초록 ▼

A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-α-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of

A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-α-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.

대표청구항 ▼

The invention claimed is: 1. A hot-melt adhesive for resealable packaging comprising:a) 30 to 90 wt. % of a metallocene-catalyzed copolymer, wherein the copolymer consists of an ethylene and/or propylene with C4 to C20-α-olefins, and the copolymer has a melt index of 5 to 100 g/10 min at 190° C.;b)

The invention claimed is: 1. A hot-melt adhesive for resealable packaging comprising:a) 30 to 90 wt. % of a metallocene-catalyzed copolymer, wherein the copolymer consists of an ethylene and/or propylene with C4 to C20-α-olefins, and the copolymer has a melt index of 5 to 100 g/10 min at 190° C.;b) 5 to 50 wt. % of a tackifying resin, which has a softening point of 80 to 140° C.;c) 0.5 to 15 wt. % of a wax, which has a melting point of 120 to 170° C.; andd) 0.1 to 20 wt. % of an additive and/or auxiliary; andwherein the adhesive is a pressure sensitive adhesive and has a viscosity of 25,000 to 250,000 mPa·s at 170 to 190° C.