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Maleimide compositions and methods for use thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01B-001/20
출원번호 US-0786441 (2007-04-12)
등록번호 US8043534 (2011-10-12)
발명자 / 주소
  • Dershem, Stephen
출원인 / 주소
  • Designer Molecules, Inc.
대리인 / 주소
    The Law Office of Jane K. Babin, Professional Corporation
인용정보 피인용 횟수 : 9  인용 특허 : 96

초록 ▼

The invention is based on the discovery that compositions containing certain maleimide compounds and aromatic diene compounds are useful as thermosetting resins for the electronic packaging industry. The invention compositions described herein can be cured in a variety of ways, with or without a cat

대표청구항

What is claimed is: 1. A composition comprising an adhesive material comprising:(a) a first compound, wherein the first compound is a maleimide, wherein the maleimide has the structure:

이 특허에 인용된 특허 (96)

  1. Dershem Stephen M. (San Diego CA) Osuna ; Jr. Jose A. (San Diego CA), Adhesive bonding composition with bond line limiting spacer system.
    상세보기
  2. Dershem, Stephen M., Adhesive composition of phenol-functional polyamides.
    상세보기
  3. Song Zhiqiang (Memphis TN), Aqueous two-part isocyanate-free curable, polyurethane resin systems.
    상세보기
  4. Forray,Deborah Derfelt; Liu,Puwei; Santos,Benedicto delos, B-stageable die attach adhesives.
    상세보기
  5. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.
    상세보기
  6. Dershem, Stephen M.; Liu, Puwei; Mizori, Farhad G., Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof.
    상세보기
  7. Dao Buu,AUX ; Morton Trevor,AUX, Bisallyloxyimides.
    상세보기
  8. Petit Christian J. (Chicopee MA), Bisimide compositions.
    상세보기
  9. Morton Trevor C. (Hampton AUX) Hodgkin Jonathan H. (Burwood AUX) Eibl Robert (Little River AUX), Bismaleimide compounds.
    상세보기
  10. Dershem Stephen M. ; Patterson Dennis B. ; Osuna ; Jr. Jose A., Bismaleimide-divinyl adhesive compositions and uses therefor.
    상세보기
  11. Dershem Stephen M. (San Diego CA) Derfelt Deborah L. (San Diego CA), Bleed resistant cyanate ester-containing compositions.
    상세보기
  12. Dershem Stephen M. ; Derfelt Deborah L., Bleed resistant cyanate ester-containing compositions.
    상세보기
  13. Dershem Stephen M. ; Derfelt Deborah L., Bleed resistant cyanate ester-containing compositions.
    상세보기
  14. Stevens James C. ; Timmers Francis J. ; Guest Martin J. ; Gathers John J. ; Cheung Yunwa W. ; Chum Pak-Wing S. ; Park Chung P.,DEX ; Clingerman George P. ; Sikkema Kevin D.,NLX, Blends of substantially random interpolymers with vinyl or vinylidene aromatic polymers.
    상세보기
  15. Okazaki, Eiichi; Kaai, Michihiro, Composition.
    상세보기
  16. Corley Larry S. (Houston TX), Composition comprising bisimide and triene.
    상세보기
  17. Mori ; Kogoro ; Izawa ; Taro ; Mizuno ; Yoshifumi ; Matsui ; Sadayoshi, Composition for inhibiting adhesion of shellfish and algae.
    상세보기
  18. Tong Quinn K. ; Ma Bodan ; Xiao Chaodong, Compositions for use in the fabrication of circuit components and printed wire boards.
    상세보기
  19. Musa Osama M., Compounds with electron donor and electron acceptor functionality.
    상세보기
  20. Musa, Osama M.; Herr, Donald E.; Nikolic, Nikola A., Curable electron donor compounds.
    상세보기
  21. Zahir Abdul-Cader (Oberwil CHX) Wyler Siegfried (Dornach CHX), Curable mixtures based on maleimides and propenyl-substituted phenols, and the use thereof.
    상세보기
  22. Kramer Andreas (Ddingen CHX), Curable mixtures containing a bismaleimide and a propenyl compound.
    상세보기
  23. Herr Donald ; Schultz Rose Ann ; Xu Pingyong ; McLaughlin Scott R., Die attach adhesives for use in microelectronic devices.
    상세보기
  24. Bonneau, Mark R.; Shin, Yun K.; Hoang, Gina; Sobczak, Martin, Die attach adhesives with epoxy compound or resin having allyl or vinyl groups.
    상세보기
  25. Musa, Osama M.; Herr, Donald E., Die attach adhesives with vinyl ether and carbamate or urea functionality.
    상세보기
  26. Dershem Stephen M. (San Diego CA) Derfelt Deborah L. (San Diego CA) Patterson Dennis B. (La Jolla CA), Die-attach composition comprising polycyanate ester monomer.
    상세보기
  27. Donald E. Herr, Dye attach adhesives for use in microelectronic devices.
    상세보기
  28. Dershem Stephen M., Epoxy-containing die-attach compositions.
    상세보기
  29. Sheppard Clyde H. (Bellevue WA) Lubowitz Hyman R. (Rolling Hills Estates CA), Extended end cap monomer for making advanced composites.
    상세보기
  30. Boyd Jack D. (Westminster CA) Repecka Linas N. (Lakewood CA), Extremely tough thermosetting bismaleimide resin systems.
    상세보기
  31. Yagi Kazuo (Ohtake JPX) Mantoku Hitoshi (Iwakuni JPX), Fiber-reinforced polymer molded body.
    상세보기
  32. Liu, Puwei; Dershem, Stephen M.; Yang, Kang; Albino, Carolyn C., Film adhesives containing maleimide compounds and methods for use thereof.
    상세보기
  33. Liu,Puwei; Dershem,Stephen M.; Neff,Benjamin; Villegas,Maria, Free radically polymerizable coupling agents.
    상세보기
  34. Dershem,Stephen M.; Mizori,Farhad G., Free-radical curable polyesters and methods for use thereof.
    상세보기
  35. Dershem Stephen M. (San Diego CA), Freeze resistant die-attach compositions.
    상세보기
  36. Reck Bernd (Beindersheim DEX) Laschober Rita A. (Ludwigshafen DEX) Gerth Dale (Ludwigshafen CA DEX) Boyd Jack D. (Westminster CA), Heat-curable bismaleimide molding compositions.
    상세보기
  37. Eisenbarth Philipp (Bad Duerkheim DEX) Linden Gerd (Heidelberg DEX) Altstaedt Volker (Gernsheim DEX) Peter Roland (Mutterstadt DEX), Heat-curable bismaleimide-alkenyl heterocyclic molding material.
    상세보기
  38. Dershem, Stephen M.; Forrestal, Kevin J.; Liu, Puwei, Heterobifunctional monomers and uses therefor.
    상세보기
  39. Stephen M. Dershem ; Kevin J. Forrestal, Heterobifunctional monomers and uses therefor.
    상세보기
  40. Dershem Stephen M. ; Osuna ; Jr. Jose A., Hydrophobic vinyl monomers, formulations containing same, and uses therefor.
    상세보기
  41. Stephen M. Dershem ; Frank G. Mizori, Hydrophobic, high Tg cycloaliphatic epoxy resins.
    상세보기
  42. Mizori,Farhad G.; Dershem,Stephen M., Imide-extended liquid bismaleimide resin.
    상세보기
  43. Mizori,Farhad G.; Dershem,Stephen M., Imide-linked maleimide and polymaleimide compounds.
    상세보기
  44. Tang Jinsheng (Zhonghua Automobile Manufacturing Corporation Shenzhen ; Guangdong Province CNX), Integral car body made of composite material.
    상세보기
  45. Dershem, Stephen M.; Yang, Kang; Liu, Puwei, Low shrinkage thermosetting resin compositions and methods of use therefor.
    상세보기
  46. Dershem, Stephen M.; Yang, Kang, Low shrinkage thermosetting resin compositions and methods of use thereof.
    상세보기
  47. Dershem Stephen M. ; Osuna Jose A., Low viscosity acrylate monomers formulations containing same and uses therefor.
    상세보기
  48. Dershem,Stephen M; Patterson,Dennis B; Osuna, Jr.,Jose A., Maleimide compounds in liquid form.
    상세보기
  49. Husson ; Jr. Frank D. ; Neff Benjamin ; Dershem Stephen M., Maleimide containing formulations and uses therefor.
    상세보기
  50. Takamizawa ; Minoru ; Yamamoto ; Yasushi ; Inoue ; Yoshio ; Noshiro ; At sumi ; Fujii ; Hitoshi, Maleimido group-containing organosilicon compounds.
    상세보기
  51. Dershem Stephen M., Method for isomerization of arylpropargyl ether monomers and uses therefor.
    상세보기
  52. Mizori Farhad G. ; Dershem Stephen M., Method for the preparation of maleimides.
    상세보기
  53. Corley Larry Steven, Modified bisimide compositions.
    상세보기
  54. Singh Balwant (Stamford CT) Tynik Robert J. (Stamford CT), N-(substituted) maleimides and compositions incorporating the same.
    상세보기
  55. Lichtenhan, Joseph D.; Schwab, Joseph J.; Lee, Andre; Phillips, Shawn, Nanostructured chemicals as alloying agents in polymers.
    상세보기
  56. Dershem Stephen M. (Santee CA) Weaver Richard R. (Poway CA), Non-ionic, water washable soldering paste.
    상세보기
  57. Ma Bodan ; Tong Quinn K., Package encapsulant compositions for use in electronic devices.
    상세보기
  58. Dershem Stephen M. ; Forray Deborah D., Perfluorinated hydrocarbon polymer-filled adhesive formulations and uses therefor.
    상세보기
  59. Waterson Pamela J. ; Naiini Ahmad ; Hsu Steve Lien-Chung,TWX ; Weber William D., Photosensitive resin compositions.
    상세보기
  60. Kodama,Sai; Murata,Shigeru; Inayama,Toshihiro; Niimi,Tatsuo, Polyalkenyl ether resin.
    상세보기
  61. Benicewicz Brian C. (Los Alamos NM) Hoyt Andrea E. (Los Alamos NM), Polyamide thermosets.
    상세보기
  62. Goto Hirofumi,JPX ; Yamada Takako,JPX ; Ito Nobuyuki,JPX, Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion.
    상세보기
  63. Charles E. Hoyle ; Shan Christopher Clark ; E. Sonny Jonsson SE, Polymerization processes using aliphatic maleimides.
    상세보기
  64. Hoyle Charles E. ; Clark Shan Christopher ; Jonsson E. Sonny,SEX, Polymerization processes using aliphatic maleimides.
    상세보기
  65. Hoyle, Charles E.; Clark, Shan Christopher; J?nsson, E. Sonny, Polymerization processes using aliphatic maleimides.
    상세보기
  66. Lichtenhan Joseph D. (Palmdale CA) Vu Ngo Q. (San Diego CA) Gilman Jeffrey W. (Landcaster CA) Feher Frank J. (Costa Mesa CA), Polymers containing alternating silsesquioxane and bridging group segments and process for their preparation.
    상세보기
  67. Locatelli Jean-Louis (Vienne FRX) Macabrey Louis (Mitry-le Neuf FRX), Polypropylene/glass fiber/imide/thermoplastic elastomer based compositions.
    상세보기
  68. Okada Takashi (Yokkaichi JPX) Aoyama Takamichi (Yokkaichi JPX) Mizuno Shoichi (Yokkaichi JPX) Akatsuka Akihiro (Yokkaichi JPX) Matsuoka Kiyonari (Mie JPX), Process for preparation of N-substituted maleimides.
    상세보기
  69. Lichtenhan Joseph D. (Palmdale CA) Gilman Jeffrey W. (Landcaster CA) Feher Frank J. (Costa Mesa CA), Process for preparation of polyhedral oligomeric silsesquioxanes and systhesis of polymers containing polyhedral oligome.
    상세보기
  70. Patrick Terence McGrail GB; Jeffrey Thomas Carter GB, Process for preparing polyarlethers.
    상세보기
  71. Osuna ; Jr. Jose A. ; Dershem Stephen M., Propargyl ether-containing compositions useful for underfill applications.
    상세보기
  72. Fan Mingxin ; Ceska Gary W. ; Horgan James ; Trainer Nicholas, Radiation curable compositions comprising an unsaturated polyester and a compound having two to six-propenyl ether groups.
    상세보기
  73. Touky, Medhat A.; McCormick, Gail; Marshall, Jacqueline M.; Blakeney, Andrew J., Radiation sensitive compositions containing image quality and profile enhancement additives.
    상세보기
  74. Dershem, Stephen M.; Forrestal, Kevin J., Radical polymerizable compositions containing polycyclic olefins.
    상세보기
  75. Dershem Stephen M. (San Diego CA), Resinless pseudoplastic bonding compositions.
    상세보기
  76. Dershem Stephen M. (San Diego CA), Resinless pseudoplastic bonding compositions.
    상세보기
  77. Meador, Mary Ann B.; Kinder, James D., Rod-coil block polyimide copolymers.
    상세보기
  78. Marien Bruce A. (Woodbridge CT) Wilbourn Keith O. (Manchester CT), Selected poly(dianhydride) compounds terminated with reactive end groups.
    상세보기
  79. Dershem Stephen M. (Santee CA), Silver-glass die attach paste with reduced resin.
    상세보기
  80. Kramer Andreas (Ddingen CHX) Wolf Jean-Pierre (Courtaman CHX) Brunner Rudolf (Belfaux CHX), Soluable polyimides.
    상세보기
  81. Dershem Stephen M. (San Diego CA) Patterson Dennis B. (La Jolla CA) Derfelt Deborah L. (San Diego CA), Solvent free die-attach compositions.
    상세보기
  82. De, Binod B.; Malik, Sanjay; Spaziano, Gregory; Biafore, John Joseph; Foster, Patrick; Slater, Sidney George; Steinhausler, Thomas; Blakeney, Andrew J., Thermally cured underlayer for lithographic application.
    상세보기
  83. Nikolic,Nikola A.; Zhang,Ruzhi; Musa,Osama M.; Jin,Hwail; Wu,Bing; Shenfield,David, Thermoset adhesive films.
    상세보기
  84. Chu Sung G. (Wilmington DE) Jabloner Harold (Wilmington DE) Nguyen Tuyen T. (Wilmington DE), Thermosettable resin compositions.
    상세보기
  85. Dershem Stephen M. ; Patterson Dennis B. ; Osuna ; Jr. Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  86. Dershem, Stephen M.; Liu, Puwei, Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  87. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  88. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  89. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  90. Dershem, Stephen M.; Patterson, Dennis B.; Osuna, Jr., Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  91. Dershem,Stephen M.; Patterson,Dennis B.; Osuna, Jr.,Jose A., Thermosetting resin compositions containing maleimide and/or vinyl compounds.
    상세보기
  92. Frihart Charles R. (Lawrenceville NJ), Three component aminoamide acrylate resin compositions.
    상세보기
  93. Malhotra Vinay (Tempe AZ) Almen Gregory R. (Mesa AZ) Hushower Mary (Tempe AZ), Toughened cocontinuous resin system.
    상세보기
  94. Boyd Jack D. (Westminster CA), Toughened thermosetting structural materials.
    상세보기
  95. Ma Bodan ; Tong Quinn K., Underfill encapsulant compositions for use in electronic devices.
    상세보기
  96. Dershem Stephen M. (Santee CA) Weaver Richard R. (Poway CA), Water washable soldering paste.
    상세보기

이 특허를 인용한 특허 (9)

  1. Dershem, Stephen M, Amide-extended crosslinking compounds and methods for use thereof.
    상세보기
  2. Dershem, Stephen M.; Mizori, Farhad G., Amide-extended crosslinking compounds and methods for use thereof.
    상세보기
  3. Dershem, Stephen M, Anti-bleed compounds, compositions and methods for use thereof.
    상세보기
  4. Mizori, Farhad G; Dershem, Stephen M, Curable composition with rubber-like properties.
    상세보기
  5. Dershem, Stephen M, Curatives for epoxy compositions.
    상세보기
  6. Mizori, Farhad G; Dershem, Stephen M, Imide-linked maleimide and polymaleimide compounds.
    상세보기
  7. Dershem, Stephen M, Maleimide-functional monomers in amorphous form.
    상세보기
  8. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.
    상세보기
  9. Dershem, Stephen M; Mizori, Farhad G; Huneke, James T, Materials and methods for stress reduction in semiconductor wafer passivation layers.
    상세보기

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