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In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center cond

In one implementation, a method is provided for constructing an interface module which includes constructing a board having a signal via through the board, and having at least one ground via extending through the board. The method further includes back drilling the signal via to create a center conductor hole above a remaining portion of the signal via and back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced. The method further includes plating the shield opening and the center conductor hole, and back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated center conductor hole.

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1. A method for constructing an interface module comprising: (a) constructing a board comprising a signal via through the board, and comprising at least one ground via extending through the board;(b) back drilling the signal via to create a center conductor hole above a remaining portion of the sign

1. A method for constructing an interface module comprising: (a) constructing a board comprising a signal via through the board, and comprising at least one ground via extending through the board;(b) back drilling the signal via to create a center conductor hole above a remaining portion of the signal via;(c) back drilling a shield opening in the board and at least part way into the at least one ground via such that a height of the center conductor hole is reduced;(d) plating the shield opening and the reduced height center conductor hole;(e) back drilling to remove a portion of the plating to electrically isolate the plated shield opening and the plated reduced height center conductor hole. 2. The method of claim 1, wherein back drilling to remove a portion of the plating between the plated shield opening and the plated remaining portion of the center conductor hole comprises removing a portion of the board such that the drilling to remove the portion of the plating furthering reduces the height of the center conductor hole. 3. The method of claim 1, further comprising inserting a coaxial cable into the board and electrically bonding a center conductor of the coaxial cable to the plated center conductor hole and electrically bonding a shield of the coaxial cable to the plated shield hole. 4. The method of claim 1, wherein constructing the board further comprises: (a) plating a coax side of the board; and(b) etching the coax side to create a shield pad electrically coupled to the at least one ground via. 5. The method of claim 1, wherein constructing the board further comprises: (a) plating an interface side of the board; and(b) etching the interface side to define center conductor pads such that the center conductor pads are electrically coupled to the remaining signal via at the interface side of the board. 6. The method of claim 1, wherein constructing the board comprising the signal via comprises constructing the board having a filled signal via.