[특허]Coaxial cable to printed circuit board interface module

[미국특허] Coaxial cable to printed circuit board interface module 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01K-003/10 H05K-003/26 H05K-003/10
출원번호	US-0315811 (2008-12-04)
등록번호	US-8201328 (2012-06-19)
발명자 / 주소	Yaghmai, Roya Parrish, Frank B. DeLessert, Daniel
출원인 / 주소	Tyco Electronics Corporation
인용정보	피인용 횟수 : 1 인용 특허 : 44

초록 ▼

In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.

대표청구항 ▼

1. A method for constructing an interface module comprising: (a) constructing a board comprising a signal via through the board, and comprising at least one ground via extending through the board;(b) back drilling the signal via to create a center conductor hole above a remaining portion of the signal via;(c) back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced;(d) plating the shield opening and the reduced height center conductor hole;(e) back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated reduced height center conductor hole. 2. The method of claim 1, wherein back drilling to remove a portion of the plating between the plated shield opening and the plated remaining portion of the center conductor hole comprises removing a portion of the board such that the drilling to remove the portion of the plating furthering reduces the height of the center conductor hole. 3. The method of claim 1, further comprising inserting a coaxial cable into the board and electrically bonding a center conductor of the coaxial cable to the plated center conductor hole and electrically bonding a shield of the coaxial cable to the plated shield hole. 4. The method of claim 1, wherein constructing the board further comprises: (a) plating a coax side of the board; and(b) etching the coax side to create a shield pad electrically coupled to the at least one ground via. 5. The method of claim 1, wherein constructing the board further comprises: (a) plating an interface side of the board; and(b) etching the interface side to define center conductor pads such that the center conductor pads are electrically coupled to the remaining signal via at the interface side of the board. 6. The method of claim 1, wherein constructing the board comprising the signal via comprises constructing the board having a filled signal via.

이 특허에 인용된 특허 (44) 인용/피인용 타임라인 분석

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Parrish, Frank; Behziz, Arash; Castellano, Derek; LeColst, Arthur E.; Thompson, Donald Eric; Becker, Jonathan M., Coaxial cable for overvoltage protection.
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Yaghmai, Roya; Parrish, Frank B.; DeLessert, Daniel, Coaxial cable to printed circuit board interface module.
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Duquerroy, Patrick M.; Rithener, Blaise; Kempter, Sébastien, Coaxial connector for interconnecting printed circuit boards.
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Claude Louis Bertin ; Gordon Arthur Kelley ; Dennis Arthur Schmidt ; William Robert Tonti ; Jerzy Maria Zalesinski, Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality.
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Durney Max W. (Penngrove CA), Drilling and counterboring apparatus and method for forming screw pockets.
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Logelin, Donald M.; Self, Bob J.; Wardwell, Robert H., High density, high frequency, board edge probe.
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Tutt, Christopher Alan; Peters, Kenneth J.; Dix, Thomas P., High frequency connector assembly.
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Tutt, Christopher Alan; Peters, Kenneth J.; Dix, Thomas P., High frequency connector assembly.
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Chan,Benson; Lauffer,John M., High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same.
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Levy Paul S. (Chandler AZ), High-frequency coaxial interface test fixture.
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Akiba Yutaka,JPX, Low-EMI circuit board and low-EMI cable connector.
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Parrish, Frank, Low-cost tester interface module.
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Buchwalter,Stephen L.; Budd,Russell Alan, Manufacture of printed circuit boards with stubless plated through-holes.
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Greene, Michael A., Method and apparatus for manufacturing interchangeable and replaceable parts.
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Pierro John A. (East Meadow NY) Graham Thomas H. (Lindenhurst NY) Weiner Scott M. (Wantagh NY) Heller Paul (Dix Hills NY) Merenda Joseph L. (Massapequa NY), Method and apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits.
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Smetana, Jr.,Joseph, Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board.
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Spinosa, Dominic; Knoll, Frank; Walsh, Jeffrey F., Method for retrofitting an inertia reel access door to an ejection seat.
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Fraley, Lawrence R.; Markovich, Voya, Method of making a multi-chip electronic package having laminate carrier.
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Chan,Benson; Lauffer,John M.; Lin,How T.; Markovich,Voya R.; Thomas,David L., Method of making high speed circuit board.
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Munk,Clayton L.; Nelson,Paul E.; Strand,David E., Method of manufacturing a wing.
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Farkas, Sandor T.; Martinez, Hector F.; Patel, Bhavesh; Paul, Indrani; Robison, Jr., Larry P.; Slupek, Darrell J.; Sparkman, Aubrey, Method of processing a circuit board.
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Levy, John Benjamin; Martin, John; Pakravan, Farhad, Methods for verifying correct counter-bore depth and precision on printed circuit boards.
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Parrish, Frank; Behziz, Arash; LeColst, Arthur E.; Castellano, Derek; Thompson, Donald Eric; Becker, Jonathan M., Modular semiconductor tester interface assembly for high performance coaxial connections.
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Yamamoto Tozo, Screwdriver for self-drilling screw.
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Yaghmai, Roya; Parrish, Frank B.; Hauptman, Steven, Shielded cable interface module and method of fabrication.
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Adkins ; Russell M., Shielded connectors for closely spaced terminals.
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Dao,Davis S., Signal module.
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Dao,Davis S., Signal module.
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Greenberg,Sharon; Nguyen,Trung, Signal module.
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Greenberg,Sharon; Nguyen,Trung, Signal module.
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McConkey James W. (Delta OH), Spindle assembly for a single or a multiple spindle machine.
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Schwiebert Matthew K. ; Barnett Ron ; Chew Geary L. ; Gleason Gerald J. ; Nicholson Dean B., Surface mountable coaxial solder interconnect and method.
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Polus, Jeffrey E., System and method for fabricating composite parts.
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Skeoch, Steven, System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector.
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Gary W. Griffin ; Myngoc T. Nguyen ; Gary A. Wells ; Carl R. Gore ; John W. Joy ; Chris A. Shmatovich, Test system and associated interface module.
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Cartier, Jr., Marc B., Test system with high frequency interposer.
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Behziz,Arash; Breinlinger,Keith; Evans,David; Parrish,Frank, Tester interface module.
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Perry L. Coombs ; Paul R. Bigoney ; Ward D. Morrison, Turret rock bolter with stinger/centralizer.
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Marumo Hiroshi (Kofu JPX) Yamashita Satoru (Kofu JPX) Negishi Nobuyuki (Tokyo JPX) Kanai Shoichi (Shimonita-machi JPX), Vertical probe tester card with coaxial probes.
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Li Che-yu ; Korhonen Matti A. ; Shi Weimin, Wire segment based interposer for high frequency electrical connection.
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이 특허를 인용한 특허 (1) 인용/피인용 타임라인 분석

Robertson, Derek; Rogers, Vincent M., Adding test access to a back-drilled VIA.
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[미국특허] Coaxial cable to printed circuit board interface module 원문보기