IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0217311
(2011-08-25)
|
등록번호 |
US-8173520
(2012-05-08)
|
우선권정보 |
JP-2002-316397 (2002-10-30) |
발명자
/ 주소 |
- Yamazaki, Shunpei
- Takayama, Toru
- Maruyama, Junya
- Ohno, Yumiko
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
84 |
초록
▼
It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the
It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present invention to bond a layer to be peeled to various base materials to provide a lighter semiconductor device and a manufacturing method thereof. Particularly, it is an object to bond various elements typified by a TFT, (a thin film diode, a photoelectric conversion element comprising a PIN junction of silicon, or a silicon resistance element) to a flexible film to provide a lighter semiconductor device and a manufacturing method thereof.
대표청구항
▼
1. A method of manufacturing a display device including an organic light-emitting element, comprising: forming a metal layer over a first substrate;removing a portion of the metal layer formed over a peripheral portion of the first substrate;forming an oxide layer in contact with the metal layer;for
1. A method of manufacturing a display device including an organic light-emitting element, comprising: forming a metal layer over a first substrate;removing a portion of the metal layer formed over a peripheral portion of the first substrate;forming an oxide layer in contact with the metal layer;forming a layer to be peeled including a thin film transistor and a first electrode over the oxide layer;forming a layer including an organic material over the first electrode;forming a second electrode comprising a transparent electrode over the layer including the organic material;separating the layer to be peeled from the first substrate;fixing a second substrate under the layer to be peeled using a second adhesive,fixing the layer to be peeled over a third substrate using a first adhesive; andwherein the third substrate has a color filter. 2. The method according to claim 1, further comprising: irradiating a laser beam to the metal layer before separating the layer to be peeled from the first substrate. 3. The method according to claim 1, wherein the portion of the metal layer is removed with dry etching. 4. The method according to claim 1, wherein the metal layer is a single layer comprising an element selected from Ti, Ta, W, Mo, Cr, Nd, Fe, Ni, Co, Zr, and Zn, or one of an alloy material and a compound material including the element as its main component, or a lamination layer thereof. 5. The method according to claim 1, wherein the first substrate is a glass substrate. 6. The method according to claim 1, wherein the color filter overlaps with the first electrode. 7. The method according to claim 1, wherein the second substrate comprises a metal or a plastic. 8. The method according to claim 1, wherein the layer including the organic material is selectively formed over the first electrode by evaporation that uses an evaporation mask. 9. The method according to claim 1, wherein the layer including the organic material is selectively formed over the first electrode by ink-jet. 10. A method of manufacturing a display device including an organic light-emitting element, comprising: forming a metal layer over a first substrate;removing a portion of the metal layer formed over a peripheral portion of the first substrate;forming an oxide layer in contact with the metal layer;forming a layer to be peeled including a thin film transistor and an organic light-emitting element over the oxide layer;bonding a support to the layer to be peeled;separating the layer to be peeled from the first substrate after bonding the support;fixing a second substrate under the layer to be peeled using a second adhesive; andseparating the layer to be peeled from the support after fixing a second substrate,fixing the layer to be peeled over a third substrate using a first adhesive; andwherein the second substrate comprises a metal or a plastic,wherein the third substrate has a color filter. 11. The method according to claim 10, further comprising: irradiating a laser beam to the metal layer before separating the layer to be peeled from the support. 12. The method according to claim 10, wherein the portion of the metal layer is removed with dry etching. 13. The method according to claim 10, wherein the metal layer is a single layer comprising an element selected from Ti, Ta, W, Mo, Cr, Nd, Fe, Ni, Co, Zr, and Zn, or one of an alloy material and a compound material including the element as its main component, or a lamination layer thereof. 14. The method according to claim 10, wherein the first substrate is a glass substrate.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.