초록 ▼

A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material outside the contact hole and the TSV opening to leave the conductive material in the contact hole and the TSV opening, thereby forming a conta

A method includes forming conductive material in a contact hole and a TSV opening, and then performing one step to remove portions of the conductive material outside the contact hole and the TSV opening to leave the conductive material in the contact hole and the TSV opening, thereby forming a contact plug and a TSV structure, respectively. In some embodiments, the removing step is performed by a CMP process.

대표청구항 ▼

1. A method of forming a through-silicon via (TSV) structure, comprising: providing a semiconductor substrate having a first region and a second region;forming a dielectric layer on the semiconductor substrate, wherein the dielectric layer comprises a first opening in the first region;forming a firs

1. A method of forming a through-silicon via (TSV) structure, comprising: providing a semiconductor substrate having a first region and a second region;forming a dielectric layer on the semiconductor substrate, wherein the dielectric layer comprises a first opening in the first region;forming a first conductive material layer on the dielectric layer, filling the first opening;forming a second opening in the second region extending through the first conductive material layer, the dielectric layer and a portion of the semiconductor substrate, wherein the second opening has a sidewall portion and a bottom portion;forming a passivation layer overlying the first conductive material layer and lining the sidewall portion and the bottom portion of the second opening;forming a second conductive material layer overlying the passivation layer, filling the second opening; andremoving portions of the second conductive material layer, the passivation layer and the first conductive material layer positioned outside the first opening and the second opening to expose the dielectric layer, wherein a portion of the second conductive material layer remaining in the second opening forms the TSV structure. 2. The method of claim 1, wherein said removing is performed by a chemical mechanical polishing (CMP) process. 3. The method of claim 1, wherein the portion of the first conductive material layer remaining in the first opening forms a contact plug. 4. The method of claim 1, further comprising: forming an integrated circuit (IC) component on the semiconductor substrate before forming a dielectric layer on the semiconductor substrate,wherein the first opening exposes the IC component. 5. The method of claim 1, wherein the first conductive material layer comprises tungsten, tungsten alloy, copper, or copper alloy. 6. The method of claim 1, wherein the second conductive material layer comprises copper, or copper alloy. 7. The method of claim 1, wherein the passivation layer comprises oxide. 8. The method of claim 1, further comprising: forming a barrier layer on the passivation layer before forming the second conductive material layer. 9. The method of claim 8, wherein the barrier layer comprises Ti, Ta, TiN, or TaN. 10. The method of claim 1, wherein: the dielectric layer is an inter-layer dielectric (ILD) layer comprising at least one selected from the group consisting of a silicon oxide containing layer formed of doped or undoped silicon oxide,doped or P-doped spin-on-glass (SOG),Phosphorus-doped Tetraethoxy Silane (PTEOS), andBoron-Phosphosilicate Tetraethoxy Silane (BPTEOS); andthe first conductive material layer is formed directly on the ILD layer.