$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Method and apparatus for detecting embedded material within an interaction region of a structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01J-003/30
출원번호 US-0986897 (2011-01-07)
등록번호 US-8094303 (2012-01-10)
발명자 / 주소
  • Denney, Paul E.
  • Eastman, Jay R.
  • Huang, Ta-Chieh
출원인 / 주소
  • Loma Linda University Medical Center
대리인 / 주소
    Knobbe, Martens, Olson & Bear LLP
인용정보 피인용 횟수 : 7  인용 특허 : 78

초록

A detection system is used during irradiation of an interaction region of a structure with laser light. The structure includes embedded material. The detection system includes means for receiving light emitted from the interaction region. The detection system further includes means for separating th

대표청구항

1. A system for detecting laser-irradiated embedded material in an inhabitable structure, the system comprising: an optical system adapted to receive light emitted from an interaction region of the inhabitable structure during irradiation of the interaction region with laser light; andan analyzer re

이 특허에 인용된 특허 (78) 인용/피인용 타임라인 분석

  1. Alexander Dennis R., Apparatus and method for detection and concentration measurement of trace metals using laser induced breakdown spectrosc.
  2. Fordahl, Craig A; Hiebel, Michael J., Apparatus and method for focal point control for laser machining.
  3. Dressel Martin (Goettingen DEX) Gerhardt Harald (Rosdorf DEX) Neu Walter (Goettingen DEX), Apparatus for controlled ablation by laser radiation.
  4. Luke, Barry Edward, Apparatus for performing operations on a workpiece at an inaccessible location.
  5. Davies Donald W., Compact fast imaging spectrometer.
  6. McGill Scott A. (21690 Wahoo Trail Chatsworth CA 91311) McGill Sterling A. (21690 Wahoo Trail Chatsworth CA 91311), Conical seismic anchor and drill bit for use with unreinforced masonry structures.
  7. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M.; Joseph,Andrew P.; Phillips,John S., Containment plenum for laser irradiation and removal of material from a surface of a structure.
  8. Kasner William H. (Penn Hills PA) Roach James F. (Oakmont PA) Toth Vincent A. (Penn Township ; Westmoreland County PA), Controlled depth laser drilling system.
  9. Damikolas Gerry, Dynamic laser cutting apparatus.
  10. Fyfe Edward R. (Del Mar CA) Isley ; Jr. Frederick P. (Tracy CA), Fabric reinforced beam and column connections.
  11. Matthews Dennis L. ; Celliers Peter M. ; Hackel Lloyd ; Da Silva Luiz B. ; Dane C. Brent ; Mrowka Stanley, High removal rate laser-based coating removal system.
  12. Freiwald, David A.; Youngman, Michael; Youngman, Kevin, Laser ablation cleaning.
  13. Millard, Ian; Pichler, Karl, Laser ablation nozzle assembly.
  14. Millard, Ian; Pichler, Karl, Laser ablation nozzle assembly.
  15. Ferguson Russell L. ; Edelson Martin C. ; Pang Ho-ming, Laser ablation system, and method of decontaminating surfaces.
  16. Klingel Hans (Moglingen DEX), Laser apparatus with novel beam aligning means and method of laser processing of workpieces using same.
  17. Schluter Holger,DEX ; Zwick Axel,DEX ; Wissenbach Konrad,DEX ; Buchter Edwin,DEX ; Reichel Frank,DEX ; Barkhausen Winfried,NLX, Laser beam apparatus and workpiece machining process.
  18. Yasumi Nagura JP; Michisuke Nayama JP; Takashi Ishide JP; Yoshio Hashimoto JP; Yukio Michishita JP; Koji Okimura JP, Laser beam machining head.
  19. Fukui Yasutaka,JPX ; Nemoto Masanobu,JPX ; Shimizu Kouki,JPX ; Sato Shun-ichi,JPX, Laser decontamination method.
  20. Taboada John (San Antonio TX) Poirier Robert H. (San Antonio TX), Laser delivery system.
  21. Otsubo, Tatsuhiro; Naka, Hiroyuki; Matsuda, Naoko, Laser drilling machine and method for collecting dust.
  22. Duffin Jason E.,GBX, Laser drilling with optical feedback.
  23. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M., Laser head for irradiation and removal of material from a surface of a structure.
  24. Theriault Gregory A. ; Lieberman Stephen H. ; Knowles David S. ; Martini Leonard J., Laser induced breakdown spectroscopy soil contamination probe.
  25. Sakamoto, Masahiko; Takeno, Shozui; Iwai, Yasuhiko; Hokodate, Toshiyuki; Kurosawa, Miki, Laser machining device.
  26. Weber, Ludwig, Laser machining head.
  27. Schubert, Peter, Laser machining head for machining a workpiece by means of a laser beam.
  28. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M.; Joseph,Andrew P.; Phillips,John S.; Patena,Michael N.; Burnham,Tim; Coleman,Paul, Laser manipulation system for controllably moving a laser head for irradiation and removal of material from a surface of a structure.
  29. Rieck Albert S., Laser marking process for vitrification of bricks and other vitrescent objects.
  30. Radich David (Lake Oswego OR), Laser objective lens shield.
  31. Furujo, Akira; Inagawa, Hisahito, Laser piercing method.
  32. Fenneman David B. (Fredericksburg VA CA) Geres Robert J. (China Lake CA), Laser pile cutter.
  33. Whitcroft Ian Andrew ; McMahon Richard Anthony,GBX, Laser treatment cooling head.
  34. Coulter Leland E. (New Canaan CT), Laser welding apparatus.
  35. Kawamoto Hideo (Hitachi JPX) Yamagiwa Tokio (Hitachi JPX) Fukuda Shinji (Hitachi JPX) Hashiura Masayoshi (Hitachi JPX) Isshiki Osamu (Hitachi JPX) Takeuchi Shigetaka (Hitachi JPX) Murashita Masaki (H, Long-sized tubular grounding container unit for gas-insulated electrical device and laser welding device for manufacturi.
  36. Babel Werner (Pfronten DEX), Machine tool for laser-beam machining of workpieces.
  37. Kaga Kunihiko,JPX ; Kotoh Satoru,JPX ; Ogawa Shuji,JPX ; Kanaoka Masaru,JPX, Machining head and laser machining apparatus.
  38. Baumann, Frieder H.; Dinu, Mihaela; Stuart, Howard R.; Walker, James A., Mechanically tunable optical devices such as interferometers.
  39. Roth Manfred (Mornshausen DEX), Method and a device for cutting a tub.
  40. Williams Merlin Ray (655 Garside Ct. San Leandro CA 94579), Method and apparatus for building construction.
  41. Hamasaki Masanobu (Takamatsu JPX) Katsumura Munehide (Kagawa JPX), Method and apparatus for cutting concrete by use of laser.
  42. Denney,Paul E.; Eastman,Jay R.; Huang,Ta Chieh, Method and apparatus for detecting embedded material within an interaction region of a structure.
  43. Denney,Paul E.; Eastman,Jay R.; Huang,Ta Chieh, Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light.
  44. Denney,Paul E.; Eastman,Jay R.; Huang,Ta Chieh, Method and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light.
  45. Neev Joseph, Method and apparatus for high precision variable rate material removal and modification.
  46. Denney, Paul E.; Eastman, Jay R.; Fallara, Paul M.; Joseph, Andrew P.; Philips, John S.; Huang, Ta Chieh; Patena, Michael N.; Burnham, Tim; Coleman, Paul, Method and apparatus for material processing.
  47. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M.; Joseph,Andrew P.; Phillips,John S.; Huang,Ta Chieh; Patena,Michael N.; Burnham,Tim; Coleman,Paul, Method and apparatus for material processing.
  48. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M.; Joseph,Andrew P.; Phillips,John S.; Huang,Ta Chieh; Patena,Michael N.; Burnham,Tim; Coleman,Paul, Method and apparatus for material processing.
  49. Denney,Paul E.; Eastman,Jay R.; Fallara,Paul M.; Joseph,Andrew P.; Phillips,John S.; Huang,Ta Chieh; Patena,Michael N.; Burnham,Tim; Coleman,Paul, Method and apparatus for material processing.
  50. Primbsch Erik (Cologne DEX), Method and apparatus for producing ultrasonic waves in light absorbing surfaces of workpieces.
  51. Wrba, Peter; Hildebrand, Peter; Kuhl, Michael; Reisacher, Martin, Method and apparatus for removing substance from the surface of a workpiece.
  52. Bertez, Christophe; Hamy, Jean; Matile, Olivier, Method and apparatus for the laser cutting of mild steel or structural steel with a multifocus optical component.
  53. Thomas James W. ; O'Banion Roland ; O'Banion Laura M., Method and apparatus for treating surfaces and ablating surface material.
  54. Jerby Eli,ILX ; Dikhtiar Vladimir,ILX, Method and device for drilling, cutting, nailing and joining solid non-conductive materials using microwave radiation.
  55. Bertez, Christophe, Method and plant for laser cutting with dual-flow and double-focus cutting head.
  56. Lovoi Paul A. (Saratoga CA), Method and system for controlled and selective removal of material.
  57. T. Dwayne McCay ; Mary Helen McCay ; Narendra B. Dahotre, Method for practicing a feedback controlled laser induced surface modification.
  58. Elcock Stanley E. ; Elcock Stanley D., Method for rejuvenating bridge hinges.
  59. Fuse Keiji (Osaka JPX), Optical device for laser machining.
  60. Fujii, Koji; Hirasawa, Kazushige; Nagayasu, Dokei; Ryudo, Makoto, Optical machining device.
  61. Kittrell Carter (Cambridge MA) Cothren ; Jr. Robert M. (Beatrice NE) Feld Michael S. (Waban MA), Optical shield for a laser catheter.
  62. Balliet ; Jr. Clifford M. (Endicott NY) Houser David E. (Apalachin NY), Optics and environmental protection device for laser processing applications.
  63. Boudot Ccile (Chalons Sur Saone FRX), Process and device for laser working with remote control.
  64. Dausinger Friedrich,DEX ; Griebsch Juergen,DEX ; Hack Ruediger,DEX, Process for determining the instantaneous penetration depth and a machining laser beam into a workpiece, and device for implementing this process.
  65. Fields William C. (Hermann MO) Fredrick Dan (Ballwin MO) Grannemann Steve (Hermann MO) Hannan Phyllis (Hermann MO) Lukashevsky Igor (St. Louis MO), Process for engraving ceramic surfaces using local laser vitrification.
  66. Yoon InBae, Protected ablation method and apparatus.
  67. Duncan C. Warren ; Meehan Richard G., Seismic correction system for retrofitting structural columns.
  68. Ho Seng-Tiong, Semiconductor micro-resonator device.
  69. Sirat, Gabriel Y., Spot size and distance characterization for a laser tool.
  70. Rudholm Gran (Boras SEX), Strap buckle with self-locking function.
  71. Dance, Bruce Guy Irvine, Surface modification.
  72. Samman Mahmod M., System and method for inspecting a cast structure.
  73. Flesher Dann J. (Benton City WA) Becker David L. (Kennewick WA) Beem William L. (Kennewick WA) Berry Tommy C. (Kennewick WA) Cannon N. Scott (Kennewick WA), Testing of concrete by laser ablation.
  74. Yamaguchi, Yoshihiro; Kabata, Tetsuya, Thermal cutting machine and dust collecting method thereof.
  75. Reichmann, Lutz; Hauer, Bjoern; Wolf, Juergen; Denner, Wolf-Juergen, Tool head for laser machining of materials.
  76. Uraki Keiichi,JPX ; Satsuta Toshitaka,JPX ; Onuma Akira,JPX ; Nakamura Mitsuo,JPX ; Onuma Tsutomu,JPX ; Matsumoto Toshimi,JPX ; Tamai Yasumasa,JPX ; Yamauchi Hiroshi,JPX ; Hayashi Eisaku,JPX ; Morina, Underwater laser processing device including chamber with partitioning wall.
  77. Price Ernest H. (1266 Pepper Dr. El Centro CA 92243), Well perforating apparatus and method.
  78. Jacobowitz Lawrence (Poughkeepsie NY) Mathisen Einar S. (Poughkeepsie NY) Thorp Lawrence D. (Yorktown NY), Wide band grating spectrometer.

이 특허를 인용한 특허 (7) 인용/피인용 타임라인 분석

  1. Cathry, Daniel; Imboden, Ernest; Bugmann, Tobias; Broger, David; Perrin, Thierry, Laser processing machine.
  2. Cathry, Daniel; Imboden, Ernest; Bugmann, Tobias; Broger, David; Perrin, Thierry, Laser processing machine.
  3. Cathry, Daniel; Beutler, Beat; Rauschenbach, Sven, Laser processing machine, in particular laser cutting machine, and method for centering a laser beam, in particular a focused laser beam.
  4. Luedi, Andreas; Cathry, Daniel, Laser processing machine, laser cutting machine, and method for adjusting a focused laser beam.
  5. Denney, Paul E.; Eastman, Jay R.; Fallara, Paul M.; Joseph, Andrew P.; Phillips, John S.; Patena, Michael N.; Burnham, Tim; Coleman, Paul, Manipulation apparatus for system that removes material from a surface of a structure.
  6. Denney, Paul E.; Eastman, Jay R.; Fallara, Paul M.; Joseph, Andrew P.; Phillips, Joseph S.; Huang, Ta-Chieh; Patena, Michael N.; Burnham, Tim; Coleman, Paul, Method and apparatus for material processing.
  7. Beutler, Beat, Method for configuring a laser machining machine.

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로