IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0117473
(2008-05-08)
|
등록번호 |
US-8121752
(2012-02-21)
|
발명자
/ 주소 |
- Winterhalter, Michael
- Berecz, Endre
|
출원인 / 주소 |
- L-3 Communications Coporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
4 |
초록
▼
A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing.
A flight recorder includes an information input device, heat sensitive memory device electrically connected to the information input device, and housing enclosing the heat sensitive memory device. The housing is made with a first material and having a plurality of openings made through the housing. A sacrificial material is disposed between the housing and heat sensitive memory device. The sacrificial material having a lower melting temperature than the first material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and heat sensitive memory device. The first material includes nickel and the sacrificial material includes aluminum. A heat insulating layer is disposed between the sacrificial material and heat sensitive memory device. A second sacrificial material is disposed between the heat insulating layer and heat sensitive memory device.
대표청구항
▼
1. A crash survivable memory unit, comprising: a heat sensitive memory device;a housing enclosing the heat sensitive memory device, the housing being made with a first material and having a plurality of openings made through the housing;a heat insulating layer comprising a second material and dispos
1. A crash survivable memory unit, comprising: a heat sensitive memory device;a housing enclosing the heat sensitive memory device, the housing being made with a first material and having a plurality of openings made through the housing;a heat insulating layer comprising a second material and disposed between the housing and the heat sensitive memory device; anda sacrificial material disposed between the housing and the heat insulating layer, the sacrificial material having a lower melting temperature than the first material and the second material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and the heat insulating layer. 2. The crash survivable memory unit of claim 1, wherein the heat sensitive memory device is a non-volatile memory unit. 3. The crash survivable memory unit of claim 1, further including a second sacrificial material disposed between the heat insulating layer and heat sensitive memory device. 4. The crash survivable memory unit of claim 1, wherein the first material includes nickel and the sacrificial material includes aluminum. 5. A flight recorder, comprising: an information input device;a heat sensitive memory device electrically connected to the information input device;a housing enclosing the heat sensitive memory device, the housing being made with a first material and having a plurality of openings made through the housing;a heat insulating layer comprising a second material and disposed between the housing and the heat sensitive memory device; anda sacrificial material disposed between the housing and the heat insulating layer, the sacrificial material having a lower melting temperature than the first material and the second material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and the heat insulating layer. 6. The flight recorder of claim 5, wherein the heat sensitive memory device is a non-volatile memory unit. 7. The flight recorder of claim 5, further including a second sacrificial material disposed between the heat insulating layer and heat sensitive memory device. 8. The flight recorder of claim 5, wherein the first material includes nickel and the sacrificial material includes aluminum. 9. The flight recorder of claim 5, wherein the flight recorder is selected from the group consisting of a flight data recorder, flight voice recorder, and flight video recorder. 10. An aircraft, comprising: an airframe; anda flight recorder connected to the airframe, the flight recorder including,(a) an information input device,(b) a heat sensitive memory device electrically connected to the information input device,(c) a housing enclosing the heat sensitive memory device, the housing being made with a first material and having a plurality of openings made through the housing,(d) a heat insulating layer comprising a second material and disposed between said housing and said heat sensitive memory device; and(e) a sacrificial material disposed between the housing and the heat insulating layer, the sacrificial material having a lower melting temperature than the first material and the second material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and the heat insulating layer. 11. The aircraft of claim 10, wherein the heat sensitive memory device is a non-volatile memory unit. 12. The aircraft of claim 10, further including a second sacrificial material disposed between the heat insulating layer and heat sensitive memory device. 13. The aircraft of claim 10, wherein the first material includes nickel and the sacrificial material includes aluminum. 14. The aircraft of claim 10, wherein the flight recorder is selected from the group consisting of a flight data recorder, flight voice recorder, and flight video recorder. 15. A method of making a crash survivable memory unit, comprising: providing a heat sensitive memory device;enclosing the heat sensitive memory device in a housing, the housing being made with a first material and having a plurality of openings made through the housing;disposing a heat insulating layer between said housing and said heat sensitive memory device, said heat insulating layer comprising a second material; anddisposing a sacrificial material between the housing and the heat insulating layer, the sacrificial material having a lower melting temperature than the first material and the second material such that the sacrificial material changes state and egresses through the openings in the housing when exposed to heat to create an air gap between the housing and the heat insulating material. 16. The method of claim 15, wherein the heat sensitive memory device is a non-volatile memory unit. 17. The method of claim 15, further including disposing a second sacrificial material between the heat insulating layer and heat sensitive memory device. 18. The method of claim 15, wherein the first material includes nickel and the sacrificial material includes aluminum.
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