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A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil ass

A cooling system for reducing the thermal energy transfer from the heated spots of an RF coil assembly to a patient bore of an MRI system is disclosed. The MRI system includes a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF coil assembly positioned within the RF space and about the patient bore. The cooling system is positioned within the RF space and includes a plurality of cooling modules configured to reduce an operating temperature of the MRI system. Each of the plurality of cooling modules further includes a thermoelectric cooler thermally coupled to the RF coil and a heat sink thermally coupled to the thermoelectric cooler opposite from the RF coil. The thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler.

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1. An MRI apparatus comprising: a magnetic resonance imaging (MRI) system having a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF transceiver system and an RF switch controlled by a pulse module to transmit RF signals to an RF coil a

1. An MRI apparatus comprising: a magnetic resonance imaging (MRI) system having a plurality of gradient coils positioned about a bore of a magnet, an RF shield formed about an RF space, and an RF transceiver system and an RF switch controlled by a pulse module to transmit RF signals to an RF coil assembly positioned within the RF space and about a patient bore so as to acquire MR images; anda cooling system positioned within the RF space and including a plurality of cooling modules configured to reduce an operating temperature of the MRI system, wherein each of the plurality of cooling modules comprises: a thermoelectric cooler thermally coupled to the RF coil; anda heat sink thermally coupled to the thermoelectric cooler and mounted on a side of the thermoelectric cooler facing away from the RF coil;wherein the thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler. 2. The MRI apparatus of claim 1 wherein the plurality of cooling modules extend out from the RF coil and into a cooling channel formed between the RF shield and the RF coil. 3. The MRI apparatus of claim 2 wherein the heat extracted from the RF coil is rejected out from the cooling module through the heat sink and into air flowing through the cooling channel. 4. The MRI apparatus of claim 1 wherein the thermoelectric cooler comprises: a pair of electrically insulating substrates;a plurality of thermoelectric elements positioned between the pair of electrically insulating substrates; anda diffusion barrier formed on each of a top surface and a bottom surface of each of the plurality of thermoelectric elements, wherein the diffusion barrier is formed of a non-magnetic material. 5. The MRI apparatus of claim 1 wherein the cooling system comprises: a power source configured to generate current for transmission to the plurality of cooling modules; anda controller programmed to control the amount of current generated by the power source for transmission to the plurality of cooling modules, thereby controlling an amount of heat extracted from the RF coil by the thermoelectric cooler. 6. The MRI apparatus of claim 5 wherein the controller is programmed to: receive an input on a desired imaging area temperature;monitor an actual imaging area temperature;determine an amount of current needed from the power source, for transmission to the plurality of cooling modules, to modify the actual imaging area temperature to the desired imaging area temperature; andcontrol the power source to generate the needed amount of current. 7. The MRI apparatus of claim 1 wherein the RF coil comprises: a pair of end rings; anda plurality of rungs extending between the pair of end rings. 8. The MRI apparatus of claim 7 wherein the cooling system comprises a pair of cooling modules mounted on each of the plurality of rungs, each pair of cooling modules mounted on opposing ends of a respective rung. 9. The MRI apparatus of claim 7 wherein the cooling system comprises: a vapor chamber mounted on each of the plurality of rungs and running a length thereof, the vapor chamber being in thermal contact with a respective rung; anda cooling module mounted on each vapor chamber at a central area of each of the rungs between the end rings. 10. The MRI apparatus of claim 7 wherein the cooling system comprises a mounting bracket associated with each of the plurality of cooling modules, and wherein each of the mounting brackets is configured to compression mount a cooling module to a respective rung. 11. The MRI apparatus of claim 10 wherein the mounting bracket comprises: a fixation portion; anda mounting portion extending out from the fixation portion and comprising a plurality of legs arranged around a perimeter of the mounting portion;wherein the plurality of legs is configured to mate with the heat sink to exert a pressure thereon to compression mount a respective one of the plurality of cooling modules to a respective rung. 12. The MRI apparatus of claim 11 wherein the mounting portion includes an opening formed therethrough to promote air flow across the heat sink. 13. The MRI apparatus of claim 11 wherein the cooling system further comprises a compression band configured to secure the mounting brackets to an RF former, the compression encircling the RF former to compression mount the fixation portion to the RF former. 14. The MRI apparatus of claim 1 wherein the heat sink is formed from a ceramic or stainless steel. 15. A method for manufacturing a cooling system for reducing operating temperature of an MRI system, wherein the MRI system includes an RF coil, a set of gradient coils and an RF shield, the RF shield formed about an RF space, the RF coil positioned within the RF space and formed about an imaging area, and the gradient coils formed about the RF shield such that the shield de-couples the RF coil from the gradient coils, the method comprising the steps of: providing a plurality of cooling modules, each of the plurality of cooling modules comprising a thermoelectric cooler and a heat sink affixed to the thermoelectric cooler;mounting each of the plurality of cooling modules to the RF coil such that the thermoelectric cooler is coupled to the RF coil; andelectrically connecting a power source to the plurality of cooling modules to provide power thereto for reducing the operating temperature of the MRI system. 16. The method of claim 15 wherein mounting each of the plurality of cooling modules to the RF coil comprises: providing a mounting bracket comprising a fixation portion and a mounting portion having a plurality of legs formed thereon;securing the fixation portion of the mounting bracket to an RF former;positioning the compression portion of the mounting bracket adjacently to the heat sink of the cooling module such that the plurality of legs are in contact with the heat sink;applying a compressive force on the heat sink by way of the plurality of legs such that the cooling module is compression mounted on the RF coil. 17. The method of claim 16 wherein securing the fixation portion of the mounting bracket to the RF former comprises: providing a compression band configured to encircle the RF former; andtightening the compression band to compression mount the fixation portion of the mounting bracket to the RF former. 18. The method of claim 15 further comprising providing a controller operatively connected to the power source, the controller configured to control an amount of current generated by the power source. 19. A cooling system for reducing MRI system operating temperature, where the MRI system includes an RF coil, a set of gradient coils and an RF shield, the RF shield formed about an RF space, the RF coil positioned within the RF space and formed about an imaging area, and the gradient coils formed about the RF shield such that the RF shield de-couples the RF coil from the gradient coils, the cooling system comprising: a plurality of cooling modules positioned within the RF space and configured to extract heat from the RF coil, each of the plurality of cooling modules comprising: a thermoelectric cooler positioned adjacently to a rung of the RF coil; anda heat spreader mounted on a side of the thermoelectric cooler opposite from the RF coil; wherein the thermoelectric cooler is configured to extract heat from the RF coil when a current is applied to the thermoelectric cooler and transfer the heat to the heat spreader. 20. The cooling system of claim 19 further comprising: a power source configured to generate current for transmission to the plurality of cooling modules; anda controller programmed to control the amount of current generated by the power source, thereby controlling an amount of heat extracted from the RF coil by the thermoelectric cooler. 21. The cooling system of claim 20 wherein the controller is programmed to: receive an input on a desired imaging area temperature;monitor an actual imaging area temperature;determine an amount of current needed from the power source, for transmission to the cooling modules, to modify the actual imaging area temperature to the desired imaging area temperature; andcontrol the power source to generate the needed amount of current. 22. The cooling system of claim 19 further comprising a plurality of mounting brackets configured to compression mount the plurality of cooling modules to the RF coil. 23. The cooling system of claim 22 wherein each of the plurality of mounting brackets comprises: a fixation portion;a mounting portion extending out from the fixation portion and comprising a central region and an outer region, wherein the outer region includes a plurality of legs extending transversely from the mounting portion;wherein the plurality of legs are configured to mate with the heat spreader to exert a pressure thereon to compression mount a cooling module of the plurality of cooling modules to the RF coil. 24. The cooling system of claim 23 wherein the central region of the mounting portion includes an opening formed therethrough to promote air flow across the heat spreader. 25. The cooling system of claim 19 wherein the thermoelectric cooler comprises: a pair of electrically insulating substrates;a plurality of thermoelectric elements positioned between the pair of electrically insulating substrates; anda diffusion barrier formed on each of a top surface and a bottom surface of each of the plurality of thermoelectric elements, wherein the diffusion barrier is formed of a non-magnetic material.