초록 ▼

A light output device comprises a substrate arrangement with a light source device integrated into the structure of the substrate arrangement. The substrate arrangement comprises first and second optically transmissive substrates, an insulating layer in which the light source device is embedded and

A light output device comprises a substrate arrangement with a light source device integrated into the structure of the substrate arrangement. The substrate arrangement comprises first and second optically transmissive substrates, an insulating layer in which the light source device is embedded and provided between the substrates, and a thermally conductive layer provided on at least on of the substrates.

대표청구항 ▼

1. A light output device, comprising at least one light source device integrated into a substrate arrangement comprising: at least one light transmissive substrate;a thermally insulating layer in thermal contact with the at least one light source device; andat least one thermally conductive layer in

1. A light output device, comprising at least one light source device integrated into a substrate arrangement comprising: at least one light transmissive substrate;a thermally insulating layer in thermal contact with the at least one light source device; andat least one thermally conductive layer in thermal contact with the at least one light source device;wherein the light source device is at least partly embedded in the thermally insulating layer. 2. A device as claimed in claim 1, wherein the thermally insulating layer (6a) has a thermal conductivity of less than 1 W/mK. 3. A device as claimed in claim 2, wherein the thermally insulating layer comprises a thermoplastic layer or resin. 4. A device as claimed in claim 1, comprising first and second light transmissive substrates, and first and second thermally conductive layers, wherein the first thermally conductive layer is provided on the first light transmissive substrate and the second thermally conductive layer is provided on the second light transmissible substrate. 5. A device as claimed in claim 4, wherein the first or the second thermally conductive layer has a thermal resistance less than 10% of the thermal resistance of the corresponding substrate on which it is provided. 6. A device as claimed in claim 1, wherein the first or the second thermally conductive layer has a thermal resistance less than 8.5 K/W. 7. A device as claimed in claim 1, wherein each thermally conductive layer (6a,6b) has a thickness d and a heat conductivity K, wherein K.d>0.002, in units of W/K. 8. A device as claimed in claim 1, wherein the thermally insulating layer comprises polyvinyl butyral or a UV resin. 9. A device as claimed in claim 1, wherein the at least one thermally conductive layer is patterned and the pattern comprises at least one region proximate to the light source device. 10. A device as claimed in claim 1, wherein the at least one thermally conductive layer is transparent. 11. A device as claimed in claim 1, wherein the at least one thermally conductive layer comprises diamond-like-carbon, MgO or Si3N4. 12. A device as claimed in claim 1, wherein the substrate arrangement comprises first and second substrates and further comprises an electrode arrangement sandwiched between the substrates, wherein the at least one light source device is connected to the electrode arrangement. 13. A device as claimed in claim 12, wherein the electrode arrangement comprises substantially transparent Indium Tin Oxide, Indium Zinc Oxide, Tin Oxide or Fluorine Doped Tin Oxide. 14. A device as claimed in claim 12, wherein the thermally conductive layer is electrically conductive and is patterned to at least partly correspond to the electrode arrangement. 15. A device as claimed in claim 1, wherein the light source device comprise one or more LED light sources. 16. A device as claimed in claim 15, wherein the light source device comprises one ore more inorganic LEDs, organic LEDs, polymer LEDs or laser diodes. 17. A light output device, comprising at least one light source device integrated into a substrate arrangement comprising:at least one light transmissive substrate;a thermally insulating layer in thermal contact with the at least one light source device; andat least one thermally conductive layer in thermal contact with the at least one light source device wherein the at least one thermally conductive layer is patterned and the pattern comprises at least one region proximate to the light source device.