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Glass package that is hermetically sealed with a frit and method of fabrication 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-033/00
출원번호 US-0521888 (2006-09-15)
등록번호 US8063560 (2011-11-07)
발명자 / 주소
  • Aitken, Bruce G.
  • Carberry, Joel P.
  • DeMartino, Steven E.
  • Hagy, Henry E.
  • Lamberson, Lisa A.
  • Miller, II, Richard J.
  • Morena, Robert
  • Schroeder, III, Joseph F.
  • Streltsov, Alexander
  • Widjaja, Sujanto
출원인 / 주소
  • Corning Incorporated
대리인 / 주소
    Kevin M., Able
인용정보 피인용 횟수 : 21  인용 특허 : 61

초록

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depos

대표청구항

What is claimed is: 1. A frit comprising a non-lead based glass doped with at least one transition metal, and a coefficient of thermal expansion (CTE) lowering filler.

이 특허에 인용된 특허 (61)

  1. Huang Rong-Ting ; Lee Hsing-Chung ; Shi Song Q., Active matrix OED array.
  2. Shi Song Q. ; So Franky ; Lee Hsing-Chung, Active matrix OED array with improved OED cathode.
  3. Liu, Yachin; Ghosh, Amalkumar P.; Zimmerman, Steven M.; Heller, Christian M., Apparatus and method for solder-sealing an active matrix organic light emitting diode.
  4. Van Assche Paul J. (Eindhoven NLX), Bodies composed of at least two parts, sealing glass and method for bonding parts.
  5. Sugawara, Tsunehiko; Segawa, Yutaka; Tanabe, Ryuichi; Ichikura, Eiji, Color cathode ray tube and glass frit for color cathode ray tubes.
  6. Duggal, Anil Raj, Color tunable organic electroluminescent light source.
  7. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.
  8. William L. Tonar ; Jeffrey A. Forgette ; John S. Anderson ; Jon H. Bechtel ; John W. Carter ; Joseph S. Stam, Electrochromic rearview mirror incorporating a third surface metal reflector and a display/signal light.
  9. Hueschen Mark R., Electroluminescent device and fabrication method for a light detection system.
  10. Jones Gary W., Emissive display using organic light emitting diodes.
  11. Haskal Eliav,CHX ; Karg Siegfried,DEX ; Salem Jesse Richard ; Scott John Campbell, Encapsulated organic light emitting device.
  12. Pichler, Karl; Lacey, David, Encapsulation for organic electronic devices.
  13. Biebuyck Hans,CHX ; Haskal Eliav,CHX, Encapsulation of organic light emitting devices using Siloxane or Siloxane derivatives.
  14. Biebuyck Hans,CHX ; Haskal Eliav,CHX, Encapsulation of organic light emitting devices using siloxane or siloxane derivatives.
  15. Affinito John D., Environmental barrier material for organic light emitting device and method of making.
  16. James J. Andre ; Steven A. Van Slyke, Forming preformed images in organic electroluminescent devices.
  17. Francis Gaylord L. (Painted Post NY), Fusion sealing materials.
  18. Domi, Shinjiro; Sakaguchi, Koichi; Misonou, Masao, Glass panel and production method therefor.
  19. DuBois Richard (North Caldwell NJ), Glass-to-glass sealing method with conductive layer.
  20. Hudecek Carl J. ; Peer Joseph V. ; Bobinski Jon G., High strength sealing glass.
  21. Michael L. Boroson ; John Schmittendorf ; Peter G. Bessey ; Jeffrey P. Serbicki, Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.
  22. Shi Song Q. (Phoenix AZ) Lee Hsing-Chung (Calabasas CA) Wei Cheng-Ping (Gilbert AZ), Inverted oleds on hard plastic substrate.
  23. Yoshida,Masahiro; Hatate,Yasuo; Sarata,Tsugumitsu; Uemura,Yoshimitsu; Honda,Tomoyuki; Fukunaga,Hiroyuki; Iwashita,Masahiro, Lead-free glass material for use in sealing and, sealed article and method for sealing using the same.
  24. Nagahara Shigehiro (Yokohama JA) Ichimura Nobuyoshi (Chigasaki JA) Suzuki Yoshiro (Tokyo JA), Liquid crystal cells.
  25. Kadowaki Akira (Mobara JPX) Itoh Shigeo (Mobara JPX) Kogure Youich (Mobara JPX) Tonegawa Takeshi (Mobara JPX), Method for sealedly forming envelope.
  26. Matthias Klockhaus DE; Dieter Jestel DE, Method for welding the surfaces of materials.
  27. Shieh Chan-Long (Paradise Valley AZ) Lee Hsing-Chung (Calabasas CA), Method of fabricating organic LED matrices.
  28. Islam Safidul (Richardson TX), Method of hermetically encapsulating a semiconductor device by laser irradiation.
  29. Komatsu Hiroshi (Suwa JPX), Method of manufacturing a microelectronic vacuum device.
  30. Daniel Hani S. (Rockville MD) Moore Douglas R. (Severna Park MD), Method of securing optical fiber components, devices and fibers to the same or to mounting fixtures.
  31. Shindo, Ayako; Goto, Naoyuki, Negative thermal expansion glass ceramic.
  32. Yamaguchi,Ayako; Goto,Naoyuki, Negative thermal expansion glass ceramic.
  33. Shindo, Ayako; Goto, Naoyuki, Negative thermal expansion glass ceramic and method for producing the same.
  34. Francis Gaylord L. (Painted Post NY) Morena Robert (Caton NY), Non-lead sealing glasses.
  35. Tsai, Rung-Ywan; Chao, Ching-Ian; Chang, Chia-Shy; Hua, Mu-Yi, Organic electro-luminescent device with first and second composite layers.
  36. Gyotoku Akira,JPX ; Iwanaga Hideaki,JPX ; Hara Shintaro,JPX ; Komatsu Takahiro,JPX ; Sakanoue Kei,JPX, Organic electroluminescence element, its manufacturing method, and display device using organic electroluminescence element.
  37. Roitman, Daniel B.; Hargreaves, John S.; Antoniadis, Homer; Seaward, Karen L., Organic electroluminescent device.
  38. Rogers Stephen P. ; So Franky ; Shi Song Q. ; Webb Brian A., Organic electroluminescent device hermetic encapsulation package.
  39. Rogers Stephen P., Organic electroluminescent device hermetic encapsulation package and method of fabrication.
  40. Roitman Daniel B. ; Sheats James R., Organic electroluminescent device with full color characteristics.
  41. Harvey ; III Thomas B. ; So Franky, Passivation of organic devices.
  42. Jones Gary W. ; Ghosh Amalkumar P., Passive matrix OLED display.
  43. Francel Josef (Toledo OH) King James E. (Toledo OH) Woulbroun John M. (Grand Rapids OH), PbO-containing sealing glass with higher oxide of a cation to avoid PbO reduction.
  44. Takamatsu, Yasushi; Nagata, Kei; Ota, Masahiro; Mizuta, Yasushi; Kikuta, Yoshio, Photocurable resin composition for sealing material and method of sealing.
  45. Anil Raj Duggal, Plastic substrates with improved barrier properties for devices sensitive to water and/or oxygen, such as organic electroluminescent devices.
  46. Langer, Alfred; Messner, Ekkehard, Process for encapsulating a component made of organic semiconductors.
  47. Shibuya Yoshimichi (Mobara JPX) Kawamura Hiromitsu (Mobara JPX) Kando Yasuhiko (Mobara JPX) Koyama Masaharu (Mobara JPX), Process for the manufacture of liquid crystal display element.
  48. Bonk John A. (Big Flats NY) Malmendier Joseph W. (Corning NY), Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite.
  49. Finkelstein Leo (San Francisco CA) Dumesnil Maurice E. (Los Altos Hills CA) Tetschlag Richard R. (San Jose CA), Sealing glass compositions.
  50. Canale,Joseph E.; Cooch,Stephen L.; Haynes,William L.; Tuttle, II,Clayton L., Sealing lighting device component assembly with solder glass preform by using infrared radiation.
  51. Cornelius Lauren K. (Painted Post NY) Francis Gaylord L. (Painted Post NY) Tick Paul A. (Corning NY), Sealing materials and glasses.
  52. Dennis Lee Matthies ; Zilan Shen ; Roger Green Stewart ; James Harold Atherton, Sealing of large area display structures.
  53. Biebuyck Hans,CHX ; Haskal Eliav,CHX, Siloxane and siloxane derivatives as encapsulants for organic light emitting devices.
  54. Hans Biebuyck CH; Eliav Haskal CH, Siloxane and siloxane derivatives as encapsulants for organic light emitting devices.
  55. Francel Josef (Toledo OH) Palermo Robert F. (Waterville OH), Solder glass with refractory filler.
  56. Frankel Robert D., Supports incorporating vertical cavity emitting lasers and tracking apparatus for use in combinatorial synthesis.
  57. Paul Wickboldt ; Albert R. Ellingboe ; Steven D. Theiss ; Patrick M. Smith, Thick adherent dielectric films on plastic substrates and method for depositing same.
  58. Takami Akio (Aichi JPX) Kondo Kazuo (Aichi JPX), Tin oxide, titanium oxide and/or zirconium oxide coated b 상세보기
  • Sheats James R. ; Hueschen Mark R. ; Seaward Karen L. ; Roitman Daniel B. ; Briggs George Andrew Davidson,GBX, Transparent, flexible permeability barrier for organic electroluminescent devices.
  • Krupetsky, Dmitriy; Schmid, Anthony P.; Ludwig, Paul N., Tuned sealing material for sealing of a flat panel display.
  • Tracy C. Edwin (Golden CO) Benson David K. (Golden CO), Welding/sealing glass-enclosed space in a vacuum.
  • 이 특허를 인용한 특허 (21)

    1. Drake, Melinda Ann; Morena, Robert Michael, Antimony-free glass, antimony-free frit and a glass package that is hermetically sealed with the frit.
    2. Chang, Wei-Chih; Hsiao, Chih-Hung; Chen, Hsien-Hung, Display panel and sealing process thereof.
    3. Bueno, Manuel Kenneth; Schiefer, Eugene Carl, Hermetically sealed boroscope probe tip.
    4. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Laser welding transparent glass sheets using low melting glass or thin absorbing films.
    5. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Laser welding transparent glass sheets using low melting glass or thin absorbing films.
    6. Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device.
    7. Nishido, Yusuke; Yamazaki, Shunpei, Light-emitting device, electronic device, lighting device, and method for manufacturing the light-emitting device.
    8. Fukai, Shuji; Kubota, Yusuke; Jikumaru, Mika; Nishi, Takeshi; Shimomura, Akihisa; Nagano, Yoji; Nakamura, Daiki, Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device.
    9. Shimomura, Akihisa; Hatano, Kaoru, Method for manufacturing electroluminesccent device.
    10. Tanaka, Koichiro, Method for manufacturing glass sealed body and method for manufacturing light-emitting device.
    11. Miyairi, Hidekazu; Shimomura, Akihisa, Method for manufacturing sealed structure including welded glass frits.
    12. Shimomura, Akihisa; Miyairi, Hidekazu, Method of heating dispersion composition and method of forming glass pattern.
    13. Shimomura, Akihisa, Method of manufacturing light-emitting device.
    14. Shimomura, Akihisa, Method of manufacturing sealed body and method of manufacturing light-emitting device.
    15. Nishido, Yusuke, Sealed body, light-emitting module and method of manufacturing sealed body.
    16. Nishido, Yusuke, Sealed body, light-emitting module, and method of manufacturing sealed body.
    17. Shimomura, Akihisa, Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device.
    18. Shimomura, Akihisa, Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device.
    19. Dabich, II, Leonard Charles; Logunov, Stephan Lvovich; Quesada, Mark Alejandro; Streltsov, Alexander Mikhailovich, Sealed devices comprising transparent laser weld regions.
    20. Nishido, Yusuke, Sealing structure and organic electroluminescence device.
    21. Drake, Melinda A.; Lamberson, Lisa A.; Morena, Robert M., Strengthened glass substrates with glass frits and methods for making the same.
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