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An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the terminal pins are inserted. The fu

An IC device includes a base plate, a plurality of terminal pins, a functional component such as an IC chip, and a resin package for protection of the functional component. The base plate is generally flat and formed with a plurality of through-holes into which the terminal pins are inserted. The functional component, disposed away from the base plate, is mounted on a printed circuit board to be electrically connected to at least one of the terminal pins. While enclosing the functional component, the resin package is held in contact with the upper surface of the base plate.

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1. An IC device comprising: a flat base plate including a first main surface, a second main surface opposite to the first main surface, and an outer side surface between the first and second main surfaces, the base plate being formed with a plurality of through-holes;a plurality of terminal pins eac

1. An IC device comprising: a flat base plate including a first main surface, a second main surface opposite to the first main surface, and an outer side surface between the first and second main surfaces, the base plate being formed with a plurality of through-holes;a plurality of terminal pins each inserted into a corresponding one of the plurality of through-holes;a functional component spaced away from the base plate and electrically connected to at least one of the plurality of terminal pins; anda resin package enclosing the functional component and provided separately from the base plate in contact with the first main surface of the base plate over an entire area of the first main surface, the resin package including an outer side surface that is flush with the outer side surface of the base plate. 2. The IC device according to claim 1, wherein the terminal pins are press-inserted into the through-holes, and the resin package is made of a thermoplastic resin. 3. The IC device according to claim 1, wherein the plurality of through-holes are aligned in two rows. 4. The IC device according to claim 1, further comprising a circuit board for mounting the functional component. 5. The IC device according to claim 4, wherein the circuit board is parallel to the base plate. 6. A method of manufacturing an IC device, the method comprising: preparing a flat base plate made of an insulating material and formed with a plurality of through-holes;inserting terminal pins into the plurality of through-holes, respectively;electrically connecting a functional component to at least one of the plurality of terminal pins;forming a molding space by bringing a mold into contact with the base plate, the molding space being defined by the mold and the base plate, the molding space accommodating the functional component and having an opening closed by the base plate; andforming a resin package by supplying a molten resin into the molding space, the molten resin being different from the insulating material of the base plate. 7. The method according to claim 6, wherein the base plate has side surfaces, the mold coming into contact with the side surfaces of the base plate for closing the molding space. 8. An IC device comprising: a flat base plate made of an insulating material, the base plate including a first main surface, a second main surface opposite to the first main surface, and outer side surfaces between the first and second main surfaces, the base plate being formed with a plurality of through-holes;a plurality of terminal pins each inserted into a corresponding one of the plurality of through-holes;a circuit board connected to the plurality of terminal pins;a functional component mounted on the circuit board and spaced away from the base plate, the functional component being electrically connected to at least one of the plurality of terminal pins; anda resin package made of a resin material different from the insulating material of the base plate, the resin package enclosing the functional component and held in contact with the first main surface of the base plate, the resin package including outer side surfaces flush with the outer side surfaces of the base plate. 9. The IC device according to claim 8, wherein the circuit board is perpendicular to the first main surface of the base plate. 10. The IC device according to claim 8, wherein the circuit board is parallel to the first main surface of the base plate. 11. The IC device according to claim 8, wherein part of the resin package fills a clearance between the circuit board and the base plate.