomas H. (Bronxville NY) Khandros Igor Y. (Peekskill NY) Grube Gary W. (Monroe NY), Multi-Layer circuit construction method and structure.
  442. Mowatt Larry J. (Allen TX) Walter David (Richardson TX), Multi-chip integrated circuit module.
  443. Mowatt Larry J. (Allen TX) Walter David (Richardson TX), Multi-chip integrated circuit module and method for fabrication thereof.
  444. Sparks, Steve E.; Edwards, Darvin R.; Heinen, Katherine G., Multi-chip module testing.
  445. Zimmerman ; Jr. John A. (Hershey PA) Paullus Clarence L. (Lewisberry PA), Multi-contact connector for ceramic substrate packages and the like.
  446. DiStefano Thomas H. (Bronxville NY) Khandros Igor Y. (Peekskill NY) Grube Gary W. (Monroe NY), Multi-layer circuit construction methods with customization features.
  447. DiStefano Thomas H. (Bronxville NY) Ehrenberg Scott G. (Fishkill NY) Khandros Igor Y. (Peekskill NY), Multi-layer circuit structures, methods of making same and components for use therein.
  448. Dampier Michael S. (Burlington VT) Prilik Ronald J. (South Burlington VT) Rapoport Norman R. (Williston VT), Multi-layer printed circuit board.
  449. McCormick John (Redwood City CA), Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate.
  450. Evans Arthur (Broofield Center CT), Multi-level test probe assembly for IC chips.
  451. Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Multichip integrated circuit packaging method.
  452. Freyman Ronald Lamar (Bethlehem PA) Garen Craig Joseph (Bethlehem PA) Holder ; Jr. Clinton Hays (Slatington PA) Kershaw Robert Nelson (Harleysville PA) Morgan Edward Clayton (Macungie PA), Multifunctional chip wire bonds.
  453. Keller Christopher G. (Albany CA), Multilayer high vertical aspect ratio thin film structures.
  454. Massaron Laurence I. (Santa Monica CA), Multilayer overlay interconnect for high-density packaging of circuit elements.
  455. Merchant Sailesh M. (Orlando FL) Nanda Arun K. (Austin TX) Roy Pradip K. (Orlando FL), Multiple layer tungsten deposition process.
  456. Reid Gilbert R. (Norristown PA), Multiple solder pre-form with non-fusible web.
  457. Reid Lee R. (Plano TX) Ratliff Charles R. (Richardson TX), Multiprobe test system and method of using same.
  458. Clabes Joachim G. (Yorktown Heights NY) Hatzakis Michael (Chappaqua NY) Lee Kam L. (Putnam Valley NY) Petek Bojan (Croton-on-Hudson NY) Slonczewski John C. (Katonah NY), Nanometer scale probe for an atomic force microscope, and method for making same.
  459. Jackson Jeffery E. (Kirkland WA), Noble metal plated wire and terminal assembly, and method of making the same.
  460. Elder Richard A. (Dallas TX) Johnson Randy (Carrollton TX) Frew Dean L. (Garland TX) Wilson Arthur M. (Dallas TX), Non-destructive burn-in test socket for integrated circuit die.
  461. Roebuck Randal D. (Dallas TX) Rizzo Salvatore P. (Norwood MA), Non-destructive interconnect system for semiconductor devices.
  462. Melton Cynthia M. (Bolingbrook IL) Raleigh Carl J. (Cary IL) Scheifers Steven (Hoffman Estates IL), Noncollapsing multisolder interconnection.
  463. Levinson Frank H. (Hanover Township ; Morris County NJ), Optical coupling device utilizing a mirror and cantilevered arm.
  464. Hill William H. (Carlsbad CA) Cawelti Dale W. (Carlsbad CA), Orthogonal bonding method and equipment.
  465. Worp Nicolaas H. (Margate FL) Freyman Bruce J. (Plantation FL) Conrath Kurt C. (Lauderhill FL), Overmolded semiconductor package with anchoring means.
  466. Hart Tom (Tempe AZ), PC board test fixture.
  467. Cipolla Thomas M. (Katonah NY) Coteus Paul W. (Yorktown Heights NY) Damianakis Ioannis (Montreal NY CAX) Johnson Glen W. (Yorktown Heights NY) Ledermann Peter G. (Peekskill NY) Matthew Linda C. (Peek, Packages for stacked integrated circuit chip cubes.
  468. Lin Paul T. (Austin TX) Wilson Howard P. (Austin TX), Pad array carrier IC device using flexible tape.
  469. Jones Gary W. (Raleigh NC), Panel display with dielectric spacer structure.
  470. Difrancesco Louis (31032 Hershey Wy Hayward CA 94544), Particle-enhanced joining of metal surfaces.
  471. Doss Saad K. (Gilroy CA) McKean Dennis R. (San Jose CA) Renaldo Alfred F. (San Jose CA) Wilson Robert J. (Cupertino CA), Patterned electroplating.
  472. Ebert Wolfram (Freiburg DEX) Handrich Eberhard (Kirchzarten DEX) Hafen Martin (Rottweil DEX) Ryrko Bruno (Denslingen DEX), Pendulum with bending spring joint.
  473. Carey David H. (Austin TX) Whalen Barry H. (Austin TX), Peripheral to area adapter with protective bumper for an integrated circuit chip.
  474. Phelps ; Jr. Douglas W. (Burlington VT) Redmond Robert J. (Essex Junction VT) Ward William C. (Burlington VT), Peripheral/area wire bonding technique.
  475. Ogura Mitsuhiro (Kunitachi JPX), Personality board.
  476. Smith Donald L. (Palo Alto CA) Alimonda Andrew S. (Los Altos CA), Photolithographically patterned spring contact.
  477. Smith Donald Leonard ; Alimonda Andrew Sebastian, Photolithographically patterned spring contact.
  478. Mu Albert T. (San Jose CA), Pin grid array package structure.
  479. Sickafus Edward N. (Grosse Ile MI), Planar micro-motor with bifilar micro-coils.
  480. Hirata Atsuomi (Nara JPX) Nakamura Yoshihiko (Nishinomiya JPX) Morii Kensaku (Takatsuki JPX), Plastic molded pin grid chip carrier package.
  481. Pai Deepak K. (Burnsville MN) Krinke Terrance A. (Roseville MN), Plated compliant lead.
  482. Pai Deepak K. (Burnsville MN) Krinke Terrance A. (Roseville MN), Plated compliant lead.
  483. Grabbe Dimitry G. (Lisbon Falls ME), Power, ground and decoupling structure for chip carriers.
  484. Pasch Nicholas F. (Pacifica CA), Preformed planar structures employing embedded conductors.
  485. Sado Ryoichi (Saitama JPX), Press-contact type interconnectors.
  486. Harris Guy (Carrollton TX) Callaway Duane (Grand Prairie TX) Shah Rajesh (Lewisville TX), Pressure differential downset.
  487. Enochs Raymond S. (Hillsboro OR), Pressure interconnect package for integrated circuits.
  488. Reding Bennett J. (Colorado Springs CO) McIver Chandler H. (Tempe AZ), Pretestable double-sided tab design.
  489. Driller Hubert (Schmitten DEX) Mang Paul (Schmitten DEX), Printed circuit board testing device with foil adapter.
  490. Yamaguchi Masao (Tokyo JPX), Probe apparatus.
  491. Itoyama Taketoshi (Tokorozawa JPX) Abe Yuichi (Tokyo JPX) Yamaguchi Masao (Tokyo JPX), Probe apparatus and burn-in apparatus.
  492. Nakajima Hisashi (Yamanishi-ken JPX) Yoshioka Haruhiko (Yamanishi-ken JPX), Probe apparatus for correcting the probe card posture before testing.
  493. Mori, Shigeoki; Karasawa, Wataru, Probe apparatus for probing an object held above the probe card.
  494. Abe Yuichi (Tokyo JPX) Yamaguchi Masao (Tokyo JPX) Nagasaka Munetosi (Yamanashi-ken JPX), Probe apparatus for testing multiple integrated circuit dies.
  495. Nakajima Hisashi,JPX ; Yoshioka Haruhiko,JPX, Probe apparatus with tilt correction mechanisms.
  496. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuit devices.
  497. McQuade Francis T. (Watertown CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuits.
  498. Iino Shinji (Yamanashi JPX) Kubota Tamio (Kofu JPX) Yokota Keiichi (Nirasaki JPX), Probe card.
  499. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.
  500. Carlin Scott J. (Austin TX) Roberts ; Jr. Samuel (Austin TX), Probe card apparatus having a heating element and process for using the same.
  501. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.
  502. Higgins H. Dan ; Pandey Rajiv ; Armendariz Norman J. ; Bates R. Dennis, Probe card assembly for high density integrated circuits.
  503. Sinsheimer Roger (Petaluma CA) Anderson James (Santa Rosa CA), Probe card changer system and method.
  504. Clarridge Glenn R. (Portland OR), Probe card fixture.
  505. Trenary Dale T. (San Jose CA), Probe card for integrated circuit chip.
  506. Liu Jui-Hsiang (Chandler AZ) Olsen Dennis R. (Scottsdale AZ), Probe card for testing unencapsulated semiconductor devices.
  507. Tarzwell John W. (Phoenix AZ), Probe device for integrated circuit wafers.
  508. Pasiecznik ; Jr. John (Malibu CA), Probe for jesting an electrical circuit chip.
  509. Khandros,Igor Y.; Mathieu,Gaetan L., Probe for semiconductor devices.
  510. Kreiger Walter C. (Underhill VT) Wilder Donald L. (South Hero VT), Probe for wafer burn-in test system.
  511. Worsham Daniel A. (San Jose CA) Ashley Jack E. (Cupertino CA) Munoz Joseph M. (San Jose CA), Probe head for an automatic semiconductive wafer prober.
  512. Nagasawa Yasushi (Yamanashi-Ken JPX) Yamashita Satoru (Kofu JPX) Matsudo Masahiko (Kofu JPX), Probe needle.
  513. Ickes John M. (Emmett ID), Probe pin alignment tool.
  514. Takagi Ryouichi (Hyogo JPX) Tada Tetsuo (Hyogo JPX) Kohara Masanobu (Hyogo JPX), Probe plate used for testing a semiconductor device, and a test apparatus therefor.
  515. Fujita Kazuhide (Osaka JPX), Probe structure for measuring electric characteristics of a semiconductor element.
  516. Tarzwell John W. (Scottsdale AZ) Tarzwell Patrick J. (Mesa AZ) Myers Theodore R. (Tempe AZ) Hyland Barry M. (Scottsdale AZ) Dahl John C. (Mesa AZ) Eddings Jack L. (Scottsdale AZ), Probe system for device and circuit testing.
  517. Janko Bozidar (Portland OR) Garuts Valdis E. (Beaverton OR) Saunders J. Lynn (Hillsboro OR), Probe with microstrip transmission lines.
  518. Itoyama Taketoshi (Tokorozawa JPX), Prober apparatus.
  519. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.
  520. Ozaki Kazuyuki (Kawasaki JPX) Wakana Shinichi (Kawasaki JPX) Goto Yoshiro (Kawasaki JPX) Ito Akio (Kawasaki JPX) Okubo Kazuo (Kawasaki JPX) Hama Soichi (Kawasaki JPX) Fujii Akira (Kawasaki JPX) Sato , Probing device and system for testing an integrated circuit.
  521. Fujihara Hitoshi (Yamanashi JPX) Takao Itaru (Yamanashi JPX), Probing device setting a probe card parallel.
  522. Tada Tetsuo (Hyogo JPX) Takagi Ryoichi (Hyogo JPX) Kohara Masanobu (Hyogo JPX), Probing plate for wafer testing.
  523. Desai Kamalesh S. (Wappingers Falls NY) Eggerding Carl L. (Wappingers Falls NY) Ferrante John A. (Sherman CT) Ricci Raymond (Wappingers Falls NY) Urfer Ernest N. (Hopewell Junction NY), Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate.
  524. LoVasco Francis (Roxbury Township NJ) Oien Michael A. (Chatham Township ; both of Morris County NJ), Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate.
  525. Moeller Werner (Ulm DEX) von Luettichau Harald (Kirchheim-Oetlingen DEX), Process for encapsulating microelectronic semi-conductor and layer type circuits.
  526. Alfaro Rafael C. (The Colony TX) Howe Lau B. (Subanq Java MYX) Ramsey Thomas H. (Garland TX), Process for enhanced intermetallic growth in IC interconnections.
  527. MacDonald Noel C. (Ithaca NY) Zhang Zhoying L. (Ithaca NY) Porkolab Gyorgy A. (Ithaca NY), Process for fabricating submicron single crystal electromechanical structures.
  528. Matthews James A. (878 Alcosta Dr. Milpitas CA 95035), Process for forming planarized, air-bridge interconnects on a semiconductor substrate.
  529. Higgins J. Aiden (Westlake Village CA) Walton ; Jr. Emory R. (Thousand Oaks CA), Process for making a probe for high speed integrated circuits.
  530. Cini Carlo (Cornaredo ITX) Massironi Angelo (Concorezzo ITX) Sisti Luigi (Genova ITX), Process for manufacturing integrated device with improved connections between the pins and the semiconductor material ch.
  531. Bridges William G. (Meriden CT) Armer Thomas A. (New Haven CT) Chang Kin-Shiung (Meriden CT), Process for manufacturing plastic pin grid arrays and the product produced thereby.
  532. Aoude Farid Y. (Wappingers NY) Cooper Emanuel I. (Riverdale NY) Duncombe Peter R. (Peekskill NY) Farooq Shaji (Hopewell Junction NY) Giess Edward A. (Purdys Station NY) Kim Young-Ho (Seoul NY KRX) Kn, Process for producing ceramic circuit structures having conductive vias.
  533. Damiot Pascale (Cerny FRX), Process for recovering bare semiconductor chips from plastic packaged modules by thermal shock.
  534. Behun John R. (Poughkeepsie NY) Miller William R. (Poughkeepsie NY) Newman Bert H. (Carmel NY) Yankowski Edward L. (Hyde Park NY), Process of fabricating a circuit package.
  535. Phy William S. (Los Altos Hills CA), Process of forming a compliant lead frame for array-type semiconductor packages.
  536. Yasuzato Tadao (Tokyo JPX) Sakurai Keizo (Tokyo JPX), Process of forming bump on electrode of semiconductor chip and apparatus used therefor.
  537. Quinn ; Daniel J. (Carrollton TX) Mulholland Wayne A. (Plano TX) Bond Robert H. (Carrollton TX) Olla Michael A. (Flower Mound TX) Cupples Jerry S. (Carrollton TX) Tsitovsky Ilya L. (Farmers Branch TX, Process of forming integrated circuits with contact pads in a standard array.
  538. Ibrahim Shawki S. (Lafayette IN) Elsner James E. (Lafayette IN), Process of making multi-layer ceramic package.
  539. Bednarz George A. (Plano TX) Smith Reginald W. (Arlington TX) Roeding Gretchen W. (Carrollton TX) Test Howard R. (Plano TX), Process of packaging a semiconductor device with reduced stress forces.
  540. Drabik Timothy J. (Atlanta GA) Martin Kevin P. (Atlanta GA) Callahan John (Revere MA), Processes and apparatus for lift-off and bonding of materials and devices.
  541. Morton Robert M. (Hopewell Junction NY) Perlmann Ariel L. (Poughkeepsie NY), Programmable interface contactor structure.
  542. Kurematsu, Katsumi, Projection type display apparatus.
  543. Oettel Friedrich H. (Daytona Beach FL), Pyroelectric detector.
  544. Suarez Jose I. (Coral Gables FL) Martin William J. (Fort Lauderdale FL) Lauder James V. (Fort Lauderdale FL) Cook Harold M. (Sunrise FL), RF interconnect.
  545. Gooch Roland W., Ramped foot support.
  546. Bernhardt Anthony F. (Berkeley CA) Contolini Robert J. (Livermore CA) Malba Vincent (Livermore CA) Riddle Robert A. (Tracy CA), Repairable chip bonding/interconnect process.
  547. Eldridge,Benjamin Niles; Grube,Gary William; Khandros,Igor Yan; Mathieu,Gaetan L., Resilient contact structures formed and then attached to a substrate.
  548. Kobayashi Shiro (Hitachi JPX) Itoh Masahiko (Hitachi JPX) Minato Akira (Hitachi JPX), Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound.
  549. Armstrong,Michael; Herman,Gayle; Omweg,Greg; Shenoy,Ravindra V., Rhodium electroplated structures and methods of making same.
  550. Woith Blake F. (Orange CA) Crumly William R. (Anaheim CA) Linder Jacques F. (Rancho Palos Verdes CA), Rigid-flex circuits with raised features as IC test probes.
  551. Carr Willian N. (Wayne NJ) Yu Hong (San Jose CA) Dong-Il Dan C. (Princeton Junction NJ), Rotary, vertical-drive, tethered micromotor.
  552. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), SOI actuators and microsensors.
  553. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), SOI diaphgram sensor.
  554. Zavracky Paul M. (Norwood MA) Morrison ; Jr. Richard H. (Taunton MA), SOI diaphragm sensor.
  555. Woith Blake F. (Orange CA) Szalay John S. (Corona Del Mar CA), Self leveling and self tensioning membrane test probe.
  556. Huff Richard E. (Belmont CA) Matta Farid (Mountain View CA), Self-leveling membrane probe.
  557. Wang Tsing-Chow (San Jose CA) Liang Louis H. (Los Altos CA), Semi-conductor device interconnect package assembly for improved package performance.
  558. Mandigo Frank N. (North Branford CT) Mei George C. (Creve Coeur MO) Fister Julius C. (Hamden CT), Semiconductor bridge (SCB) packaging system.
  559. Grube Gary (Monroe NY) Khandros Igor (Peekskill NY) Mathieu Gaetan (Carmel NY), Semiconductor chip assemblies and components with pressure contact.
  560. Grube Gary (Monroe NY) Khandros Igor (Peekskill NY) Mathieu Gaetan (Carmel NY), Semiconductor chip assemblies and components with pressure contact.
  561. Khandros Igor Y. (Peekskill NY) DiStefano Thomas H. (Bronxville NY), Semiconductor chip assemblies and methods of making same.
  562. Khandros Igor Y. (Peekskill NY) DiStefano Thomas H. (Bronxville NY), Semiconductor chip assemblies having interposer and flexible lead.
  563. Khandros Igor Y. (Peekskill NY) DiStefano Thomas H. (Bronxville NY), Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate.
  564. Khandros Igor Y. (Peekskill NY) DiStefano Thomas H. (Bronxville NY), Semiconductor chip assemblies with fan-in leads.
  565. Khandros Igor Y. (Peekskill NY) DiStefano Thomas H. (Bronxville NY), Semiconductor chip assemblies with fan-in leads.
  566. DiStefano Thomas H. (Los Gatos CA) Karavakis Gus (Coram NY) Kovac Zlata (Los Gatos CA) Mitchell Craig (San Jose CA), Semiconductor chip connection components with adhesives and methods for bonding to the chip.
  567. Lee James C. K. (Los Altos CA) Amdahl Gene M. (Atherton CA) Beck Richard L. (Cupertino CA) Quinn Robert F. (Cupertino CA) Sochor Jerzy R. (San Jose CA), Semiconductor chip interface.
  568. Burt Roy J. (Sunnyvale CA), Semiconductor chip mounting system.
  569. King Jerrold L. (Boise ID) Brooks Jerry M. (Caldwell ID), Semiconductor chip package.
  570. DiStefano, Thomas H.; Grube, Gary W.; Khandros, Igor Y.; Mathiew, Gaetan, Semiconductor connection components and method with releasable lead support.
  571. DiStefano Thomas H. (Bronxville NY) Grube Gary W. (Monroe NY) Khandros Igor Y. (Peekskill NY) Mathiew Gatan (Carmel NY), Semiconductor connection components and methods with releasable lead support.
  572. Sahara Kunizo (Tokyo JPX) Otsuka Kanji (Higashiyamato JPX) Ishida Hisashi (Higashiyamato JPX), Semiconductor device and process for producing the same.
  573. Otsuka Kanji (Higashiyamato JPX) Kato Masao (Hadano JPX) Kumagai Takashi (Isehara JPX) Usami Mitsuo (Ohme JPX) Kuroda Shigeo (Ohme JPX) Sahara Kunizo (Nishitama JPX) Yamada Takeo (Koganei JPX) Miyamo, Semiconductor device having leads for mounting to a surface of a printed circuit board.
  574. Satonaka Koichiro (Fuchu JA), Semiconductor device having multi-layer wiring structure with additional through-hole interconnection.
  575. Okumura Katsuya (Yokohama JPX), Semiconductor device having stacking structure.
  576. Hutchison Robert V. (Oceanside CA), Semiconductor device package having lead frame structure with integral spring contacts.
  577. Distefano Thomas H. (Bronxville NY) Khandros Igor Y. (Peekskill NY) Mathiew Gaetan (Carmel NY) Sweis Jason (Ossining NY) Grange John (Red Hook NY) Grube Gary W. (Monroe NY), Semiconductor inner lead bonding tool.
  578. Kishida Satoru (Itami JPX), Semiconductor integrated circuit device.
  579. Saito Tamio (Tokyo JPX) Yosihara Kunio (Kawasaki JPX), Semiconductor integrated circuit device.
  580. Takahashi Takahiko (Tokyo JPX) Itoh Funikazu (Fujisawa JPX) Shimase Akira (Yokohama JPX) Yamaguchi HIroshi (Fujisawa JPX) Hongo Mikio (Yokohama JPX) Haraichi Satoshi (Yokohama JPX), Semiconductor integrated circuit device and process for producing the same.
  581. Fukuta Masumi (Machida JPX) Narita Hisatoshi (Hino JPX), Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection.
  582. Hawkins George W. (Mesa AZ), Semiconductor package having leads that break-away from supports.
  583. Keryhuel Alain (Pavilly FRX) Meigne Christian (Barentin FRX), Semiconductor package with contact springs.
  584. Hebert David F. (Hayward CA), Semiconductor package with tape mounted die.
  585. Koenig Paul W. (Clyde NY), Semiconductor pellet assembly mounted on ceramic substrate.
  586. Yanof Arnold W. (Tempe AZ) Dauksher William (Mesa AZ), Semiconductor structure and method of manufacture.
  587. Isaac George L. (980 Kiely Blvd. #326 Santa Clara CA 95051) Miller Donald C. (1139 Blair Ave. Sunnyvale CA 94087) Ziegenhagen ; II Rodney S. (2905 Kilo Ave. San Jose CA 95124), Semiconductor test socket and contacts.
  588. Isaac George L. ; Miller Donald C. ; Ziegenhagen ; II Rodney Scott, Semiconductor test socket and contacts.
  589. Fujii Toshifumi (Kyoto JPX) Koine Masayoshi (Kyoto JPX), Semiconductor wafer testing apparatus using intermediate semiconductor wafer.
  590. Fogal Rich (Boise ID), Semiconductor wire bonding method.
  591. Ruf Alexander (Mainz DEX) Abraham Michael (Mainz DEX) Lacher Manfred (Mainz DEX) Zetterer Thomas (Schwabenheim DEX) Dietrich Thomas R. (Frankfurt DEX), Sensor head for use in atomic force microscopy and method for its production.
  592. Grube Gary W. (Monroe NY) Mathieu Gaetan (Carmel NY) Sweis Jason (Ossining NY) Grange John A. (Cupertino CA), Shaped lead structure and method.
  593. Fung Clifford D., Single-sided differential pressure sensor.
  594. Kubena Randall L. (Agoura CA) Atkinson Gary M. (Thousand Oaks CA), Single-wafer tunneling sensor and low-cost IC manufacturing method.
  595. Kurose Mitsukazu (Suwa JPX) Minowa Masahiro (Suwa JPX), Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip.
  596. Baba Masaharu (Yokohama JPX), Socket for baseless lamp.
  597. Murphy James V. (Warwick RI), Socket terminal positioning method and construction.
  598. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
  599. Schmidt Detlef W. (Schaumburg IL) Mussele Carl (Elgin IL) Moore Kevin D. (Schaumburg IL), Solder bump stretch device.
  600. Moore Kevin D. (Schaumburg IL) Stafford John W. (St. Charles IL) Walker Mauro (Lake Barrington IL), Solder bump transfer method.
  601. Beckham Keith F. (Newburgh NY) Kolman Anne E. (Wappingers Falls NY) McGuire Kathleen M. (Fishkill NY) Puttlitz Karl J. (Wappingers Falls NY) Quinones Horatio (Peekskill NY), Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and pr.
  602. Noschese Rocco (Wilton CT), Solder mounting of electrical contacts.
  603. Reid Lee R. (Plano TX), Solid state interconnection system for three dimensional integrated circuit structures.
  604. Matcovich Robert R. (King of Prussia PA) Matcovich Thomas J. (Maple Glen PA) Matcovich John J. (Woodside NY) Paist Kenneth W. (Philadelphia PA), Sports implement swing analyzer.
  605. Walker George F. (New York NY) Zingher Arthur (White Plains NY), Spring array connector.
  606. Reymond Welles K. (Waterbury CT), Spring biased tapered contact elements for electrical connectors and integrated circuit packages.
  607. O\Connor Robert J. (Greenfield IN), Spring contact structure.
  608. White William J. (Chelmsford MA) Ortolf James M. (Acton MA), Spring finger interconnect for IC chip carrier.
  609. Pommer Richard J. (El Toro CA) Chiechi John (Irvine CA), Spring grid array interconnection for active microelectronic elements.
  610. Cotues Paul W. (Yorktown Heights NY) Moskowitz Paul A. (Yorktown Heights NY) Murphy Philip (New Fairfield CT) Ritter Mark B. (Brookfield CT) Walker George F. (New York NY), Stepped electronic device package.
  611. Gooch Roland W. ; Wadsworth Mark V., Stress tolerant bolometer.
  612. Ueno Toshiaki,JPX ; Saito Mitsuchika,JPX, Structure for providing an electrical connection between circuit members.
  613. Joshi Kailash C. (Endwell NY) Spaight Ronald N. (Vestal NY), Studded chip attachment process.
  614. Selvin Gerald J. (Huntington Beach CA), Submersible pipe electrical cable assembly.
  615. Marks Robert (South Burlington VT) Phelps ; Jr. Douglas W. (Burlington VT) Ward William C. (Burlington VT), Substrate with multiple type connections.
  616. Kaeriyama Toshiyuki (Plano TX), Support posts for micro-mechanical devices.
  617. Hartman John E. (Painesville OH) Venaleck John T. (Madison OH), Surface mount compatible connector system with mechanical integrity.
  618. Grabbe Dimitry G. (Middletown PA) Korsunsky Iosif (Harrisburg PA) Ringler Daniel R. (Elizabethville PA), Surface mount electrical connector.
  619. Simpson John P. (Apalachin NY), Surface mounted array strain relief device.
  620. Hingorany, Premkumar, Surface mounted system for leaded semiconductor devices.
  621. Goodman David S. (Mission Viejo CA) Oliver Leland W. (Santa Ana CA), Surface mounting connector.
  622. Scheingold William S. (Palmyra PA) Youngfleish Frank C. (Harrisburg PA), Surface to surface connector.
  623. Fredrickson Toby Alan, System for expanding space provided by test computer to test multiple integrated circuits simultaneously.
  624. Higgins ; III Leo M. (Austin TX) McShane Michael B. (Austin TX), TAB tape translator for use with semiconductor devices.
  625. Niki Kenichi (Amagasaki JPX) Kokogawa Toru (Amagasaki JPX) Takasago Hayato (Amagasaki JPX), Tape carrier for assembling an IC chip on a substrate.
  626. Jamison John W. (Palm Springs CA) Allen Robert E. (Mission Viejo CA), Test connector for electrical devices.
  627. Evans Arthur (Brookfield Center CT), Test probe assembly for IC chips.
  628. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Rising Robert P. (Trumbull CT), Test probe assembly for testing integrated circuit devices.
  629. Feigenbaum Haim (Irvine CA) Szalay John S. (Corona Del Mar CA) Woith Blake F. (Orange CA), Test probe for panel having an overlying protective member adjacent panel contacts.
  630. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
  631. Congleton Helen (Huntington Beach CA) Slaton Carol L. (Irvine CA) Koudounaris Angelo (Hermosa Beach CA) Smith Gerald B. (Huntington Beach CA) Soto Vicente (Riverside CA), Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication.
  632. Rostoker Michael D. (San Jose CA) Dangelo Carlos (San Jose CA) Koford James (San Jose CA), Testing and exercising individual, unsingulated dies on a wafer.
  633. Nakajima Hisashi (Yamanashi-ken JPX), Testing apparatus and connection method for the testing apparatus.
  634. Arnaudov Konstantin (Wertheim-Bettingen DEX) Prokopp Manfred (Wertheim DEX), Testing device for testing electrical or electronic test specimens.
  635. Hierold Christofer (Munich DEX), Thermal sensor/actuator in semiconductor material.
  636. Hierold Christofer,DEX, Thermal sensor/actuator in semiconductor material.
  637. Field Leslie A. (Portola Valley CA) Ruby Richard C. (Menlo Park CA), Thermally actuated micromachined microwave switch.
  638. Estes Howard S. (Houston TX), Thermally reactive lead assembly and method for making same.
  639. Fister Julius C. (Hamden CT) Breedis John F. (Trumbull CT), Thermosonic palladium lead wire bonding.
  640. Wilby John L. (Ottawa CAX), Thick film packages with common wafer aperture placement.
  641. Fujitsu Takao (Kanagawa JPX), Thin semiconductor integrated circuit device assembly.
  642. Frew Dean L. (Garland TX) Kressley Mark A. (Richardson TX) Wilson Arthur M. (Richardson TX) Miller Juanita G. (Richardson TX) Hecker ; Jr. Philip E. (Garland TX) Drumm James (Crystal Lake IL) Johnson, Three dimensional assembly of integrated circuit chips.
  643. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
  644. Chiu Anthony M. (Richardson TX), Three dimensional multi-chip module with integral heat sink.
  645. Cray Seymour R. (Chippewa Falls WI) Krajewski Nicholas J. (Elk Mound WI), Three dimensionally interconnected module assembly.
  646. Park Kwanhum,KRX ; Gho Youngho,KRX ; Go Jeungsang,KRX ; Kwak Byungman,KRX, Threshold microswitch and a manufacturing method thereof.
  647. Reed Michael L. (Pittsburgh PA) Weiss Lee E. (Pittsburgh PA), Tissue-connective devices with micromechanical barbs.
  648. Freyman Bruce J. (N. Lauderdale FL) Dorinski Dale (Coral Springs FL) Shurboff John (Coral Springs FL), Ultra high density pad array chip carrier.
  649. Crane ; Jr. Stanford W. (Cincinnati OH), Ultra-high density electrical interconnect system.
  650. Aigo Seiichiro (3-15-13 Negishi ; Daito-Ku Tokyo JPX), Unitary probe assembly.
  651. Everett Stephen M. (Livermore CA), Universal circuit board test fixture.
  652. Prater Craig (Goleta CA) Albrecht Thomas B. (San Jose CA), Universal, microfabricated probe for scanning probe microscopes.
  653. Agarwala Birendra N. (Wappingers Falls NY) Palmateer Paul H. (Wappingers Falls NY) Shih Da-Yuan (Poughkeepsie NY), Use of tapered head pin design to improve the stress distribution in the braze joint.
  654. Schuck David B. (Escondido CA), VLSI Packaging system.
  655. Noschese Rocco J. (Wilton CT), Vertical action contact spring.
  656. Chiu Anthony M. (Richardson TX), Vertical lead-on-chip package.
  657. Jones Gary W. (Raleigh NC) Sune Ching-Tzong (Raleigh NC), Vertical microelectronic field emission devices.
  658. Jones Gary W. (Raleigh NC) Sune Ching-Tzong (Raleigh NC), Vertical microelectronic field emission devices including elongate vertical pillars having resistive bottom portions.
  659. Aoude Farid Y. (Wappingers NY) Cooper Emanuel I. (Riverdale NY) Duncombe Peter R. (Peekskill NY) Farooq Shaji (Hopewell Junction NY) Giess Edward A. (Purdys Station NY) Kim Young-Ho (Seoul NY KRX) Kn, Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates.
  660. Sato Mitsuya (Yokohama JPX), Wafer prober.
  661. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
  662. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.
  663. Gliga Alexandru S. (San Jose CA), Weakening wire supplied through a wire bonder.
  664. Correy Thomas B. (Richland WA), Welding arc initiator.
  665. Fujimoto Hitoshi (Itami JPX) Masuda Hisao (Itami JPX), Wire bonding apparatus.
  666. Okumura Hiroshi (Kyoto JPX), Wire bonding apparatus and method.
  667. Haji Hiroshi (Chikushino JPX), Wire bonding apparatus and wire bonding method.
  668. Shimizu Yasuhiko (Yokohama JPX), Wire bonding method.
  669. Terakado Yoshimitsu (Tokyo JPX) Sugiura Kazuo (Tokyo JPX) Mochida Tooru (Tokyo JPX) Mii Tatsunari (Tokyo JPX), Wire bonding method.
  670. Terakado Yoshimitsu (Tokyo) Yamazaki Nobuto (Tokyo JPX), Wire bonding method.
  671. Kobayashi Hiroaki (Yokohama JPX), Wire bonding method and device.
  672. Okikawa Susumu (Ohme JPX) Tanimoto Michio (Kokubunji JPX), Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method.
  673. Fan Long-Sheng ; Fontana ; Jr. Robert Edward ; Furuhata Tomotake,JPX ; Reiley Timothy Clark ; Zappe Hans Helmut, Wobble motor microactuator for fine positioning and disk drive incorporating the microactuator.
  674. Adams Victor J. (Tempe AZ) Gutteridge Ronald J. (Paradise Valley AZ), .

이 특허를 인용한 특허 (14)

  1. Cortez, Adrian, Contactor for reducing ESD in integrated circuit testing.
  2. Jeon, Myoungsoo; Taylor, Attalee Snarr; Hornung, Craig Warren, Electrical component having an array of electrical contacts.
  3. Park, Chan Woo; Koo, Jae Bon; Lim, Sang Chul; Oh, Ji-Young; Jung, Soon-Won, Electronic circuit and method of fabricating the same.
  4. Simonin, Stephen Paul, Ground fault circuit interrupter (GFCI) system and method.
  5. Simonin, Stephen Paul, Ground fault circuit interrupter (GFCI) system and method.
  6. Lewinnek, David Walter; Sinsheimer, Roger Allen; Valiente, Luis Antonio; DiPalo, Craig Anthony, Interconnect for transmitting signals between a device and a tester.
  7. Huang, Herb He, MEMS device and method of fabricating the same.
  8. Giannuzzi, Lucille A., Method for ex-situ lift-out specimen preparation.
  9. Veeramani, Arun S.; Jensen, Heath A.; Frodis, Uri; Wiita, Christopher G.; Lockard, Michael S.; Boguslavsky, Irina; Lembrikov, Pavel; Smalley, Dennis R.; Chen, Richard T., Methods of forming parts using laser machining.
  10. Shin, Jong Cheon; Ha, Dong Ho, Socket for semiconductor chip test and method of manufacturing the same.
  11. Sinsheimer, Roger Allen, Structure for transmitting signals in an application space between a device under test and test electronics.
  12. Hartenstein, Abraham, Surface mount antenna contacts.
  13. Suto, Anthony J.; Wrinn, Joseph Francis; Toscano, John P.; Arena, John Joseph, Test fixture.
  14. Huang, Chien-Hsin; Chen, Li-Che; Wang, Ming-I; Lan, Bang-Chiang; Wu, Hui-Min; Su, Tzung-I, Wafer level package of MEMS microphone and manufacturing method thereof.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로