$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

[미국특허] Color correction for radiation detectors 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01J-005/02
출원번호 US-0607122 (2006-11-30)
등록번호 US-8153980 (2012-04-10)
발명자 / 주소
  • Brady, John F.
  • Syllaios, Athanasios J.
  • Schimert, Thomas R.
  • McCardel, William L.
  • Gooch, Roland W.
출원인 / 주소
  • L-3 Communications Corp.
대리인 / 주소
    O'Keefe, Egan, Peterman & Enders LLP
인용정보 피인용 횟수 : 14  인용 특허 : 93

초록

Systems and methods for color correcting radiation by alternately focusing a first radiation spectrum on a first radiation spectrum detector, and then focusing at least one additional radiation spectrum on at least one additional radiation spectrum detector.

대표청구항

1. A color-corrected radiation detection system, comprising: a first radiation spectrum detector capable of detecting at least a first radiation spectrum and a second radiation spectrum detector capable of detecting at least a second radiation spectrum, said first and second radiation spectra being

이 특허에 인용된 특허 (93) 인용/피인용 타임라인 분석

  1. Farnworth Warren M. ; Akram Salman ; Wood Alan G. ; Hembree David R. ; Wark James M. ; Jacobson John O., Apparatus for testing semiconductor wafers.
  2. Hegel ; Jr. Rudolph R. (Richfield MN) Wood R. Andrew (Bloomington MN), Array uniformity correction.
  3. Suppelsa Anthony B. (Coral Springs FL), Auto-regulating solder composition.
  4. Eden Dayton Dale ; Case William Edward ; Schimert Thomas R., Bandgap radiation detector.
  5. Agnese Patrick,FRX ; Sajer Jean-Michel,FRX, Bolometric detection device for millimeter and sub-millimeter waves and a method for manufacturing this device.
  6. Kaiser William J. (Los Angeles CA) Pister Kristofer S. J. (Pacific Palisades CA) Stafsudd Oscar M. (Los Angeles CA) Nelson Phyllis R. (Mar Vista CA) Burstein Amit (N. Hollywood CA), CMOS integrated microsensor with a precision measurement circuit.
  7. Gordon Richard (Scarsdale NY) Ciallella John G. (White Plains NY), Ceramic lid assembly for hermetic sealing of a semiconductor chip.
  8. Barron Carole C. ; Hetherington Dale L. ; Montague Stephen, Chemical-mechanical polishing of recessed microelectromechanical devices.
  9. Bly Vincent T. (Springfield VA) Terrill Conrad W. (Lorton VA) Advena Donna J. (Springfield VA), Chopper for staring infrared systems.
  10. Klocek Paul, Chopper for thermal imaging system and method.
  11. Chang Shyh-Ming (Hsinchu TWX) Chu Chih-Chiang (Taipei TWX) Lee Yu-Chi (Taipei Hsien TWX), Composite bump flip chip bonding.
  12. Lillquist Robert D. (Schenectady NY) Pimbley Joseph M. (Schenectady NY) Vogelsong Thomas L. (Schenectady NY), Composite visible/thermal-infrared imaging system.
  13. Dostoomian Ashod S. (Stoukhim MA) Richard Alan A. (Seekona MA) Traub Alan C. (Framingham MA) Vanzetti Riccardo (Brockton MA), Controller for spot welding.
  14. Ouvrier-Buffet Jean-Louis,FRX ; Beccia Chantal,FRX ; Vilain Michel,FRX, Device for the detection of multispectral infrared/visible radiation.
  15. Marshall Charles M. ; Blackwell Richard, Dual-band multi-level microbridge detector.
  16. Wadsworth Mark V. ; McCardel William L., Electronic chopping.
  17. Schimert Thomas R. (Ovilla TX), Enhanced quantum well infrared photodetector.
  18. Pister Kristofer S. J., Etchants for use in micromachining of CMOS Microaccelerometers and microelectromechanical devices and method of making.
  19. Hall Peter M. (Emmaus PA) Howland Frank L. (Allentown PA) Morabito Joseph M. (Bethlehem PA) Rickabaugh Lawrence J. (North Andover MA), Fabrication of circuit packages.
  20. McCormack Kent (Richardson TX) McNeill Dane A. (Dallas TX), Ferroelectric imaging system.
  21. Kurtz Anthony D. (Teaneck NJ) Ned Alexander A. (Bloomingdale NJ), Fusion bonding technique for use in fabricating semiconductor devices.
  22. Mikkor Mati (Ann Arbor MI), Hermetic sealing of silicon.
  23. Roland W. Gooch ; Mark V. Wadsworth, High fill factor bolometer array.
  24. Syllaios Athanasios J. ; Gooch Roland W. ; McCardel William L. ; Schimert Thomas R., High frequency infrared emitter.
  25. Marshall Charles M. ; Blackwell Richard, Imaging system including an array of dual-band microbridge detectors.
  26. Gibbons Robert C. ; McKenney Samuel R. ; Baber S. Charles ; Chang Richard R. ; Bell Michael C., Infrared chopper using binary diffractive optics.
  27. Robert C. Gibbons ; Samuel R. McKenney ; S. Charles Baber ; Richard R. Chang ; Michael C. Bell, Infrared chopper using binary diffractive optics.
  28. Hornbeck Larry J. (Van Alstyne TX), Infrared detector.
  29. Vilain Michel,FRX ; Yon Jean-Jacques,FRX, Infrared detector and manufacturing process.
  30. Spears David L. (Acton MA), Infrared detector using a resonant optical cavity for enhanced absorption.
  31. Schimert, Thomas R.; Beratan, Howard R.; Hanson, Charles M.; Soch, Kevin L.; Tregilgas, John H., Infrared detector with amorphous silicon detector elements, and a method of making it.
  32. Sauer Donald Jon ; Martinelli Ramon Ubaldo ; Amantea Robert ; Levine Peter Alan, Infrared imager using room temperature capacitance sensor.
  33. Eden Dayton D., Infrared radiation detector.
  34. Blackwell Richard ; Butler Neal R. ; Mroczkowski Jacek, Infrared radiation detector having a reduced active area.
  35. Wood Roland A. (Bloomington MN) Higashi Robert E. (Shorewood MN) Rhodes Michael L. (Richfield MN), Infrared radiation imaging array with compound sensors forming each pixel.
  36. Kimura Mitsuteru (2-56 ; Shiomidai 3-chome ; Shichigahama-cho Miyagi-gun ; Miyagi-ken JPX) Kudo Takeshi (Kanagawa JPX), Infrared radiation sensor.
  37. Christopher Richard Sutter ; Richard August Petelinkar ; Rebecca Edythe Reeves, Infrared reflective visually colored metallic compositions.
  38. Ray Michael (Goleta CA) Kennedy Adam M. (Santa Barbara CA), Integrated infrared microlens and gas molecule getter grating in a vacuum package.
  39. Liu Michael S. (Bloomington MN) Haviland Jeffrey S. (Plymouth MN) Yue Cheisan J. (Roseville MN), Integrated infrared sensitive bolometers.
  40. Higashi Robert E. (Minneapolis MN) Johnson Robert G. (Minnetonka MN), Integrated micromechanical sensor element.
  41. Higashi Robert E. ; Ridley Jeffrey A. ; Stratton Thomas G. ; Wood R. Andrew, Integrated silicon vacuum micropackage for infrared devices.
  42. Salatino Matthew M. ; Young William R. ; Begley Patrick A., Lid wafer bond packaging and micromachining.
  43. Feng Milton ; Shen Shyh-Chiang, Low actuation voltage microelectromechanical device and method of manufacture.
  44. Klapper Stuart H. ; Laitin Howard ; Kormos Alex L. ; Cook Lacy G. ; Masarik David M. ; Salvio Paul R., Low cost night vision system for nonmilitary surface vehicles.
  45. Beratan Howard R. ; Cho Chih-Chen, Low mass optical coating for thin film detectors.
  46. Kormos,Alexander L.; Felts,Paul D., Method and apparatus for modulating infrared radiation.
  47. Ho Chih-Ming ; Li Wen J., Method for aligning and forming microelectromechanical systems (MEMS) contour surfaces.
  48. Pogge H. Bernhard ; Davari Bijan ; Greschner Johann,DEX ; Kalter Howard L., Method for fabricating a very dense chip package.
  49. Keenan William F. (Plano TX), Method for forming uncooled infrared detector.
  50. Wood R. Andrew ; Ridley Jeffrey A. ; Higashi Robert E., Method for making a wafer-pair having sealed chambers.
  51. Montoya Thomas T., Method for probing a semiconductor wafer using a motor controlled scrub process.
  52. Wagner John J. (Eleva) Chojnacki Thomas P. (River Falls) Eberlein Delvin D. (Altoona WI), Method of fabricating silicon-based carriers.
  53. Guthrie Frank E. ; Johnson Paul O., Method of forming an electronic package with a solder seal.
  54. Gale Richard O. (Richardson TX) Mignardi Michael A. (Dallas TX), Method of protecting micromechanical devices during wafer separation.
  55. Kao Pai-Hsiang ; Mathew Ranjan J. ; De Vera Cornelio, Methods and apparatuses for singulation of microelectromechanical systems.
  56. Kamiyama Satoshi (Kawanishi JPX) Ohnaka Kiyoshi (Moriguchi JPX), Methods for soldering semiconductor devices.
  57. Gooch, Roland W.; Schimert, Thomas R.; McCardel, William L.; Ritchey, Bobbi A., Microbolometer and method for forming.
  58. Gerard Henry M. (Capistrano Beach CA), Microbolometer detector element with enhanced sensitivity.
  59. Beatty Christopher C. (Fort Collins CO), Microchip assembly with electrical element in sealed cavity.
  60. Carley L. Richard ; Reed Michael L. ; Fedder Gary K. ; Santhanam Suresh, Microelectromechanical structure and process of making same.
  61. Werner Wolfgang,DEX, Micromechanical device and method for its production.
  62. Cole Barrett E. (Bloomington MN), Microstructure design for high IR sensitivity.
  63. Foss Norman A. (North Oaks MN) Kruse ; Jr. Paul W. (Edina MN) Wood R. Andrew (Bloomington MN), Monolithic integrated dual mode IR/mm-wave focal plane sensor.
  64. Nakos James S. ; Williams Richard Q., Nonvolatile memory cell using microelectromechanical device.
  65. Hendrickson Thomas E. (Wazata MN), Photodetector signal processing.
  66. Howe Roger T. ; Franke Andrea ; King Tsu-Jae, Polycrystalline silicon germanium films for forming micro-electromechanical systems.
  67. Sparks Douglas Ray ; Jordan Larry Lee ; Beni Ruth Ellen ; Duffer Anthony Alan ; Yeh Shing, Process for bonding micromachined wafers using solder.
  68. Lin Liwei ; Cheng Yu-Ting ; Najafi Khalil ; Wise Kensall D., Process for making microstructures and microstructures made thereby.
  69. Grinberg Jan (Los Angeles CA) Welkowsky Murray S. (Chatsworth CA) Wu Chiung-Sheng (Los Angeles CA) Braatz Paul O. (Canoga Park CA), Radiation detector array using radiation sensitive bridges.
  70. Gooch Roland W., Ramped foot support.
  71. Keenan William F. (Plano TX), Readout system and process for IR detector arrays.
  72. Cheek Jon ; Whigham William A. ; Wristers Derick, Reduced boron diffusion by use of a pre-anneal.
  73. Trotta Patrick A. (Plano TX) McKenney Samuel R. (Dallas TX), Reflective chopper for infrared imaging systems.
  74. Kormos Alex L. ; Hanson Charles M., Semi-opaque chopper for thermal imaging system and method.
  75. Schimert Thomas Robert ; Eden Dayton D., Semiconductor photovoltaic diffractive resonant optical cavity infrared detector.
  76. Hanson Charles M., Solid state infrared chopper.
  77. Gooch Roland W. ; Wadsworth Mark V., Stress tolerant bolometer.
  78. Syllaios, Athanasios J.; Gooch, Roland W.; Schimert, Thomas R.; Meissner, Edward G., Sub-wavelength structures for reduction of reflective properties.
  79. Ouvrier-Buffet Jean-Louis,FRX ; Yon Jean-Jacques,FRX, Thermal detector with bolometric effect amplification.
  80. Beratan Howard R. ; Hanson Charles M., Thermal detector with nucleation element and method.
  81. Hanson Charles M. (Richardson TX), Thermal imaging system with a monolithic focal plane array and method.
  82. Hanson Charles M. (Richardson TX) Dudley Dana (Dallas TX) Robinson James E. (Dallas TX), Thermal imaging system with integrated thermal chopper.
  83. Naoki Oda JP, Thermal infrared detector provided with shield for high fill factor.
  84. Hocker G. Benjamin (Minnetonka MN) Holmen James O. (Minnetonka MN) Johnson Robert G. (Minnetonka MN), Thermal isolation microstructure.
  85. Higashi Robert E. (Bloomington MN) Holmen James O. (Minnetonka MN) Johnson Robert G. (Minnetonka MN), Thermal sensor.
  86. Eden Dayton D., Uncooled infrared detector.
  87. Eden Dayton D., Uncooled infrared detector.
  88. Keenan William F. (Plano TX), Uncooled infrared detector and method for forming the same.
  89. Wood R. Andrew (Bloomington MN), Use of vanadium oxide in microbolometer sensors.
  90. Gooch, Roland W.; Schimert, Thomas R., Vacuum package fabrication of integrated circuit components.
  91. Gooch, Roland W.; Schimert, Thomas R., Vacuum package fabrication of integrated circuit components.
  92. Roland W. Gooch, Vacuum package fabrication of microelectromechanical system devices with integrated circuit components.
  93. Kennedy Adam M. ; Sarver Charles E. ; Williams Ronald L., Vacuum package having vacuum-deposited local getter and its preparation.

이 특허를 인용한 특허 (14) 인용/피인용 타임라인 분석

  1. Boulanger, Pierre; Sharp, Barbara; Hoelter, Theodore R.; Teich, Andrew C.; Högasten, Nicholas; Scott, Jeffrey S.; Strademar, Katrin; Nussmeier, Mark; Kurth, Eric A., Compact multi-spectrum imaging with fusion.
  2. Kester, Robert T.; Hagen, Nathan A., Divided-aperture infra-red spectral imaging system for chemical detection.
  3. Wieners, John A.; Neal, Henry W., Imaging systems with digital micromirror devices (DMD).
  4. Boulanger, Pierre; Hoelter, Theodore R.; Sharp, Barbara; Kurth, Eric A., Infrared camera system architectures.
  5. Boulanger, Pierre; Hoelter, Theodore R.; Sharp, Barbara; Kurth, Eric A., Infrared camera system architectures.
  6. Hoelter, Theodore R.; Kostrzewa, Joseph; Boulanger, Pierre; Sharp, Barbara; Kurth, Eric A., Infrared camera system housing with metalized surface.
  7. Simolon, Brian; Kurth, Eric A.; Barskey, Steve; Nussmeier, Mark; Högasten, Nicholas; Hoelter, Theodore R.; Strandemar, Katrin; Boulanger, Pierre; Sharp, Barbara, Infrared imager with integrated metal layers.
  8. Teich, Andrew C.; Högasten, Nicholas; Scott, Jeffrey S.; Strandemar, Katrin; Nussmeier, Mark; Kurth, Eric A.; Hoelter, Theodore R.; Boulanger, Pierre; Sharp, Barbara, Infrared imaging enhancement with fusion.
  9. Nussmeier, Mark; Kurth, Eric A.; Högasten, Nicholas; Hoelter, Theodore R.; Strandemar, Katrin; Boulanger, Pierre; Sharp, Barbara, Low power and small form factor infrared imaging.
  10. Nussmeier, Mark; Kurth, Eric A.; Högasten, Nicholas; Hoelter, Theodore R.; Strandemar, Katrin; Boulanger, Pierre; Sharp, Barbara, Low power and small form factor infrared imaging.
  11. Nussmeier, Mark; Kurth, Eric A.; Högasten, Nicholas; Hoelter, Theodore R.; Strandemar, Katrin; Boulanger, Pierre; Sharp, Barbara, Low power and small form factor infrared imaging.
  12. Högasten, Nicholas; Hoelter, Theodore R.; Strandemar, Katrin, Non-uniformity correction techniques for infrared imaging devices.
  13. Högasten, Nicholas; Dumpert, Dwight; Hoelter, Theodore R.; Scott, Jeffrey S.; Strandemar, Katrin; Nussmeier, Mark; Kurth, Eric A.; Boulanger, Pierre; Sharp, Barbara, Time spaced infrared image enhancement.
  14. Högasten, Nicholas; Dumpert, Dwight; Hoelter, Theodore R.; Scott, Jeffrey S.; Strandemar, Katrin; Nussmeier, Mark; Kurth, Eric A.; Boulanger, Pierre; Sharp, Barbara, Time spaced infrared image enhancement.

활용도 분석정보

상세보기
다운로드
내보내기

활용도 Top5 특허

해당 특허가 속한 카테고리에서 활용도가 높은 상위 5개 콘텐츠를 보여줍니다.
더보기 버튼을 클릭하시면 더 많은 관련자료를 살펴볼 수 있습니다.

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로