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[미국특허] Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 US-0849112 (2007-08-31)
등록번호 US-8143100 (2012-03-27)
발명자 / 주소
  • Karnezos, Marcos
출원인 / 주소
  • ChipPAC, Inc.
인용정보 피인용 횟수 : 3  인용 특허 : 84

초록 ▼

A method for making a semiconductor multi-package module includes; providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming z-interconnects between the upper and lowe

대표청구항 ▼

1. A method for making a multipackage module, comprising: providing a bottom package including at least one die on a lower side of a bottom package substrate,stacking a top package over an upper surface of the bottom package substrate with the top package including an upper die stacked over a lower

이 특허에 인용된 특허 (84) 인용/피인용 타임라인 분석

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이 특허를 인용한 특허 (3) 인용/피인용 타임라인 분석

  1. Okuda, Nobuyoshi; Kanae, Masaaki; Hayasaka, Naoki, High-frequency module.
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  2. Scheid, David, Integrated circuit package including wire bond and electrically conductive adhesive electrical connections.
    상세보기
  3. Jang, Ae-nee; Park, Jin-Woo; Lee, Seokhyun; Lee, Jongho, Semiconductor package devices.
    상세보기

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