[특허]Warm water cooling

Exaflop LLC

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특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Warm water cooling

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F25D-023/12
미국특허분류(USC)	062/259.2; 062/150; 062/185; 062/201
출원번호	US-0757345 (2007-06-01)
등록번호	US-8209993 (2012-07-03)
발명자 / 주소	Carlson, Andrew Whitted, William Clidaras, Jimmy Hamburgen, William Aigner, Gerald Beaty, Donald L.
출원인 / 주소	Exaflop LLC
대리인 / 주소	Fish & Richardson P.C.
인용정보	피인용 횟수 : 22 인용 특허 : 5

초록

A method of providing cooled air to electronic equipment includes capturing heated air from a volume containing electronic equipment, cooling the heated air by more than fifteen degrees Celsius in an air-to-water heat exchanger, and supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air.

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1. A method of providing cooled air to electronic equipment, comprising: capturing air from a human-occupiable workspace in a data center and controlling flow of the air through a volume containing electronic equipment so that the air rises in temperature by twenty degrees Celsius or more from an ambient temperature of the workspace as it passes through the volume, and capturing the heated air from the volume;cooling the heated air by twenty degrees Celsius or more in an air-to-water heat exchanger;supplying cooling water to the air-to-water heat exchanger at a temperature above a dew point temperature of the heated air; andcontrolling the water to maintain the temperature of the cooling water at the temperature above the dew point temperature of the heated air,wherein the captured air passes by parallel paths through a plurality of vertically-stacked bays defined in the volume such that the air rises in temperature by twenty degrees Celsius or more from the ambient temperature of the workspace while passing between a first side and a second side of particular ones of the plurality of bays, the first side being open to the workspace to allow access to computing devices mounted in the particular ones of the plurality of bays while the captured air passes through the plurality of bays, andat least a portion of the airflow circulates through a circulation loop that comprises an airflow path from the workspace to a respective bay of the plurality of vertically-stacked bays in the volume, then to an area of a warm air plenum positioned in the volume behind the respective bay, then from the area of the warm air plenum positioned in the volume behind the respective bay to an area of the warm air plenum in an attic space above the volume, then from the area of the warm air plenum in the attic space above the volume to the air-to-water heat exchanger positioned in the volume. 2. The method of claim 1, wherein the step of capturing the heated air comprises capturing substantially only the heated air, and capturing substantially no air that is not from the volume containing the electronic equipment. 3. The method of claim 1, wherein the cooling water is returned from the air-to-water heat exchanger at a temperature above 40 degrees Celsius. 4. The method of claim 1, further comprising returning water from the air-to-water heat exchanger, wherein the temperature of the supplied water is more than 15 degrees Celsius cooler than the temperature of the returned water. 5. The method of claim 1, further comprising returning water from the air-to-water-heat exchanger and transferring heat from the returned water to water supplied from an evaporative cooling water source. 6. The method of claim 5, wherein the evaporative cooling water source comprises one or more cooling towers. 7. The method of claim 5, wherein the temperature of the returned water is more than 10 degrees Celsius warmer than the water supplied from the evaporative cooling water source. 8. The method of claim 1, wherein an approach temperature of the cooled air and the cooling water is less than about 5 degrees Celsius. 9. The method of claim 1, further comprising maintaining a cooling setpoint that is based on an expected wet bulb temperature occurring substantially continuously for one week or more. 10. The method of claim 1, wherein a cooling setpoint changes substantially continuously over a time duration. 11. A method of providing cooled air to electronic equipment, comprising: heating air drawn from a human-occupiable workspace by a temperature differential of 20 degrees Celsius or more by passing it over electronic equipment along the height of an equipment rack that houses the electronic equipment,cooling, by one or more cooling coils, the heated air from the electronic equipment by approximately the same temperature as the temperature differential by supplying cooling water to the one or more cooling coils at a temperature above a dew point temperature of the heated air; andreturning the cooled air to the workspace,wherein the air passes by parallel paths through a plurality of bays defined in the equipment rack such that the air rises in temperature by twenty degrees Celsius or more from the ambient temperature of the workspace while passing between a first side and a second side of particular ones of the plurality of bays, the first side being open to the workspace to allow access to the electronic equipment mounted in the particular ones of the plurality of bays while the air passes through the plurality of bays, andat least a portion of the airflow circulates through a circulation loop that comprises an airflow path from the workspace to a respective bay of the plurality of bays in a volume comprising the workspace, then to an area of a warm air plenum positioned in the volume behind the respective bay, then from the area of the warm air plenum positioned in the volume behind the respective bay to an area of the warm air plenum in an attic space above the volume, then from the area of the warm air plenum in the attic space above the volume to the one or more cooling coils positioned in the volume. 12. The method of claim 11, further comprising receiving, in the one or more cooling coils, a flow of cooling fluid cooled using evaporative cooling with no refrigeration. 13. The method of claim 12, wherein heating the air from the workspace comprises heating the air from about 25 degrees Celsius to more than 45 degrees Celsius. 14. The method of claim 13, wherein a temperature of the heated air is at or near a maximum failure preventative temperature for the electronic equipment. 15. The method of claim 11, wherein the cooled air is returned directly to the workspace after it is cooled by the one or more cooling coils. 16. The method of claim 11, wherein the electronic equipment comprises a large plurality of rack servers in a data center. 17. The method of claim 11, wherein the heated air is drawn through the plurality of bays and circulated by a fan located above the equipment rack into the portion of the warm air plenum that extends above, and is thermally separated from, the human-occupiable workspace, and wherein the air is further circulated from the warm air plenum through the one or more cooling coils and back to the human-occupiable workspace. 18. The method of claim 1, further comprising maintaining a setpoint that maintains air around the electronic equipment at a temperature below an expected failure level for the electronic equipment. 19. The method of claim 18, wherein the setpoint maintains a temperature in a human-occupied space around the electronic equipment above 75 deg. Fahrenheit. 20. The method of claim 1, further comprising capturing the heated air in one or more common warm air plenums and cooling the heated air with the air-to-water heat exchanger before circulating the cooled air into an occupied workspace around the electronic equipment. 21. The method of claim 20, further comprising drawing air directly from the workspace into open-front racks that hold the electronic equipment. 22. The method of claim 20, further comprising routing the captured heated air from the one or more common warm air plenums into an attic space, and delivering the captured air to the workspace using an air handler and a conduit adjacent to the workspace. 23. The method of claim 1, further comprising controlling flow rates of air through racks using fans located between the volume containing the electronic equipment and one or more common warm air plenums. 24. The method of claim 1, further comprising cooling the water using an evaporative cooling system having a plurality of cooling towers and no operating chiller. 25. The method of claim 24, wherein the cooling towers comprise hybrid cooling towers. 26. The method of claim 1, wherein the heated air enters the air-to-water heat exchanger at a temperature over 110 deg. Fahrenheit. 27. The method of claim 1, wherein the heated air is drawn from the volume and circulated by a fan located above the volume into the portion of the warm air plenum that extends above, and is thermally separated from, the human-occupiable workspace in the data center, and wherein the air is further circulated from the warm air plenum through the air-to-water heat exchanger and back to the human-occupiable workspace.

이 특허에 인용된 특허 (5)

이 특허를 인용한 특허 피인용횟수: 22

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구성항목	관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
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특허 상세정보

Warm water cooling

초록

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이 특허에 인용된 특허 (5)

이 특허를 인용한 특허 피인용횟수: 22

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Warm water cooling

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이 특허에 인용된 특허 (5)

이 특허를 인용한 특허 피인용횟수: 22

IPC 상위 출원인

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상세정보조회

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IPC 상세정보(version : 201201)

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