초록 ▼

To increase an area in which a component can be mounted in a substrate including an IC chip to which an antenna is connected. For this purpose, an opening at the center of a center substrate is provided with an IC chip. An antenna is wired to an upper surface of the center substrate so as to enclose

To increase an area in which a component can be mounted in a substrate including an IC chip to which an antenna is connected. For this purpose, an opening at the center of a center substrate is provided with an IC chip. An antenna is wired to an upper surface of the center substrate so as to enclose the IC chip. A top substrate is laminated and fixed on the upper surface of the center substrate. A bottom substrate is laminated and fixed on a lower surface of the center substrate. Since the antenna is not wired to an upper surface of the top substrate and a lower surface of the bottom substrate, a component can be mounted on the entire upper and lower surfaces. This allows a large number of components to be mounted.

대표청구항 ▼

1. An antenna-containing substrate wherein a first substrate is provided with an IC chip and an antenna, wherein the antenna is mounted on a surface of the first substrate and is connected to the IC chip, andthe first substrate and a second substrate are fixed and laminated such that a reverse surfa

1. An antenna-containing substrate wherein a first substrate is provided with an IC chip and an antenna, wherein the antenna is mounted on a surface of the first substrate and is connected to the IC chip, andthe first substrate and a second substrate are fixed and laminated such that a reverse surface of the second substrate is opposed to the surface of the first substrate,wherein the first substrate has an opening and the IC chip is fitted in the opening, and there is provided a wiring pattern for electrically connecting the IC chip to a component to be mounted on at least one of a reverse surface of the first substrate and a surface of the second substrate,the IC chip further comprising:a power supply circuit that generates the power to be supplied to the IC chip on the basis of a radio wave signal received by the antenna,a data interface circuit that establishes data communication to and from the component to be mounted,a determination circuit that determines whether the power generated by the power supply circuit is supplied to the IC chip or the power applied through the wiring pattern is supplied to the IC chip, anda power supply control circuit that controls the supply of the power so as to continue to supply the power to the data interface circuit in response to the determination by the determination circuit that the power is supplied to the IC chip through the wiring pattern, while stopping supplying the power to the data interface circuit in response to the determination by the determination circuit that the power generated by the power supply circuit is supplied to the IC chip. 2. An operation member and antenna mounting substrate carrying device comprising: an operation member mounting substrate having an operation member, which is operated by a touch of a human being, mounted on its surface, being provided with an IC chip connected to the operation member, and having a first antenna, connected to the IC chip, mounted on its surface or reverse surface; anda communication substrate having a second antenna, communicating with the first antenna mounted on the operation member mounting substrate, mounted thereon, wherein the communication substrate further comprises a determination circuit that determines whether or not it does not communicate with an external device excluding the operation member and antenna mounting substrate carrying device by means of the first antenna mounted on the operation member mounting substrate, anda communication control circuit that establishes communication through the first antenna mounted on the operation member mounting substrate by means of the second antenna in response to the determination by the determination circuit that it does not communicate with the external device,wherein a portion of the surface or reverse surface of the operation member mounting substrate corresponding to a portion having the first antenna mounted thereon is electromagnetically shielded. 3. The operation member and antenna mounting substrate carrying device according to claim 2, wherein the operation member mounting substrate is fixed to a case of the operation member and antenna mounting substrate carrying device on which the operation member mounting substrate is mounted with the substrate positioned inside the case and the operation member positioned so as to be exposed to the outside of the case. 4. The operation member and antenna mounting substrate carrying device according to claim 3, wherein the operation member mounting substrate is integrated with the case by being molded thereto. 5. The operation member and antenna mounting substrate carrying device according to claim 2, wherein the operation member mounting substrate is a flexible substrate. 6. The operation member and antenna mounting substrate carrying device according to claim 2, further comprising a transmission control circuit that transmits a radio wave signal for generating the power from the second antenna mounted on the communication substrate to the first antenna mounted on the operation member mounting substrate,the IC chip provided in the operation member mounting substrate further comprisinga power supply circuit that generates the power on the basis of the radio wave signal received in the first antenna,a detection circuit that detects an operating state in the operation member on the basis of the power generated by the power supply circuit, anda transmission control circuit that transmits a signal representing the operating state detected by the detection circuit from the first antenna to the second antenna mounted on the communication substrate by means of the first antenna. 7. The operation member and antenna mounting substrate carrying device according to claim 2, wherein the operation member mounting substrate further comprisesa receiving control circuit that carries out control such that the first antenna mounted on the operation member mounting substrate receives data transmitted from the external device excluding the operation member and antenna mounting substrate carrying device, anda memory circuit that stores the data received in the receiving control circuit. 8. The operation member and antenna mounting substrate carrying device according to claim 2, wherein the communication substrate further comprisesa receiving control circuit that carries out control such that the second antenna mounted on the communication substrate receives the data transmitted from the external device excluding the operation member and antenna mounting substrate carrying device, anda memory circuit that stores the data received in the receiving control circuit.