IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0732662
(2010-03-26)
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등록번호 |
US-8228675
(2012-07-24)
|
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
55 |
초록
Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.
대표청구항
▼
1. An apparatus comprising: a heat conducting structure having a first surface and a second surface, wherein the first surface is adaptable to be in thermal contact with a thermal load; anda heat transfer structure immersed in a surrounding medium, the heat transfer structure having a third surface
1. An apparatus comprising: a heat conducting structure having a first surface and a second surface, wherein the first surface is adaptable to be in thermal contact with a thermal load; anda heat transfer structure immersed in a surrounding medium, the heat transfer structure having a third surface substantially parallel to the second surface of the heat conducting structure, said heat transfer structure being coupled to said heat conducting structure using a gas bearing structure, the gas bearing structure configured to cause a gas filled gap region to form between said second surface and said third surface at least in part responsive to a motion of said heat transfer structure, and wherein the heat transfer structure is supported by the gas filled gap region during operation of the apparatus, said gas filled gap region having a substantially low thermal resistance, and said heat transfer structure being movable relative to said heat conducting structure. 2. The apparatus of claim 1, wherein said heat transfer structure is provided with surface features comprising one or more of fins, vanes, blades, channels, ducts, pins, posts, plates, slots, protrusions, recesses, perforations, holes, textured surfaces, segmented elements, staggered elements, and smooth surfaces. 3. The apparatus of claim 2, wherein said surface features are disposed of in a forward swept, backward swept, and/or radial orientation. 4. The apparatus of claim 1, wherein said gas bearing structure is adapted to maintain said gas filled gap region. 5. The apparatus of claim 1, and further comprising a mechanism adapted to rotate and/or translate said heat transfer structure relative to said surrounding medium and/or heat conducting structure. 6. The apparatus of claim 5, and further comprising one or more mechanisms adapted to maintain a constant axis of rotation. 7. The apparatus of claim 5, and further comprising at least one rotor member and one or more stator coils adapted to impart rotation to said heat transfer structure. 8. The apparatus of claim 5, wherein said heat transfer structure is adapted to pump, circulate, and/or impart motion to said surrounding medium. 9. The apparatus of claim 5, and further comprising a means for varying an angular velocity of said heat transfer structure. 10. The apparatus of claim 5, wherein angular velocity of said heat transfer structure is high enough to induce turbulent flow over a portion of one or more surfaces of said heat transfer structure. 11. The apparatus of claim 5, wherein said heat transfer structure comprises at least one structural element for generating turbulence or promoting convective transport in said gas filled gap region, wherein the thermal resistance of said gas filled gap region is reduced. 12. The apparatus of claim 5, wherein reverse rotation of said heat transfer structure is adapted to removal of foreign matter, including but not limited to particulates, condensation and/or ice, from one or more surfaces said heat transfer structure. 13. The apparatus of claim 1, wherein at least one of said second surface and said third surface comprises a lubricant coating, anti-friction coating, or both. 14. The apparatus of claim 1, wherein said surrounding medium comprises a pure gas or a mixture of gases. 15. The apparatus of claim 1, wherein said gas filled gap region comprises a pure gas or a mixture of gases. 16. The apparatus of claim 1, and further comprising: an inlet port adapted to direct air received from outside of a building and/or enclosure to said heat transfer structure; andan outlet port adapted to direct heated air from said heat transfer structure to outside said building and/or enclosure. 17. The apparatus of claim 1, wherein said apparatus is adapted to thermal management of one or more active and/or passive electronic components, including but not limited to a resistor, capacitor, inductor, transformer, diode, rectifier, thyristor, transistor, amplifier, integrated circuit, display driver, line driver, buffer, microprocessor, central processing unit, graphics processing unit, coprocessor, transducer, sensor, actuator, power supply, ac to dc converter, dc to ac converter, dc to dc converter, ac to ac converter, or printed circuit assembly. 18. The apparatus of claim 1, wherein said gas bearing structure comprises a hydrodynamic gas bearing. 19. A method of transferring heat between a thermal load and a surrounding medium, comprising providing a heat conducting structure in thermal contact with a thermal load, a movable heat transfer structure through which heat may be exchanged with a surrounding medium, a gas filled gap region between at least one surface of said heat conducting structure and at least one surface of said heat transfer structure, wherein said gas filled gap region forms at least in part due to a motion of said heat transfer structure, the method further comprising transferring heat between said at least one surface of said heat conducting structure and at least one surface of said heat transfer structure through said gas filled gap region and transferring heat between said heat transfer structure and said surrounding medium.
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