Shielded RF distance telemetry pin wiring for active implantable medical devices
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61N-001/00
H03L-005/00
출원번호
US-0307306
(2006-01-31)
등록번호
US-8160705
(2012-04-17)
발명자
/ 주소
Stevenson, Robert A.
Frysz, Christine A.
Hussein, Haytham
Brendel, Richard L.
출원인 / 주소
Greatbatch Ltd
대리인 / 주소
Scalise, Michael F.
인용정보
피인용 횟수 :
48인용 특허 :
29
초록▼
In an electromagnetic interference (EMI) filter terminal for an active implantable medical device (AIMD), an insulated and shielded RF telemetry pin is provided to prevent re-radiation of unwanted stray signals, including the telemetry signal itself, to adjacent sensitive circuits or lead wires. The
In an electromagnetic interference (EMI) filter terminal for an active implantable medical device (AIMD), an insulated and shielded RF telemetry pin is provided to prevent re-radiation of unwanted stray signals, including the telemetry signal itself, to adjacent sensitive circuits or lead wires. The invention provides for an EMI filter terminal assembly for an AIMD including a radio frequency (RF) telemetry pin antenna extending therethrough. The RF telemetry pin antenna includes a conductive shield extending over a portion of the RF telemetry pin antenna in non-conductive relation with the telemetry pin, and conductively connected to a ground associated with the AIMD. The assembly may also include an insulation tube between the RF telemetry pin antenna and the conductive shield covering a portion of the RF telemetry pin antenna.
대표청구항▼
1. A terminal assembly for an active implantable medical device (AIMD), comprising: a) a housing for the AIMD, the housing having an outboard body fluid side and an inboard side;b) a hermetic feedthrough terminal comprising a ferrule hermetically sealed to the housing and supporting an insulative ma
1. A terminal assembly for an active implantable medical device (AIMD), comprising: a) a housing for the AIMD, the housing having an outboard body fluid side and an inboard side;b) a hermetic feedthrough terminal comprising a ferrule hermetically sealed to the housing and supporting an insulative material sealing between at least one conductive leadwire and an inner surface of the ferrule;c) at least one capacitor mounted to the feedthrough terminal and comprising spaced apart active and ground electrode plates encased in a dielectric material, wherein the at least one leadwire extends from the feedthrough terminal and is electrically connected to the active electrode plates of the capacitor with the ground electrode plates being electrically connected to the ferrule and the AIMD housing;d) an electrically conductive pin extending through the AIMD housing in non-conductive relation thereto, wherein the conductive pin extends from a proximal pin portion that is electrically connected to an electronic circuit board or substrate disposed within the housing remote from the feedthrough terminal to a distal portion that extends through the insulative material of the feedthrough terminal in non-conductive relation to the body fluid side and wherein the conductive pin is not electrically connected to either the active or ground electrode plates of the capacitor; ande) a conductive shield comprising a substantially continuous covering that is coaxially disposed around an outer perimeter of the conductive pin in non-conductive relationship therewith, but that conductively extends along the length of the conductive pin from a proximal shield end adjacent to the circuit board or substrate to a distal shield end electrically connected to the ground electrode plates, the ferrule and the AIMD housing. 2. The assembly of claim 1 wherein the conductive shield extends along the length of the conductive pin from the proximal shield end electrically connected to a ground plane of the circuit board or substrate to the distal shield end electrically connected to the capacitor ground electrode plates, the ferrule and the AIMD housing. 3. The assembly of claim 2 wherein the housing comprises the ground plane. 4. The assembly of claim 3 wherein the ground plane comprises the conductive ferrule. 5. The assembly of claim 1, including a conductive metal coating covering at least a portion of the outer surface of the feedthrough capacitor, wherein the metal coating is conductively connected to the ground electrode plates and the housing. 6. The assembly of claim 5 wherein the metal coating of the feedthrough capacitor is conductively connected to the conductive shield of the conductive pin. 7. The assembly of claim 6, wherein the metal coating is conductively connected to the conductive shield by a solder, a braze, or a thermal setting conductive adhesive. 8. The assembly of claim 1, further comprising a conductive metal frame covering a portion of the outer surface of the feedthrough capacitor and conductively connected to the housing and the conductive shield of the conductive pin. 9. The assembly of claim 1, wherein the AIMD is selected from the group consisting of a cardiac pacemaker, a cardiac sensing system, an implantable defibrillator, a congestive heart failure device, a hearing implant, a cochlear implant, a neurostimulator, a drug pump, a ventricular assist device, an insulin pump, a spinal cord stimulator, an implantable sensing system, a deep brain stimulator, an artificial heart, an incontinence device, a vagus nerve stimulator, a bone growth stimulator, a gastric pacemaker, and a prosthetic device. 10. The assembly of claim 1, further comprising an insulation tube between the conductive pin and the conductive shield. 11. The assembly of claim 10, wherein the insulation tube is selected from the group consisting of of Kovar, a polyimide, Teflon, silicone, and a conductive heat shrink tubing. 12. The assembly of claim 1, wherein the conductive shield is selected from the group consisting of gold, copper, and nickel. 13. The assembly of claim 1, wherein the conductive shield is selected from the group consisting of a solid metal tube, a wound wire tube, a braided wire tube or a wrapped foil tube. 14. The assembly of claim 13, wherein the wound wire or braided wire material comprises 304V stainless steel. 15. The assembly of claim 1 wherein the circuit board or substrate includes a wire bond pad, and wherein the proximal pin portion is conductively connected to the wire bond pad of the circuit board or substrate by a thermal bond, an ultrasonic bond, a solder or a conductive adhesive. 16. The assembly of claim 15, further comprising a second wire bond pad on the substrate conductively connected to the conductive shield of the conductive pin. 17. The assembly of claim 16, wherein the proximal shield end is conductively connected to the second wire bond pad by a thermal bond, an ultrasonic bond, a solder, or a conductive adhesive. 18. The assembly of claim 1, further comprising a counterbore in the insulative material of the feedthrough terminal, the counterbore being disposed around the conductive pin. 19. The assembly of claim 18, further comprising a notch or swage on the conductive pin inside the feedthrough terminal. 20. The assembly of claim 5, further comprising an exterior insulation layer over the conductive shield of the conductive pin. 21. The assembly of claim 20, wherein the exterior insulation layer comprises polyimide tubing. 22. The assembly of claim 20, wherein the conductive shield is conductively connected to the ground electrode plates by removing a portion of the exterior insulation layer at the proximal shield end. 23. The assembly of claim 1 wherein the capacitor is supported on the feedthrough terminal adjacent to the inboard side of the AIMD housing. 24. A terminal assembly for an active implantable medical device (AIMD), comprising: a) a housing for the AIMD, the housing having an outboard body fluid side and an inboard side;b) a hermetic feedthrough terminal comprising a ferrule hermetically sealed to the housing and supporting an insulative material sealing between at least one conductive leadwire and an inner surface of the ferrule;c) at least one capacitor mounted to the feedthrough terminal and comprising spaced apart active and ground electrode plates encased in a dielectric material, wherein the at least one leadwire extends from the feedthrough terminal and is electrically connected to the active electrode plates of the capacitor with the ground electrode plates being electrically connected to the ferrule and the AIMD housing;d) an electrically conductive pin extending through the housing in non-conductive relation thereto, wherein the conductive pin extends from a proximal pin portion that is electrically connected to a radio frequency (RF) detection circuit mounted on a circuit board or substrate disposed within the housing remote from the feedthrough terminal to a distal portion that extends through the insulative material of the feedthrough terminal in a non-conductive relation to the body fluid side and wherein the conductive pin is not electrically connected to either the active or ground electrode plates of the capacitor;e) a conductive shield comprising a substantially continuous covering that is coaxially disposed around an outer perimeter of the conductive pin in non-conductive relationship therewith, but that conductively extends along the length of the conductive pin from a proximal shield end electrically connected a ground plane of the circuit board or substrate to a distal shield end electrically connected to the ground electrode plates, the ferrule and the AIMD housing. 25. A terminal assembly for an active implantable medical device (AIMD), comprising: a) a housing for the AIMD, the housing having an outboard body fluid side and an inboard side;b) a hermetic feedthrough terminal comprising an insulative material sealing between at least one conductive leadwire and an inner surface of an opening in the housing;c) at least one capacitor mounted to the feedthrough terminal and comprising spaced apart active and ground electrode plates encased in a dielectric material, wherein the at least one leadwire extends from the feedthrough terminal and is electrically connected to the active electrode plates of the capacitor with the ground electrode plates being electrically connected to the AIMD housing;d) an electrically conductive pin extending through the AIMD housing in non-conductive relation thereto, wherein the conductive pin extends from a proximal pin portion that is electrically connected to an electronic circuit board or substrate disposed within the housing remote from the feedthrough terminal to a distal portion that extends through the insulative material of the feedthrough terminal in non-conductive relation to the body fluid side and wherein the conductive pin is not electrically connected to either the active or around electrode plates of the capacitor; ande) a conductive shield comprising a substantially continuous covering that is coaxially disposed around an outer perimeter of the conductive pin in non-conductive relationship therewith, but that conductively extends along the length of the conductive pin from a proximal shield end adjacent to the circuit board or substrate to a distal shield end electrically connected to the ground electrode plates and the AIMD housing.
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