초록 ▼

The invention provides an enhanced method and system for machining an array of components. A holding mechanism is provided for holding an array of components in a machining process. The holding mechanism comprises: a rigid base plate and at least one support for holding a raw material while machinin

The invention provides an enhanced method and system for machining an array of components. A holding mechanism is provided for holding an array of components in a machining process. The holding mechanism comprises: a rigid base plate and at least one support for holding a raw material while machining, one end of each support being coupled to the rigid base plate. The holding mechanism is further provided with a secure plate movably coupled to the rigid base plate. The secure plate is provided with one or more holding parts such as double-sided tape or guiding pins for holding the raw material. The secure plate can be elevated to hold the raw material during a machining operation such as peripheral machining.

대표청구항 ▼

1. A process of manufacturing an array case for an ultrasound probe, comprising: (a) providing a raw material with a plurality of holes for accommodating a plurality of supports;(b) machining a plurality of components having an internal cavity and a plurality of lips, wherein the lips attach the com

1. A process of manufacturing an array case for an ultrasound probe, comprising: (a) providing a raw material with a plurality of holes for accommodating a plurality of supports;(b) machining a plurality of components having an internal cavity and a plurality of lips, wherein the lips attach the components to the raw material;(c) removing the raw material on the corners of the internal cavity using a broaching process;(d) machining outer surface of the components, while the lips hold the components to the raw material;(e) elevating a vertically-moveable secure plate for holding the plurality of components, the secure plate being provided with at least one holding part; and(f) peripheral machining the raw material for removing the lips, the components being held by the secure plate during the peripheral machining. 2. A process as in claim 1, wherein the step of providing the raw material includes machining holes in the raw material corresponding to the supports. 3. A process as in claim 1, wherein the step of providing the raw material further comprises: holding the raw material using the plurality of supports, the supports being attached to a rigid base plate. 4. A process as in claim 1, wherein the step of machining the plurality of components comprises: defining a component layout design, the plurality of components being grounded and sized into required component size. 5. A process as in claim 1, wherein the step of removing the raw material from the corners of the inner cavity comprises removing the raw material using a broaching tool associated with a CNC machine. 6. A process as in claim 1, wherein the step of elevating the secure plate comprises: elevating the secure plate to attach one side of a double-sided foam tape to the raw material, the other side of the foam tape being attached to a rigid surface of the secure plate. 7. A process as in claim 1, wherein the step of elevating further comprises: inserting at least one guiding pin within at least one component of the plurality of components, the at least one guiding pin being provided on the secure plate. 8. A process as in claim 1, wherein the plurality of components are held in a fixed position while machining, broaching and peripheral machining. 9. A process as in claim 1, wherein the at least one holding part of the secure plate holds the plurality of components during the peripheral machining. 10. A process as in claim 1, wherein the lips attach the plurality of components to at least one rib of the raw material.