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Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/00
  • B23P-009/00
  • B21D-039/00
  • B32B-003/00
출원번호 US-0784330 (2010-05-20)
등록번호 US-8164909 (2012-04-24)
우선권정보 JP-2004-110879 (2004-04-05); JP-2004-221700 (2004-07-29)
발명자 / 주소
  • Nagase, Toshiyuki
  • Nagatomo, Yoshiyuki
  • Kubo, Kazuaki
  • Negishi, Takeshi
출원인 / 주소
  • Mitsubishi Materials Corporation
대리인 / 주소
    Leason Ellis LLP.
인용정보 피인용 횟수 : 2  인용 특허 : 39

초록

A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluore

대표청구항

1. A method of manufacturing an Al/AlN joint material, comprising: a first step of obtaining an AlN sintering body having a porous layer on a surface thereof by sintering a powder of AlN:a second step of joining an Al member to the porous layer via a brazing material:a third step of removing a weak

이 특허에 인용된 특허 (39)

  1. Yamagata Shin-ichi,JPX ; Suwata Osamu,JPX ; Kawai Chihiro,JPX ; Fukui Akira,JPX ; Takeda Yoshinobu,JPX, Aluminum base member for semiconductor device containing a nitrogen rich surface and method for producing the same.
  2. Sasame Akira (Hyogo JPX) Sakanoue Hitoyuki (Hyogo JPX), Aluminum nitride sintered body having a metallized coating layer on its surface.
  3. Horiguchi Akihiro (Yokohama JPX) Kasori Mituo (Kawasaki JPX) Ueno Fumio (Kawasaki JPX) Sato Hideki (Yokohama JPX) Mizunoya Nobuyuki (Yokohama JPX) Endo Mitsuyoshi (Yamato JPX) Tanaka Shun-ichiro (Yok, Aluminum nitride sintered body having conductive metallized layer.
  4. Shinosawa, Katsuhiro; Shirai, Takao; Nakayama, Noritaka, Aluminum nitride substrate and thin film substrate therewith, and manufacturing method thereof.
  5. Kadomura, Shingo; Takatsu, Kei; Hirano, Shinsuke; Suzuki, Nobuyuki, Aluminum nitride/aluminum base composite material and a method for producing thereof.
  6. Osanai,Hideyo; Ideguchi,Satoru, Aluminum/ceramic bonding substrate and method for producing same.
  7. Feygin Michael (2301 205th St. ; Suite 107 Torrance CA 90501), Apparatus and method for forming an integral object from laminations.
  8. Naba Takayuki,JPX, Ceramic circuit board.
  9. Naba, Takayuki; Yamaguchi, Haruhiko, Ceramic circuit board and method of manufacturing the same.
  10. Nagase Toshiyuki,JPX ; Kuromitsu Yoshirou,JPX ; Sugamura Kunio,JPX ; Kanda Yoshio,JPX ; Hatsushika Masafumi,JPX ; Otsuki Masato,JPX, Ceramic circuit board with heat sink.
  11. Yoshida Hideaki (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX) Toriumi Makoto (Saitama JPX) Yuzawa Michio (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
  12. Yoshida Hideaki (Saitama JPX) Toriumi Makoto (Saitama JPX) Tanaka Hirokazu (Saitama JPX) Umezawa Masao (Saitama JPX) Yuzawa Michio (Saitama JPX) Kuromitsu Yoshirou (Saitama JPX), Ceramic substrate used for fabricating electric or electronic circuit.
  13. Hirano Masanori (Toyoake JPX) Yamauchi Noriyoshi (Yokkaichi JPX), Ceramic-metal composite structure and process of producing same.
  14. Cockbain Alan Gray (Inglewood Church Road Evenley ; near Brackley ; Northamptonshire EN) Latimer Michael John (355 ; Birchfield Road East Northampton ; Northamptonshire EN) Parr Norman Lawrence (2 ; , Composite materials.
  15. Sasaki Kazutaka,JPX ; Nakata Hirohiko,JPX, Copper circuit junction substrate and method of producing the same.
  16. Hashimoto,Masaki; Morita,Kazushige; Kakui,Mikio; Tanaka,Yuji; Sakamoto,Masayuki, Electrophotographic photoreceptor and method for producing the same.
  17. Yamakawa Akira (Hyogo JPX) Miyake Masaya (Hyogo JPX) Sakanoue Hitoyuki (Hyogo JPX) Takeuchi Hisao (Hyogo JPX) Sogabe Koichi (Hyogo JPX) Sasame Akira (Hyogo JPX), Heat-conductive aluminum nitride sintered body and method of manufacturing the same.
  18. Yamakawa Akira (Hyogo JPX) Miyake Masaya (Hyogo JPX) Sakanoue Hitoyuki (Hyogo JPX) Takeuchi Hisao (Hyogo JPX) Sogabe Koichi (Hyogo JPX) Sasame Akira (Hyogo JPX), Heat-conductive aluminum nitride sintered body and method of manufacturing the same.
  19. Nagase Toshiyuki (Omiya JPX) Kanda Yoshio (Omiya JPX) Kuromitu Yoshiro (Omiya JPX) Hatsushika Masafumi (Omiya JPX) Tanaka Hirokazu (Omiya JPX), Highly heat-radiating ceramic package.
  20. Kiyoshi Araki ; Masahiro Kida JP; Takahiro Ishikawa JP; Yuki Bessyo JP; Takuma Makino JP, Laminated radiation member, power semiconductor apparatus, and method for producing the same.
  21. Osanai,Hideyo; Furo,Masahiro, Metal-ceramic circuit board.
  22. Sakuraba Masami,JPX ; Kimura Masami,JPX ; Takahara Masaya,JPX ; Nakamura Junji,JPX, Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method.
  23. Karandikar,Prashant G.; Rossing, legal representative,Marlene; Rossing, deceased,Barry R., Method for brazing ceramic-containing bodies, and articles made thereby.
  24. Rossing, Barry R.; Karandikar, Prashant G., Method for brazing ceramic-containing bodies, and articles made thereby.
  25. Mizunoya Nobuyuki (Yokohama JPX) Kohama Hajime (Yokohama JPX) Sugiura Yasuyuki (Yokohama JPX), Method for directly bonding ceramic and metal members and laminated body of the same.
  26. Fushii Yasuhito (Omuta JPX) Nakamura Miyuki (Omuta JPX) Nakajima Yukihiko (Omuta JPX) Kato Kazuo (Machida JPX) Miyai Akira (Machida JPX) Hiruta Kazuyuki (Machida JPX), Method for forming a ceramic circuit board.
  27. Hirano, Koichi; Yamashita, Yoshihisa; Nakatani, Seiichi, Method for manufacturing circuit board and circuit board and power conversion module using the same.
  28. Ishikawa,Takahiro; Kida,Masahiro; Ishikawa,Shuhei; Nakayama,Nobuaki, Method for producing a circuit board.
  29. Ohashi Tsuneaki,JPX ; Fujii Tomoyuki,JPX, Method of manufacturing joint body.
  30. Lucke,Olaf; Thyzel,Bernd, Power electronics component.
  31. Hirose Yoshiyuki,JPX ; Sasaki Kazutaka,JPX ; Shimazu Mitsuru,JPX ; Nakata Hirohiko,JPX, Power module board and power module using the board.
  32. Sakuraba Masami,JPX ; Kimura Masami,JPX ; Nakamura Junji,JPX ; Takahara Masaya,JPX, Power module circuit board and a process for the manufacture thereof.
  33. Nagatomo Yoshiyuki,JPX ; Nagase Toshiyuki,JPX ; Kubo Kazuaki,JPX ; Shimamura Shoichi,JPX, Power module substrate.
  34. Sakuraba Masami,JPX ; Kimura Masami,JPX ; Nakamura Junji,JPX ; Takahara Masaya,JPX, Semiconductor substrates of high reliability ceramic metal composites.
  35. Ikeda Kazuo,JPX ; Komorita Hiroshi,JPX ; Sato Yoshitoshi,JPX ; Komatsu Michiyasu,JPX ; Mizunoya Nobuyuki,JPX, Silicon nitride circuit board.
  36. Ikeda Kazuo,JPX ; Komorita Hiroshi,JPX ; Sato Yoshitoshi,JPX ; Komatsu Michiyasu,JPX ; Mizunoya Nobuyuki,JPX, Silicon nitride circuit board.
  37. Ikeda Kazuo,JPX ; Komorita Hiroshi,JPX ; Sato Yoshitoshi,JPX ; Komatsu Michiyasu,JPX ; Mizunoya Nobuyuki,JPX, Silicon nitride circuit board.
  38. Takeda, Yukio; Ogihara, Satoru; Ura, Mitsuru; Nakamura, Kousuke; Asai, Tadamichi; Ohkoshi, Tokio; Matsushita, Yasuo; Maeda, Kunihiro, Sintered aluminum nitride and semi-conductor device using the same.
  39. Takeda Yukio (Hitachi JPX) Ogihara Satoru (Hitachi JPX) Ura Mitsuru (Hitachi JPX) Nakamura Kousuke (Hitachi JPX) Asai Tadamichi (Ibaraki JPX) Ohkoshi Tokio (Hitachi JPX) Matsushita Yasuo (Hitachi JPX, Sintered aluminum nitride semi-conductor device.

이 특허를 인용한 특허 (2)

  1. Mori, Shogo; Kono, Eiji, Cooling device.
  2. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
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