초록 ▼

A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circ

A soldering apparatus including a vessel containing a molten solder, a casing defining therewithin a soldering chamber in which a flat overflowing wave of the molten solder is formed, a conveyor physically integrated with the casing for movement therewith and operable for transferring a printed circuit board through the soldering chamber, actuators and for vertically moving the casing, inert gas feeders for feeding an inert gas to the soldering chamber, and a controller for controlling the operation of the actuators and, so that the printed circuit board is contacted with the surface of the flat overflowing wave in an atmosphere of the inert gas during its passage through the soldering chamber.

대표청구항 ▼

The invention claimed is: 1. An apparatus for soldering a flat work piece having a lower surface to be soldered, comprising:a solder vessel containing a molten solder;a solder-overflowing pot disposed in said solder vessel and having a discharge opening above a surface level of the molten solder, sa

The invention claimed is: 1. An apparatus for soldering a flat work piece having a lower surface to be soldered, comprising:a solder vessel containing a molten solder;a solder-overflowing pot disposed in said solder vessel and having a discharge opening above a surface level of the molten solder, said solder-overflowing pot being configured to form a flat overflowing wave of the molten solder above said discharge opening, said discharge opening having a dimension greater than that of the work piece so that entire lower surface of the work piece can simultaneously contact with a surface of said flat overflowing wave;a casing extending above said solder vessel from a rear end to a fore end and defining therewithin a soldering chamber, said casing having an inlet opening at said rear end to permit the work piece to enter said soldering chamber therethrough and an outlet opening at said fore end to permit the work piece to exit said soldering chamber therethrough, said casing having a lower opening facing said discharge opening of said solder-overflowing pot, said casing having a skirt extending contiguously downward from a whole marginal edge of said lower opening to surround said solder-overflowing pot, said skirt cooperating with said molten solder-containing vessel to seal said soldering chamber such that the soldering chamber is permitted to be in gas communication with an outside atmosphere only through said inlet and outlet openings;a plurality of baffle plates, arranged in respective sections proximate to the inlet opening and the outlet opening, forming respective labyrinth sealed sections;a conveyor disposed within said soldering chamber and physically integrated with said casing for movement therewith, said conveyor being operable for transferring the work piece between said inlet opening and said outlet opening;one or more inert gas feeders for feeding an inert gas to said soldering chamber;drive means operable to vertically move said integrated conveyor and casing between an upper position in which the work piece can be received by said conveyor through said inlet opening and can be discharged from said conveyor through said outlet opening and a lower position in which the work piece can contact with the surface of said flat overflowing wave during the positioning thereof above said discharge opening;a controller for controlling the operation of said drive means and the operation of said conveyor so that the work piece is received through said inlet opening by said conveyor in said upper position, contacted with the surface of said flat overflowing wave during the positioning thereof above said discharge opening by said conveyor in said lower position and discharged through said outlet opening from said soldering chamber by said conveyor in said upper position; anda volume variable chamber in gas communication with said soldering chamber, a volume of said volume valuable chamber being variable such that a total volume of said soldering chamber and said volume valuable chamber is maintained substantially unchanged when the volume of said soldering chamber is changed in response to the vertical movement of said casing.