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Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap struct

Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure, which includes a first dielectric material for interlayer insulation and is for blocking a noise, is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate, a second conductive plate arranged on a planar surface that is different from that of the first conductive plate, a third conductive plate arranged on a same planar surface as the first conductive plate, and a stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged. A second dielectric material having a permittivity that is different from that of the first dielectric material is interposed between any two of the first conductive plate, the second conductive plate, and the third conductive plate.

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1. A printed circuit board into which an electromagnetic bandgap structure is inserted, the electromagnetic bandgap structure including a first dielectric material for interlayer insulation and configured to block a noise, the electromagnetic bandgap structure comprising: a first conductive plate;a

1. A printed circuit board into which an electromagnetic bandgap structure is inserted, the electromagnetic bandgap structure including a first dielectric material for interlayer insulation and configured to block a noise, the electromagnetic bandgap structure comprising: a first conductive plate;a second conductive plate arranged on a planar surface that is different from that of the first conductive plate;a third conductive plate arranged on a same planar surface as the first conductive plate; anda stitching via unit configured to connect the first conductive plate and the third conductive plate through the planar surface on which the second conductive plate is arranged,wherein a second dielectric material is interposed between any two of the first conductive plate, the second conductive plate and the third conductive plate, the second dielectric material having a permittivity that is different from that of the first dielectric material. 2. The printed circuit board of claim 1, wherein the stitching via unit comprises: a connection pattern arranged on the same planar surface as the second conductive plate but electrically separated from the second conductive plate; anda pair of vias connecting opposite ends of the connection pattern to the first conductive plate and the third conductive plate, respectively. 3. The printed circuit board of claim 2, wherein the second dielectric material is interposed between the second conductive plate and the connection pattern. 4. The printed circuit board of claim 1, wherein the second dielectric material has a higher permittivity than that of the first conductive plate.