Semiconductor apparatus and fabrication method of the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/04
H01L-031/36
H01L-031/376
H01L-031/20
출원번호
US-0010962
(2011-01-21)
등록번호
US-8134153
(2012-03-13)
우선권정보
JP-2002-305084 (2002-10-18)
발명자
/ 주소
Yamazaki, Shunpei
Takayama, Toru
Maruyama, Junya
Ohno, Yumiko
출원인 / 주소
Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
Fish & Richardson P.C.
인용정보
피인용 횟수 :
16인용 특허 :
83
초록▼
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal displ
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.
대표청구항▼
1. A semiconductor device comprising: a plastic substrate or a plastic base material as a support medium;an adhesive in contact with the plastic substrate or the plastic base material;an insulating film in contact with the adhesive; anda release layer over the insulating film,wherein each of the pla
1. A semiconductor device comprising: a plastic substrate or a plastic base material as a support medium;an adhesive in contact with the plastic substrate or the plastic base material;an insulating film in contact with the adhesive; anda release layer over the insulating film,wherein each of the plastic substrate or the plastic base material comprises a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide and one selected from the group consisting of metal powder, metal fibers, low-melting metals and ceramics. 2. A semiconductor device according to claim 1, wherein a device included in the release layer is one selected from the group consisting of a thin-film transistor, a light-emitting device including a light-emitting layer containing an organic compound, a liquid crystal device, a memory device, a pin junction silicon photoelectric converter, and a silicon resistance element. 3. A semiconductor device according to claim 1, wherein the adhesive has thermal conductivity. 4. A semiconductor device according to claim 1, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 5. A semiconductor device according to claim 1, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 6. A semiconductor device according to claim 1, wherein the semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal. 7. A semiconductor device comprising: a plastic substrate or a plastic base material as a support medium;an adhesive in contact with the plastic substrate or the plastic base material;an insulating film in contact with the adhesive;a cathode and an anode provided over the insulating film; anda film containing an organic compound provided between the cathode and the anode,wherein each of the plastic substrate or the plastic base material comprises a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide and one selected from the group consisting of metal powder, metal fibers, low-melting metals and ceramics. 8. A semiconductor device according to claim 7, wherein the adhesive has thermal conductivity. 9. A semiconductor device according to claim 7, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 10. A semiconductor device according to claim 7, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 11. A semiconductor device according to claim 7, wherein the semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal. 12. A semiconductor device according to claim 7 wherein the film containing the organic compound comprises a light-emitting layer. 13. A semiconductor device comprising: a plastic substrate or a plastic base material as a support medium;an adhesive in contact with the plastic substrate or the plastic base material;an insulating film in contact with the adhesive; anda layer over the insulating film,wherein each of the plastic substrate or the plastic base material comprises a material selected from the group consisting of polypropylene, polypropylene sulfide, polycarbonate, polyetherimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, and polyphthalamide and one selected from the group consisting of metal powder, metal fibers, low-melting metals and ceramics. 14. A semiconductor device according to claim 13, wherein a device included in the layer is one selected from the group consisting of a thin-film transistor, a light-emitting device including a light-emitting layer containing an organic compound, a liquid crystal device, a memory device, a pin junction silicon photoelectric converter, and a silicon resistance element. 15. A semiconductor device according to claim 13, wherein the adhesive has thermal conductivity. 16. A semiconductor device according to claim 13, wherein each the plastic substrate or the plastic base material has higher thermal conductivity than that of the adhesive. 17. A semiconductor device according to claim 13, wherein the adhesive contains powder or filler comprising a material selected from the group consisting of silver, nickel, aluminum, and aluminum nitride. 18. A semiconductor device according to claim 13, wherein the semiconductor device is incorporated into one selected from the group consisting of a video camera, a digital camera, a goggle type display, a car navigation, a personal computer, and a portable information terminal.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (83)
Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Zavracky Paul M. (Norwood MA), A slide assembly for projector with active matrix moveably mounted to housing.
Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Dingle Brenda (Mansfield MA) Jacobsen Jeffrey (Hollister CA), Color filter system for display panels.
Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Display device and method of fabricating involving peeling circuits from one substrate and mounting on other.
Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
Andros Frank Edward ; Bupp James Russell ; DiPietro Michael ; Hammer Richard Benjamin, Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device.
Spitzer Mark B. (Sharon MA) Jacobsen Jeffrey (Hollister CA), Eye tracking system having an array of photodetectors aligned respectively with an array of pixels.
Esterberg Dennis R. ; Smith Mark A. ; Rubens Paul A. ; Lang Tracy A., Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink.
Salerno Jack ; Zayracky Matthew ; Offsey Stephen ; Chastain David ; Arney Michel ; Beck Benjamin ; Hunter Gregory ; O'Connor Kevin ; Richard Alan, Housing assembly for a matrix display.
Fan John C. C. (Chestnut Hill MA) Dingle Brenda (Mansfield MA) Shastry Shambhu (Franklin MA) Spitzer Mark B. (Sharon MA) McClelland Robert W. (Norwell MA), Light emitting diode bars and arrays and method of making same.
Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA) Vu Duy-Phach (Taunton MA) Zavracky Paul M. (Norwood MA), Liquid crystal display having adhered circuit tiles.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA), Liquid crystal display having essentially single crystal transistors pixels and driving circuits.
Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA) Vu Duy-Phach (Taunton MA) Zavracky Paul M. (Norwood MA), Method for manufacturing a semiconductor device using a circuit transfer film.
Vu Duy-Phach (Taunton MA) Dingle Brenda D. (Mansfield MA) Dingle Jason E. (Mansfield MA) Cheong Ngwe (Boston MA), Method for manufacturing a semiconductor device using a circuit transfer film.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA), Method of fabricating single crystal silicon arrayed devices for display panels.
Andros Frank E. (Binghamton NY) Bupp James R. (Endwell NY) DiPietro Michael (Vestal NY) Hammer Richard B. (Apalachin NY), Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate an.
Fan John C. C. (Chestnut Hill MA) Dingle Brenda (Mansfield MA) Shastry Shambhu (Franklin MA) Spitzer Mark B. (Sharon MA) McClelland Robert W. (Norwell MA), Method of making light emitting diode bars and arrays.
Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
Vu Duy-Phach (1559 Bay St. - Apt. 55 Taunton MA 02780) Dingle Brenda D. (142 Lawndale Rd. Mansfield MA 02048) Dingle Jason E. (142 Lawndale Rd. Mansfield MA 02048) Cheong Ngwe (348 Tremont St. Boston, Polysilicon transistors formed on an insulation layer which is adjacent to a liquid crystal material.
Gale Ronald P. (Sharon MA) McCullough Richard (Wrenthem MA) Salerno Jack P. (Waban MA) Fantone Stephen D. (Lynnfield MA) Forsyth Robert P. (Lexington MA) Carellas Peter T. (Winchester MA) Thomas Mich, Projection monitor.
Gale Ronald P. (Sharon MA) McCullough Richard (Wrenthem MA) Salerno Jack P. (Waban MA) Fantone Stephen D. (Lynnfield MA) Forsyth Robert Park (Lexington MA) Carellas Peter T. (Winchester MA) Thomas Mi, Projection monitor.
Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
Iwane, Masaaki; Nakagawa, Katsumi; Iwakami, Makoto; Nishida, Shoji; Ukiyo, Noritaka; Iwasaki, Yukiko; Mizutani, Masaki, Separation method of semiconductor layer and production method of solar cell.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA), Single crystal silicon arrayed devices for display panels.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA) Spitzer Mark B. (Sharon MA), Single crystal silicon arrayed devices for display panels.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA) Spitzer Mark B. (Sharon MA), Single crystal silicon arrayed devices for display panels.
Spitzer Mark B. (Sharon MA) Salerno Jack P. (Waban MA) Jacobsen Jeffrey (Hollister CA), Single crystal silicon arrayed devices for projection displays.
Salerno Jack P. ; Zavracky Paul M. ; Spitzer Mark B. ; Dingle Brenda, Single crystal silicon arrayed devices with optical shield between transistor and substrate.
Vu Duy-Phach (Taunton MA) Dingle Brenda D. (Mansfield MA) Dingle Jason E. (Mansfield MA) Cheong Ngwe (Boston MA), Single crystal silicon tiles for liquid crystal display panels including light shielding layers.
Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA), Single crystal silicon transistors for display panels.
Salerno Jack P. (Waban MA) Zavracky Matthew (Attleboro MA) Offsey Stephen (Brookline MA) Striegler Thomas (San Jose CA) O\Connor Kevin (South Easton MA) Chastain David (Acton MA) Arney Michel (Needha, Slide projector mountable light valve display.
Zavracky Matthew (Attleboro MA) Offsey Stephen (Brookline MA) Chastain David (Acton MA) Arney Michel (Needham MA) Beck Benjamin (Boston MA) Hunter Gregory (Westwood MA) O\Connor Kevin (South Easton M, Slide projector mountable light valve display.
Zavracky Matthew ; Offsey Stephen ; Chastain David ; Arney Michel ; Beck Benjamin ; Hunter Gregory ; O'Connor Kevin ; Richard Alan, Slide projector mountable light valve display.
Salerno Jack P. (Waban MA) Zavracky Paul M. (Norwood MA) Spitzer Mark B. (Sharon MA) Dingle Brenda (Mansfield MA), Transferred single crystal arrayed devices including a light shield for projection displays.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.