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Heat exchanger device and method for heat removal or transfer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0732662 (2010-03-26)
등록번호 US-8228675 (2012-07-24)
발명자 / 주소
  • Koplow, Jeffrey P.
출원인 / 주소
  • Sandia Corporation
대리인 / 주소
    Dorsey & Whitney LLP
인용정보 피인용 횟수 : 6  인용 특허 : 55

초록

Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air.

대표청구항

1. An apparatus comprising: a heat conducting structure having a first surface and a second surface, wherein the first surface is adaptable to be in thermal contact with a thermal load; anda heat transfer structure immersed in a surrounding medium, the heat transfer structure having a third surface

이 특허에 인용된 특허 (55)

  1. Sri-Jayantha, Sri M.; MoVicker, Gerard; Khanna, Vijayeshwar Das, Active heat sink for high power microprocessors.
  2. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  3. Lopatinsky,Edward; Schaefer,Dan; Rosenfeld,Saveliy; Fedoseyev,Lev, Apparatus for cooling of electronic components.
  4. Giorgio Paul J., Apparatus for optimizing the rotational speed of cooling fans.
  5. David R. Davis ; Michael R. Flannery, CPU fan assembly.
  6. Tsai,Ming Kun, CPU heat dissipating device structure.
  7. Huang, Kau-Chung, Centrifugal pump device for a heat-dissipating system.
  8. Chen, Chien-Jung, Circuit board fixing structure of heatsink fan.
  9. Muller Rolf (Ackerstrasse 13 St. Georgen ; Schwarzw. DEX) Wrobel Gunter (Furstenbergring 8 Villingen DEX), Compact miniature fan.
  10. Jui-Hung Cheng TW, Composite heat dissipation fan.
  11. Lopatinsky, Edward L.; Fedoseyev, Lev A.; Shaefer, Dan K.; Rosenfeld, Saveliy T.; Fedosov, Yuri I.; Popov, Viktor N.; Askhatov, Nil N., Cooler for electronic devices.
  12. Lopatinsky, Edward; Fedoseyev, Lev A.; Fedosov, Yuriy Igorevich; Askhatov, Nil, Cooler for electronic devices.
  13. Lopatinsky,Edward L.; Schaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Cooler for electronic devices.
  14. Breier,Anton; Kamagata,Hidetoshi, Cooling apparatus.
  15. Watanabe, Michinori; Suzuki, Michihiro; Nakamura, Toshiyuki, Cooling apparatus for cooling electric element.
  16. Bahl,Manish; Mok,Lawrence S., Cooling apparatus for heat generating devices.
  17. Saito Kohichi,JPX, Cooling fan and cooling fan assembly.
  18. Cronin John E. (Milton VT) Previti-Kelly Rosemary A. (Richmond VT) Ryan James G. (Sandy Hook CT) Sullivan Timothy D. (Underhill VT), Cooling microfan arrangements and process.
  19. Mays, II, Ford Chapman, Cooling module and related control circuits useful therefor incorporating a communication port for receiving digital command signals to control module.
  20. Fiske Orlo James, Data storage and/or retrieval methods and apparatuses and components thereof.
  21. Maling ; Jr. George C. (Poughkeepsie NY) Schmidt Roger R. (Poughkeepsie NY), Disk augmented heat transfer system.
  22. Foster, Sr.,Jimmy Grant; June,Michael Sean; Makley,Albert Vincent; Matteson,Jason Aaron, Dual impeller push-pull axial fan heat sink.
  23. Williams Edward J. (Charlottesville VA), Dynamic heat sink.
  24. Lee,Sen Yung; Lin,Shueei Muh; Hsieh,Hsin Mao, Fan device for removing heat from heat sources.
  25. Kaneko,Sachiko; Shishido,Yuji; Hashimoto,Toshio; Kimura,Tooru, Fan motor.
  26. Yamada Tadao (3-9-9 Inadera Amagasaki City ; Hyogo-ken 655 JPX), Fan motor.
  27. Brown Alan E., Fan speed monitoring system for determining the speed of a PWM fan.
  28. Lopatinsky Edward, Fan with magnetic blades.
  29. Webster ; Jr. Leo H. ; Mok Lawrence Shungwei ; Kamath Vinod ; Mansuria Mohanlal S., Forced air cooling apparatus for semiconductor chips.
  30. Hwang, Ching Bai; Meng, Jin Gong, Heat dissipation apparatus.
  31. Xia,Wan Lin; Li,Tao; Zhang,Jun; Qin,Ji Yun, Heat dissipation device.
  32. Ogushi Tetsurou (Amagasaki JPX) Kaga Kunihiko (Amagasaki JPX) Tanaka Hideharu (Amagasaki JPX) Yamanaka Goro (Amagasaki JPX), Heat exchange apparatus and method for preparing the apparatus.
  33. Amou Mitsuru,JPX ; Mehara Koji,JPX, Heat sink apparatus.
  34. Xia,Wan Lin; Li,Tao; Zhong,Yong, Heat sink assembly.
  35. Wang Michael (Taipei Hsien TWX), Heat sink assembly for a central processing unit of a computer.
  36. Khanna, Vijayeshwar D.; McVicker, Gerard; Sri-Jayantha, Sri M., Heat transfer device in a rotating structure.
  37. Hsu,Wei Chun; Chang,Shun Chen; Huang,Wen Shi, Heat-dissipating device.
  38. Al-Garni, Ahmed Z.; Hawwa, Muhammad A., Hybrid cooling system and method for cooling electronic devices.
  39. Roy,Sanjay K., Impeller driven active heat sink.
  40. Lopatinsky,Edward L.; Shaefer,Dan K.; Rosenfeld,Saveliy T.; Fedoseyev,Lev A., Integrated cooler for electronic devices.
  41. Evans Richard J. ; Gardell David L. ; Palagonia Anthony M., Method and apparatus for cooling an electronic device.
  42. Horng,Alex; Yin,Tso Kuo, Miniature blower fan.
  43. Horng, Alex; Yin, Tso-Kuo, Miniature fan.
  44. Hawwa, Muhammad A; Al-Dini, Salem A.; Ben-Mansour, Rached, Moving carbon nanotube heat sink.
  45. Zimmerman, Kurt; Meehan, Robert F.; Rust, John, Non-contacting thermal rotary joint.
  46. Horng,Alex; Lu,Yu Yuan, Radial-flow heat-dissipating fan with increased inlet airflow.
  47. Cheng, Jui-Hung, Radiator fan.
  48. Lopatinsky Edward L. ; Rosenfield Saveliy T., Rotor drive motor with u-shaped stator cores.
  49. Xi, Junnan, Speed control circuit of brushless DC fan motor.
  50. Woong Kwon Kim KR, Substrate structure of a liquid crystal display and a manufacturing method thereof.
  51. Cheng Rex (Taoyuan TWX), Thermal control variable speed DC brushless fan.
  52. Larimer William R., Transistor package structured to provide heat dissipation enabling use of silicon carbide transistors and other high po.
  53. Herbert, Edward, Venturi fan.
  54. Odagiri, Kinya; Oki, Kouji; Suzuki, Shingo, Very thin fan motor with attached heat sink.
  55. Herbert,Edward, Wave-fans and wave-fans with heat sinks.

이 특허를 인용한 특허 (6)

  1. Devitt, Andrew, Air bearing for use as a seal.
  2. Devitt, Andrew, Air bearing for use as seal.
  3. Van Der Tempel, Leendert; Lammers, Jeroen Herman; Van Os, Petrus Johannes Maria, Cooling device utilizing internal synthetic jets.
  4. Koplow, Jeffrey P., Heat transfer assemblies, systems, and methods for conditioning a medium.
  5. Koplow, Jeffrey P.; Kariya, Harumichi Arthur; Staats, Jr., Wayne Lawrence, Heating and cooling devices, systems and related method.
  6. Losse, II, Valdemar R.; Losse, Valdemar R., Non-electric forced air heating and cooling apparatus.
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