초록 ▼

Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may

Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

대표청구항 ▼

1. A composite structure comprising a conductive surfacing film formed on a prepreg layup, wherein said surfacing film comprises silver flakes distributed substantially uniformly throughout the film in a substantially interconnected, lamellar configuration, and is formed from a curable thermosetting

1. A composite structure comprising a conductive surfacing film formed on a prepreg layup, wherein said surfacing film comprises silver flakes distributed substantially uniformly throughout the film in a substantially interconnected, lamellar configuration, and is formed from a curable thermosetting composition comprising: a. at least one multifunctional epoxy resin;b. at least one curing agent selected from the group consisting of: aromatic primary amines, bisureas, boron trifluoride complexes, and dicyandiamide;c. at least one toughening agent having a functional group selected from epoxy groups, carboxylic acid groups, amino groups and hydroxyl groups capable of reacting with other components of the composition;d. non-conductive fillers;e. silver flakes in an amount greater than about 35 wt. %, based on the total weight of the composition,said surfacing film has an electrical resistivity of less than 500 mΩ/sq and a film weight in the range of 0.01-0.15 psf (pounds per square foot), andsaid prepreg layup is comprised of a plurality of prepreg layers, each of said prepreg layers being formed from a sheet of fibers impregnated with a matrix material. 2. The composite structure of claim 1, wherein said at least one multifunctional epoxy resin comprises a combination of Diglycidylether of Bisphenol A and at least one of Tetraglycidylether methylenedianiline and Diglycidylether of Tetrabromo Bisphenol A. 3. The composite structure of claim 1, wherein said at least one curing agent is selected from the group consisting of: dicyandiamide, Bisureas, 4,4′-Methylene bis-(phenyl dimethylurea), 4,4′-diaminodiphenyl sulfone (4,4′-DDS), and BF3. 4. The composite structure of claim 1, wherein said at least one toughening agent is selected from the group consisting of: carboxylated nitriles, carboxyl-terminated butadiene acrylonitrile (CTBN), carboxyl-terminated polybutadiene (CTB), polyether sulfone, polyether ether ketone (PEEK), polyetherketoneketone (PEKK), liquid rubber, and core/shell rubber particles. 5. The composite structure of claim 1, wherein said thermosetting composition further comprises ceramic microspheres and fumed silica, and said at least one multifunctional epoxy resin comprises a combination of Diglycidylether of Bisphenol A, Tetraglycidylether methylenedianiline, and Diglycidylether of Tetrabromo Bisphenol A,said at least one curing agent comprises dicyandiamide and bisureas,said at least one toughening agent comprises carboxylated nitrile and either carboxyl-terminated butadiene acrylonitrile (CTBN) or carboxyl-terminated polybutadiene (CTB). 6. The composite structure of claim 1, wherein said curable thermosetting composition further comprises a chain extension agent selected from the group consisting of: bisphenol A, tetrabromo bisphenol A (TBBA), bisphenol Z, tetramethyl bisphenol A (TMBP-A), and bisphenol fluorines. 7. The composite structure of claim 1, wherein said thermosetting composition further comprises a UV stabilizer selected from the group consisting of: butylated hydroxytoluene (BHT), 2-hydroxy-4-methoxy-benzophenone, 2,4-Bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-octyloxyphenyl)-1,3,5-triazine, 3,5-Di-tert-butyl-4-hydroxybenzoic acid, n-hexadecyl ester, titanium dioxide, ultra-fine zinc oxide, and carbon black. 8. The composite structure of claim 1, wherein said thermosetting composition further comprises at least one of silver nanowires, carbon nanotubes, conductive carbon black, silver coated copper flake, and silver-coated glass balloons. 9. The composite structure of claim 1, wherein said thermosetting composition further comprises non-conductive fillers. 10. The composite structure of claim 9, wherein said non-conductive fillers comprise ceramic microspheres.