[특허]Structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle

Honeywell International Inc.

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Structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle

국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01R-012/00
미국특허분류(USC)	307/009.1;
출원번호	US-0270196 (2008-11-13)
등록번호	US-8242623 (2012-08-14)
발명자 / 주소	Lucero, Michael Collette, Daniel Ross Axtman, David
출원인 / 주소	Honeywell International Inc.
대리인 / 주소	Shumaker & Sieffert, P.A.
인용정보	피인용 횟수 : 5 인용 특허 : 15

초록

A structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle that comprises a printed circuit board attached to a core vehicle body, wherein the printed circuit board conforms to the shape of the core vehicle body's airframe skirt, and wherein the printed circuit board provides structural integrity to the core vehicle body.

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1. A ducted fan unmanned aerial vehicle (UAV) comprising a structural ring interconnect printed circuit board assembly, the UAV comprising: an annular duct one end of which comprises an airframe skirt; anda ring-shaped printed circuit board attached to the airframe skirt, wherein the printed circuit board conforms to the shape of the airframe skirt, and wherein the printed circuit board is configured to increase structural integrity of the airframe skirt when attached thereto. 2. The UAV of claim 1 further comprising at least one connector on a surface of the printed circuit board. 3. The UAV of claim 2, wherein the at least one connector comprises at least one socket connector on a surface of the printed circuit board or at least one servo socket connector on the surface of the printed circuit board. 4. The UAV of claim 3, wherein one of the at least one socket connector comprises at least one of a power supply socket, a radio socket connector, or an antenna coaxial cable connector. 5. The UAV of claim 1, wherein the printed circuit board comprises a plurality of layers and wherein one or more of the plurality of layers is a ground plane configured to shield conductors from electromagnetic interference. 6. The UAV of claim 5, wherein the ground plane is a carbon fiber skin composite. 7. The UAV of claim 1, wherein an arc length of the printed circuit board extends at least 180 degrees around a circumference of the airframe skirt. 8. The UAV of claim 7, wherein the arc length of the printed circuit board extends 360 degrees around the circumference of the airframe skirt. 9. The UAV of claim 1, wherein the printed circuit board is attached to and supported by a plurality of v-blocks contained in the airframe skirt. 10. The UAV of claim 1, wherein the printed circuit board is either rigid or rigid-flex. 11. The UAV of claim 1, further comprising a plurality of payload pods connected to the airframe skirt to form at least a portion of the annular duct of the UAV. 12. The UAV of claim 1, wherein each of the plurality of payload pods comprise at least one electronic component,wherein the printed circuit board comprises a plurality of connectors configured to connect electronic components of the plurality of payload pods, andwherein the printed circuit board forms a platform on which the plurality of payload pods are arranged to connect the electronic components of the plurality of payload pods via the plurality of connectors of the printed circuit board. 13. The UAV of claim 1, wherein the airframe skirt comprises a generally v-shaped shell comprising a first wall arranged radially inward from a second wall,wherein a first end of the first wall is connected to a first end of the second wall, andwherein the printed circuit board connects the first wall to the second wall distal to the first ends of each wall. 14. The UAV of claim 1, wherein an outer edge of the printed circuit board substantially matches an outer wall of the airframe skirt and wherein an inner edge of the printed circuit board abuts an inner wall of the airframe skirt. 15. A structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle (UAV), the structural ring interconnect printed circuit board comprising: a plurality of arcuate printed circuit boards configured to be attached to an airframe skirt of the UAV, wherein the airframe skirt defines at least a portion of one end of an annular duct of the UAV, wherein each of the plurality of printed circuit boards conforms to the shape of the airframe skirt and the plurality of printed circuit boards are configured to form a ring-shape when arranged together and connected to the airframe skirt, and wherein each of the plurality of the printed circuit boards is configured to increase structural integrity of the airframe skirt when attached thereto. 16. The structural ring interconnect printed circuit board assembly of claim 15, wherein an arc length of each of the plurality of printed circuit boards extends between 45 and 90 degrees around a circumference of the airframe skirt. 17. The structural ring interconnect printed circuit board assembly of claim 15, wherein an inner wall and an outer wall of the airframe skirt are thicker in sections of the airframe skirt corresponding to spaces between each of the plurality of printed circuit boards. 18. The structural ring interconnect printed circuit board assembly of claim 15 further comprising at least one connector on a surface of each of the plurality of printed circuit boards. 19. The structural ring interconnect printed circuit board assembly of claim 18, wherein the at least one connector comprises at least one socket connector on a surface of at least one of the plurality of printed circuit boards. 20. An unmanned aerial vehicle comprising: a ducted fan comprising a duct, wherein one end of the duct comprises a core vehicle body comprising an air frame skirt;a plurality of payload pods connected to the core vehicle to form the duct; anda printed circuit board attached the core vehicle body, wherein the printed circuit board conforms to a shape of the airframe skirt, and wherein the printed circuit board is configured to increase structural integrity of the airframe skirt when attached to the core vehicle body.

이 특허에 인용된 특허 (15)

이 특허를 인용한 특허 피인용횟수: 5

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Structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle

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Structural ring interconnect printed circuit board assembly for a ducted fan unmanned aerial vehicle

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이 특허에 인용된 특허 (15)

이 특허를 인용한 특허 피인용횟수: 5

IPC 상위 출원인

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IPC 상세정보(version : 201201)

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