초록 ▼

A method for fabricating an image sensor is provided. In the image sensor fabrication method, an interconnection and a dielectric interlayer are formed on a semiconductor substrate including a readout circuit. An image sensing unit is formed on a carrier substrate of one side of a dielectric layer.

A method for fabricating an image sensor is provided. In the image sensor fabrication method, an interconnection and a dielectric interlayer are formed on a semiconductor substrate including a readout circuit. An image sensing unit is formed on a carrier substrate of one side of a dielectric layer. The carrier substrate and the dielectric interlayer are bonded to each other. The dielectric layer and the carrier substrate are removed to leave the image sensing unit on the dielectric interlayer.

대표청구항 ▼

1. A method for fabricating an image sensor, comprising: forming an interconnection and a dielectric interlayer on a semiconductor substrate including a readout circuit;preparing first and second carrier substrates, each including a surface dielectric layer;forming a first carrier pattern layer on t

1. A method for fabricating an image sensor, comprising: forming an interconnection and a dielectric interlayer on a semiconductor substrate including a readout circuit;preparing first and second carrier substrates, each including a surface dielectric layer;forming a first carrier pattern layer on the second carrier substrate by cleaving the first carrier substrate;performing a thermal treatment process on the first carrier pattern layer;forming an image sensing unit on or in the first carrier pattern layer, wherein the surface dielectric layers are between the image sensing unit and the second carrier substrate;bonding the image sensing unit and the dielectric interlayer; andremoving the surface dielectric layers and the second carrier substrate to leave the image sensing unit on the dielectric interlayer. 2. The method according to claim 1, wherein removing the surface dielectric layers comprises a first wet etching process. 3. The method according to claim 2, wherein removing the second carrier substrate comprises the first wet etching process, a second wet etching process, a dry etching process, or planarization. 4. The method according to claim 3, wherein removing the second carrier substrate comprises the first wet etching process. 5. The method according to claim 1, further comprising, prior to performing the thermal treatment process, placing the surface dielectric layers face to face, and applying pressure to opposite sides of the first and second carrier substrates. 6. The method according to claim 1, wherein the thermal treatment process is performed at temperatures of about 1000 ° C. to about 2000 ° C. 7. The method according to claim 1, wherein the first and/or second carrier substrates comprise crystalline silicon. 8. A method for fabricating an image sensor, comprising: forming an interconnection and a dielectric interlayer on a semiconductor substrate including a readout circuit;forming an image sensing unit on or in a carrier substrate, wherein a carrier dielectric layer is between the image sensing unit and the carrier substrate;bonding the image sensing unit and the dielectric interlayer;cleaving the carrier substrate; andafter cleaving the carrier substrate, removing the carrier dielectric layer and the carrier substrate to leave the image sensing unit on the dielectric interlayer. 9. The method according to claim 3, wherein removing the second carrier substrate further comprises cleaving the second carrier substrate. 10. A method for fabricating an image sensor, comprising: forming an interconnection and a dielectric interlayer on a semiconductor substrate including a readout circuit;forming a dielectric layer on each of first and second carrier substrates;performing a primary bonding process to bond the dielectric layers of the first and second carrier substrates to each other;forming a first carrier pattern layer on the first carrier substrate by removing a portion of the first carrier substrate through a primary cleaving process;forming an image sensing unit in or on the first carrier pattern layer;performing a secondary bonding process to bond the dielectric interlayer and the image sensing unit to each other; andremoving the dielectric layers and the second carrier substrate to leave the image sensing unit on the dielectric interlayer. 11. The method according to claim 10, further comprising performing a thermal treatment process on the first carrier pattern layer after forming the first carrier pattern layer. 12. The method according to claim 11, wherein the thermal treatment process is performed at a temperature of about 1000 ° C. to about 2000 ° C. 13. The method according to claim 10, further comprising forming a second carrier pattern layer by cleaving a portion of the second carrier substrate after performing the secondary bonding process. 14. The method according to claim 10, wherein removing the dielectric layer comprises a wet etching process. 15. The method according to claim 14, wherein removing of the dielectric layer simultaneously removes the second carrier pattern layer. 16. The method according to claim 8, wherein removing the carrier dielectric layer comprises a first wet etching process. 17. The method according to claim 16, wherein removing the carrier substrate comprises the first wet etching process, a second wet etching process, a dry etching process, or planarization. 18. The method according to claim 17, wherein removing the carrier substrate comprises the first wet etching process. 19. The method according to claim 8, wherein the carrier substrate comprises crystalline silicon. 20. The method according to claim 8, wherein the carrier dielectric layer comprises first and second carrier dielectric layers bonded together.