초록 ▼

Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning part

Disclosed is a substrate cleaning method for prevent damage to a pattern formed on a substrate. The substrate cleaning method includes cleaning the substrate by striking cleaning particulates carried in a flow of dry air or inert gas against a surface of the substrate, and removing the cleaning particulates.

대표청구항 ▼

1. A substrate cleaning method for cleaning particles on a substrate, comprising the steps of: mixing cleaning particulates made of a solid material only with dry air or inert gas;flowing the cleaning particulates mixed only with dry air or inert gas toward a surface of the substrate so that the cle

1. A substrate cleaning method for cleaning particles on a substrate, comprising the steps of: mixing cleaning particulates made of a solid material only with dry air or inert gas;flowing the cleaning particulates mixed only with dry air or inert gas toward a surface of the substrate so that the cleaning particulates strike the particles on the substrate and the particles rise from the surface of the substrate;removing the particles from the substrate by an air current generated by rotating the substrate; andremoving the cleaning particulates from the substrate,wherein the mixing is performed using a mixing box in which a mesh is used to filter the cleaning particulates before the cleaning particulates are mixed only with the dry air or inert gas. 2. The substrate cleaning method of claim 1, wherein each of the cleaning particulates has a particle diameter ranging from 100 nm to 100 μm. 3. The substrate cleaning method of claim 1, wherein the substrate is rotated during the flowing step. 4. The substrate cleaning method of claim 1, wherein removing the cleaning particulates comprises supplying a rinsing liquid to the substrate. 5. The substrate cleaning method of claim 1, wherein removing the cleaning particulates comprises supplying inert gas to the substrate. 6. The substrate cleaning method of claim 1, wherein the cleaning particulates are made of a water-soluble oxide. 7. The substrate cleaning method of claim 1, wherein the cleaning particulates are made of latex. 8. The substrate cleaning method of claim 1, wherein a pattern is formed on the substrate. 9. A computer-readable storage medium storing a control program executed on a computer, the control program allowing the computer to control a substrate cleaning apparatus to perform the substrate cleaning method of claim 1. 10. The substrate cleaning method of claim 1, wherein the mixing box includes a vessel having water and the cleaning particulates dissolved therein, and the dissolved cleaning particulates are subsequently separated from the water by a heater to be mixed with the dry air or inert gas. 11. The substrate cleaning method of claim 4, wherein the rinsing liquid has a pH between 7 and 11. 12. The substrate cleaning method of claim 4, further comprising drying the substrate by rotating the substrate to remove the rinsing liquid from the surface of the substrate after the supply of the rinsing liquid. 13. The substrate cleaning method of claim 4, wherein the cleaning particulates are made of a material having a negative zeta potential in the rinsing liquid. 14. The substrate cleaning method of claim 6, wherein the oxide comprises CaO or Y2O3.