Purification method of polyamic acid resin and polyimide resin
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C08G-063/00
C08G-063/02
출원번호
US-0982787
(2010-12-30)
등록번호
US-8217135
(2012-07-10)
우선권정보
TW-98146379 A (2009-12-31)
발명자
/ 주소
Tsai, Min-Ruei
출원인 / 주소
Daxin Materials Corporation
대리인 / 주소
Jianq Chyun IP Office
인용정보
피인용 횟수 :
0인용 특허 :
5
초록▼
Purification methods of polyamic acid resin and polyimide resin are provided. The purification methods of polyamic acid resin or polyimide resin includes providing a polyamic acid resin or a polyimide resin containing metal ion impurities. Thereafter, a cation exchange resin is used to react with th
Purification methods of polyamic acid resin and polyimide resin are provided. The purification methods of polyamic acid resin or polyimide resin includes providing a polyamic acid resin or a polyimide resin containing metal ion impurities. Thereafter, a cation exchange resin is used to react with the polyamic acid resin or the polyimide resin in order to remove the metal ion impurities therein, and a water content in the polyamic acid resin or the polyimide resin is removed to purify the polyamic acid resin or polyimide resin.
대표청구항▼
1. A purification method of a polyamic acid resin, comprising: providing a polyamic acid resin solution containing metal ion impurities;performing a metal ion removal step, wherein a cation exchange resin is used to react with the polyamic acid resin solution to remove the metal ion impurities in th
1. A purification method of a polyamic acid resin, comprising: providing a polyamic acid resin solution containing metal ion impurities;performing a metal ion removal step, wherein a cation exchange resin is used to react with the polyamic acid resin solution to remove the metal ion impurities in the polyamic acid resin solution; andperforming a water content removal step, so as to purify the polyamic acid resin solution by removing water content in the polyamic acid resin solution,wherein the metal ion removal step can be performed prior or later to the water content removal step in the order of sequence. 2. The purification method of the polyamic acid resin of claim 1, wherein a main chain of the cation exchange resin is selected from polystyrene, polydiphenylethylene, or a polymer formed by polymerization or crosslinking of silicone. 3. The purification method of the polyamic acid resin of claim 1, wherein the cation exchange resin comprises one of the following functional groups: a sulfone group, an amino salt group, an acidic group, a polyol group, or a urea group. 4. The purification method of the polyamic acid resin of claim 1, wherein a reaction flow rate of the metal ion removal step is between 10 and 300 L/h. 5. The purification method of the polyamic acid resin of claim 1, wherein a temperature of the metal ion removal step is between 0 and 75° C. 6. The purification method of the polyamic acid resin of claim 1, wherein a pressure of the metal ion removal step is between 0 and 10 kg/m2. 7. The purification method of the polyamic acid resin of claim 1, wherein a pH value of the metal ion removal step is between 4 and 10. 8. The purification method of the polyamic acid resin of claim 1, wherein the water content removal step comprises using a molecular sieve, celite, or aluminum oxide to remove the water content in the polyamic acid resin solution. 9. The purification method of the polyamic acid resin of claim 1, wherein the water content removal step comprises performing processes of evaporation, freeze sublimate, molecular sieve absorption, celite absorption, or aluminum oxide absorption on the polyamic acid resin solution. 10. The purification method of the polyamic acid resin of claim 1, wherein the water content removal step comprises performing a thin film evaporation on the polyamic acid resin solution. 11. The purification method of the polyamic acid resin of claim 1, wherein a reaction time of the water content removal step is between 4 and 12 hours. 12. The purification method of the polyamic acid resin of claim 1, wherein a temperature of the water content removal step is between −5 and 75° C. 13. The purification method of the polyamic acid resin of claim 1, wherein a pressure of the water content removal step is between 0.01 and 30 torr. 14. A purification method of polyimide resin, comprising: providing a polyimide resin solution containing metal ion impurities;performing a metal ion removal step, wherein a cation exchange resin is used to react with the polyimide resin solution to remove the metal ion impurities in the polyimide resin solution; andperforming a water content removal step, so as to purify the polyimide resin solution by removing water content in the polyimide resin solution,wherein the metal ion removal step can be performed prior or later to the water content removal step in the order of sequence. 15. The purification method of the polyimide resin of claim 14, wherein a main chain of the cation exchange resin is selected from polystyrene, polydiphenylethylene, or a polymer formed by polymerization or crosslinking of silicone. 16. The purification method of the polyimide resin of claim 14, wherein the cation exchange resin comprises one of the following functional groups: a sulfone group, an amino salt group, an acidic group, a polyol group, or a urea group. 17. The purification method of the polyimide resin of claim 14, wherein a reaction flow rate of the metal ion removal step is between 10 and 300 L/h. 18. The purification method of the polyimide resin of claim 14, wherein a temperature of the metal ion removal step is between 0 and 75° C. 19. The purification method of the polyimide resin of claim 14, wherein a pH value of the metal ion removal step is between 4 and 10. 20. The purification method of the polyimide resin of claim 14, wherein the water content removal step comprises using a molecular sieve, celite, or aluminum oxide to remove the water content in the polyimide resin solution. 21. The purification method of the polyimide resin of claim 14, wherein the water content removal step comprises performing processes of evaporation, freeze sublimate, molecular sieve absorption, celite absorption, or aluminum oxide absorption on the polyimide resin solution. 22. The purification method of the polyimide resin of claim 14, wherein the water content removal step comprises performing thin film evaporation on the polyimide resin solution. 23. The purification method of the polyimide resin of claim 14, wherein a reaction time of the water content removal step is between 4 and 12 hours. 24. The purification method of the polyimide resin of claim 14, wherein a temperature of the water content removal step is between −5 and 75° C. 25. The purification method of the polyimide resin of claim 14, wherein a pressure of the water content removal step is between 0.01 and 30 torr.
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이 특허에 인용된 특허 (5)
Goerlitzer,Hans; Staschik,Dorothea, Method for removing metal ions from polymers or polymer solutions.
Bruening, Ronald L.; Krakowiak, Krzysztof E., Polyamide ligand-containing polymeric resins and methods of using the same for removing, separating and/or concentrating desired metal ions from solutions.
Buchwalter Leena P. (Wappingers Falls NY) Buchwalter Stephen L. (Wappingers Falls NY) O\Toole Terrence R. (Hopewell Junction NY) Thomas Richard R. (Fishkill NY) Viehbeck Alfred (Stormville NY), Surface midification of a polyimide.
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