IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0370319
(2009-02-12)
|
등록번호 |
US-8164911
(2012-04-24)
|
발명자
/ 주소 |
|
출원인 / 주소 |
- Delphi Technologies, Inc.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
6 |
초록
▼
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circui
A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
대표청구항
▼
1. A lightweight automotive electronic device comprising: at least one electronic circuit component; anda housing assembly substantially formed of a composite of relatively rigid polymer based material and electrically conductive material operable to substantially enclose and to shield said at least
1. A lightweight automotive electronic device comprising: at least one electronic circuit component; anda housing assembly substantially formed of a composite of relatively rigid polymer based material and electrically conductive material operable to substantially enclose and to shield said at least one electronic circuit component from electrical anomalies including RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection) and/or ESD (electrostatic discharge),wherein said housing assembly includes at least one window formed therein, said window substantially closed by an embossed segment of said conductive material operative to effect electrical interconnection between said conductive material and said at least one electronic circuit component, andwherein said conductive material is insert molded within said polymer based material. 2. The electronic device of claim 1, wherein said housing assembly comprises: a generally box-like case having integrally formed wall portions and an opening for receiving said electronic component; anda closure member cooperating with the case to enclose electronic system subassemblies within a cavity defined by said housing assembly. 3. The electronic device of claim 2, wherein said window is formed in one of said wall portions. 4. The electronic device of claim 1, wherein said conductive material comprises open mesh wire screen, wherein said window is operative to enable the flow of ambient fluid therethrough. 5. The electronic device of claim 1, wherein said embossed portion of conductive material defines an elongated upset bead. 6. The electronic device of claim 5, wherein said upset bead projects outwardly. 7. The electronic device of claim 5, wherein said upset bead projects inwardly. 8. The electronic device of claim 5, wherein said upset bead projects both inwardly and outwardly. 9. The electronic device of claim 5, wherein said upset bead extends peripherally adjacent edges of said window. 10. The electronic device of claim 9, wherein said upset bead extends peripherally substantially about the entire circumference of said window. 11. The electronic device of claim 5, wherein the embossed portion of said conductive material comprises a plurality of generally concentric elongated upset beads. 12. The electronic device of claim 1, further comprising a segment of rigid polymer based material resiliently carried within said window for limited displacement with respect to said housing assembly. 13. The electronic device of claim 12, wherein said segment of rigid polymer based material is discrete and separated from the polymer based material forming an adjacent wall portion of said housing assembly. 14. The electronic device of claim 12, wherein said segment of rigid polymer based material comprises a cantilevered extension of the polymer based material forming an adjacent wall portion of said housing assembly. 15. A lightweight automotive electronic device comprising: at least one electronic circuit component; anda housing assembly substantially formed of a composite of relatively rigid polymer based material and electrically conductive material operable to substantially enclose and to shield said at least one electronic circuit component from electrical anomalies including RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection) and/or ESD (electrostatic discharge),wherein said housing assembly includes at least one window formed therein, said window substantially closed by an embossed segment of said conductive material operative to effect electrical interconnection between said conductive material and said at least one electronic circuit component, andwherein said conductive material is disposed substantially adjacent inner surfaces of said housing assembly. 16. A lightweight automotive electronic device comprising: at least one electronic circuit component; anda housing assembly substantially formed of a composite of relatively rigid polymer based material and electrically conductive material operable to substantially enclose and to shield said at least one electronic circuit component from electrical anomalies including RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection) and/or ESD (electrostatic discharge),wherein said housing assembly includes at least one window formed therein, said window substantially closed by an embossed segment of said conductive material operative to effect electrical interconnection between said conductive material and said at least one electronic circuit component,said electronic device further comprising a segment of rigid polymer based material resiliently carried within said window for limited displacement with respect to said housing assembly,wherein said segment of polymer based material is integrally formed with said embossed segment of conductive material. 17. A lightweight automotive electronic device comprising: at least one electronic circuit component; and a housing assembly substantially formed of a composite of relatively rigid polymer based material and electrically conductive material operable to substantially enclose and to shield said at least one electronic circuit component from electrical anomalies including RFI (radio frequency interference), EMI (electromagnetic interference), BCI (bulk current injection) and/or ESD (electrostatic discharge), wherein said housing assembly includes at least one window formed therein, said window substantially closed by an embossed segment of said conductive material operative to effect electrical interconnection between said conductive material and said at least one electronic circuit component,said electronic device further comprising a segment of rigid polymer based material resiliently carried within said window for limited displacement with respect to said housing assembly,wherein said segment of polymer based material defines an engagement surface for limiting displacement of an adjacent structural element. 18. The electronic device of claim 17, wherein said adjacent structural element comprises an electronic subassembly mounting bracket disposed within said housing assembly. 19. The electronic device of claim 17, wherein said adjacent structural element comprises a device disposed externally of said housing assembly.
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