초록 ▼

Devices and methods are provided for the controlled release or exposure of reservoir contents. The device includes a substrate, a plurality of reservoirs in the substrate, reservoir contents disposed in the reservoirs, discrete reservoir caps covering each reservoir to seal the reservoir contents in

Devices and methods are provided for the controlled release or exposure of reservoir contents. The device includes a substrate, a plurality of reservoirs in the substrate, reservoir contents disposed in the reservoirs, discrete reservoir caps covering each reservoir to seal the reservoir contents in the reservoirs, and control circuitry for selectively disintegrating the reservoir caps to release or expose the reservoir contents in vivo. At least one of the reservoir caps comprises a first electrically conductive layer coated with one or more protective layers. In one embodiment, the control circuitry comprises an electrical input lead and an electrical output lead connected to and directly contacting each of said reservoir caps and a source of electric power for applying an electrical current through each reservoir cap in an amount effective to rupture each of the reservoir caps.

대표청구항 ▼

1. A device for the controlled delivery or exposure of reservoir contents comprising: a substrate having at least one reservoir, each reservoir having at least one opening;reservoir contents disposed in the at least one reservoir;a reservoir cap formed of an electrically conductive material and clos

1. A device for the controlled delivery or exposure of reservoir contents comprising: a substrate having at least one reservoir, each reservoir having at least one opening;reservoir contents disposed in the at least one reservoir;a reservoir cap formed of an electrically conductive material and closing off the opening, to seal the reservoir contents in the at least one reservoir; andcontrol circuitry and a power source for selectively disintegrating the reservoir cap, thereby opening the reservoir to release or expose the reservoir contents,wherein the reservoir cap comprises multiple metal layers or multiple layers of metal and semiconductor,wherein the control circuitry comprises an electrical input lead and an electrical output lead, which leads are electrically and mechanically connected to the reservoir cap. 2. The device of claim 1, wherein at least one of the multiple metal layers comprises titanium. 3. The device of claim 1, wherein at least one of the multiple metal layers comprises platinum. 4. The device of claim 1, wherein the reservoir cap comprises a platinum/titanium/platinum layer structure. 5. The device of claim 1, wherein the reservoir cap comprises a titanium/platinum/titanium/platinum/titanium layer structure. 6. The device of claim 1, wherein at least one of the multiple metal layers comprises gold, silver, aluminum, copper, palladium, an alloy of gold and silicon, an alloy of gold and germanium, an alloy of platinum and iridium, an alloy of nickel and titanium, or an alloy of platinum and silicon. 7. The device of claim 1, wherein the multiple metal layers comprise a main layer and one or more adhesion layers, one or more stabilizing layers, or both adhesion and stabilizing layers. 8. The device of claim 7, wherein the main layer has a thickness of about 300 nm. 9. The device of claim 7, wherein the one or more stabilizing layers each have a thickness of about 15 nm. 10. The device of claim 7, wherein the one or more adhesion layers each have a thickness between about 10 nm and 15 nm. 11. The device of claim 7, wherein the one or more adhesion layers are located over only a portion of the main layer. 12. The device of claim 7, wherein the one or more adhesion layers comprise titanium, chromium, or aluminum. 13. The device of claim 1, wherein the leads and reservoir cap comprise a continuous lead-reservoir cap layer of the same material, without an interface between the reservoir cap and the leads. 14. The device of claim 1, wherein the leads and the reservoirs cap comprise different materials, with an intermetallic junction at the interface of the leads and the reservoir cap. 15. The device of claim 1, wherein the reservoir contents comprise at least one drug. 16. The device of claim 1, wherein the reservoir contents comprise at least one sensor. 17. The device of claim 16, wherein the sensor measures the concentration of glucose, urea, calcium, or a hormone in a patient. 18. The device of claim 1, wherein the volume of each of the reservoirs is between 1 nL and 500 μL. 19. The device of claim 1, which comprises two or more of the reservoirs in an array in the substrate. 20. An implantable medical device comprising: a substrate having a plurality of discrete reservoirs defined therein;a drug or biosensor disposed in each of the reservoirs;a plurality of electrically conductive reservoir caps covering the reservoirs to seal the reservoir contents in the reservoirs; andcontrol circuitry and a power source for selectively disintegrating each of the reservoir caps by electrothermal ablation in vivo,wherein said reservoir caps comprise multiple metal layers or multiple layers of metal and semiconductor,wherein the control circuitry comprises an electrical input lead and an electrical output lead, which leads are electrically and mechanically connected to each of the reservoir caps. 21. The device of claim 20, wherein at least one of the multiple metal layers comprises titanium. 22. The device of claim 20, wherein at least one of the multiple metal layers comprises platinum. 23. The device of claim 20, wherein the multiple metal layers comprise a platinum/titanium/platinum layer structure. 24. The device of claim 20, wherein at least one of the multiple metal layers comprises gold, silver, aluminum, copper, palladium, an alloy of gold and silicon, an alloy of gold and germanium, an alloy of platinum and iridium, an alloy of nickel and titanium, or an alloy of platinum and silicon. 25. The device of claim 20, wherein the multiple metal layers comprise a main layer and one or more adhesion layers, one or more stabilizing layers, or both adhesion and stabilizing layers. 26. The device of claim 25, wherein the one or more adhesion layers are located over only a portion of the main layer. 27. The device of claim 20, wherein the leads are electrically and mechanically connected to the reservoir caps by a continuous lead-reservoir cap layer of the same material, without an interface between each reservoir cap and the leads. 28. The device of claim 20, wherein the leads and the reservoir caps include different materials with an intermetallic junction at the interface of the leads and each reservoir cap.