System and method for directly coupling a chassis and a heat sink associated with a circuit board or processor
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-005/00
H05K-007/20
F28F-007/00
H01L-023/495
출원번호
US-0325921
(2008-12-01)
등록번호
US-8248806
(2012-08-21)
발명자
/ 주소
Mimberg, Ludger
출원인 / 주소
NVIDIA Corporation
대리인 / 주소
Zilka-Kotab, PC
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
A system and method are provided for directly coupling a chassis and a heat sink. A circuit board is provided with at least one processor mounted thereon. Additionally, a heat sink is provided, the heat sink being mechanically coupled to at least one of the circuit board and the processor for provid
A system and method are provided for directly coupling a chassis and a heat sink. A circuit board is provided with at least one processor mounted thereon. Additionally, a heat sink is provided, the heat sink being mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board. Furthermore, a mount is provided, the mount being coupled to the heat sink for providing a direct mechanical coupling with a chassis.
대표청구항▼
1. An apparatus, comprising: a circuit board with at least one processor mounted thereon, the circuit board having a circuit board connector along an edge of the circuit board for insertion into a circuit board slot of a motherboard for communication therebetween;a heat sink mechanically coupled to
1. An apparatus, comprising: a circuit board with at least one processor mounted thereon, the circuit board having a circuit board connector along an edge of the circuit board for insertion into a circuit board slot of a motherboard for communication therebetween;a heat sink mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board, the heat sink comprising a primary surface that interfaces with the at least one of the circuit board and the processor, and four walls formed orthogonally to and extending from the primary surface of the heat sink, a first one of the four walls being closest to the circuit board connector along the edge of the circuit board for orientation of the first wall parallel to the motherboard, a second one of the four walls opposite of the first wall relative to the primary surface of the heat sink and oriented parallel to the first wall, and third and fourth walls each perpendicular to and connecting the first wall and the second wall; anda mount coupled to the second wall of the heat sink for providing a direct mechanical coupling into a slot of a chassis, at least a portion of the mount extending from the second wall of the heat sink in a direction parallel to the circuit board connector of the circuit board for insertion of the mount into the slot of the chassis;wherein a second mount is coupled to the first wall of the heat sink for providing a second direct mechanical coupling into a second slot of the chassis, at least a portion of the second mount extending from the first wall of the heat sink in a direction parallel to the mount coupled to the second wall of the heat sink and parallel to the circuit board connector of the circuit board, for insertion of the second mount into the second slot of the chassis. 2. The apparatus of claim 1, wherein the processor includes a graphics processor. 3. The apparatus of claim 1, wherein the mount is integrally coupled to the second wall of the heat sink. 4. The apparatus of claim 1, wherein the mount is screwably coupled to the second wall of the heat sink. 5. The apparatus of claim 1, wherein the mount, when providing the direct mechanical coupling, precludes movement along at least one dimension. 6. The apparatus of claim 1, wherein the mount is substantially rectilinear. 7. The apparatus of claim 1, wherein the mount, when providing the direct mechanical coupling, precludes movement along at least two dimensions. 8. The apparatus of claim 1, wherein the mount is substantially cylindrical. 9. The apparatus of claim 1, wherein the mount is configured for providing the direct mechanical coupling with the chassis at a single point of contact. 10. The apparatus of claim 1, wherein the mount is configured for providing the direct mechanical coupling with the chassis at a plurality of points of contact. 11. The apparatus of claim 1, wherein the mount is configured for providing the direct mechanical coupling with the chassis utilizing another circuit board connector of the chassis. 12. The apparatus of claim 1, wherein a first portion of the mount resides in another plane that is separate and opposite from the plane in which the circuit board resides and a second portion of the mount substantially resides in the plane in which the circuit board resides. 13. The apparatus of claim 12, wherein the first portion of the mount that resides in the other plane is directly mechanically coupled with the chassis via a plurality of direct mechanical couplings of the chassis residing in the other plane. 14. The apparatus of claim 1, wherein the mount inhibits mechanical stress to the circuit board. 15. The apparatus of claim 1, wherein the mount has a substantially L-shaped configuration. 16. The apparatus of claim 1, wherein the first mount and second mount substantially reside in a plane that is the same as a plane in which the circuit board resides. 17. The apparatus of claim 16, wherein the mount and the second mount both have a substantially L-shaped configuration, such that both the mount and the second mount each have a first portion and a second portion, where the first portion of the mount is coupled along the second wall of the heat sink and the first portion of the second mount is coupled along the first wall of the heat sink, and the second portion of each of the mount and second mount extend from the corresponding first portion such that both of the second portions extends parallel to the circuit board connector. 18. The apparatus of claim 17, wherein the second portion of the second mount is in the plane of the circuit board connector such that the second mount is also inserted into the circuit board slot of the motherboard along with the circuit board connector of the circuit board. 19. A method, comprising; mechanically coupling a heat sink to at least one of a circuit board and a processor for providing thermal communication between the heat sink and the circuit board, the circuit board having a circuit board connector along an edge of the circuit board for insertion into a circuit board slot of a motherboard for communication therebetween, and the heat sink comprising a primary surface that interfaces with the at least one of the circuit board and the processor, and four walls formed orthogonally to and extending from the primary surface of the heat sink, the heat sink oriented such that: a first one of the four walls is closest to the circuit board connector along the edge of the circuit board for orientation of the first wall parallel to the motherboard,a second one of the four walls is opposite of the first wall relative to the primary surface of the heat sink and oriented parallel to the first wall, andthird and fourth walls are each perpendicular to, and connect, the first wall and the second wall; andcoupling a mount to the second wall of the heat sink for providing a direct mechanical coupling with a slot of a chassis, at least a portion of the mount extending from the second wall of the heat sink in a direction parallel to the circuit board connector of the circuit board for insertion of the mount into the slot of the chassis;wherein a second mount is coupled to the first wall of the heat sink for providing a second direct mechanical coupling into a second slot of the chassis, at least a portion of the second mount extending from the first wall of the heat sink in a direction parallel to the mount coupled to the second wall of the heat sink and parallel to the circuit board connector of the circuit board, for insertion of the second mount into the second slot of the chassis. 20. A system, comprising: a chassis configured to include: a circuit board with at least one processor mounted thereon, the circuit board having a circuit board connector along an edge of the circuit board for insertion into a circuit board slot of a motherboard for communication therebetween;a heat sink mechanically coupled to at least one of the circuit board and the processor for providing thermal communication between the heat sink and the circuit board, the heat sink comprising a primary surface that interfaces with the at least one of the circuit board and the processor, and four walls formed orthogonally to and extending from the primary surface of the heat sink, a first one of the four walls being closest to the circuit board connector along the edge of the circuit board for orientation of the first wall parallel to the motherboard, a second one of the four walls opposite of the first wall relative to the primary surface of the heat sink and oriented parallel to the first wall, and third and fourth walls each perpendicular to and connecting the first wall and the second wall; anda mount coupled to the second wall of the heat sink for providing a direct mechanical coupling into a slot of the chassis, at least a portion of the mount extending from the second wall of the heat sink in a direction parallel to the circuit board connector of the circuit board for insertion of the mount into the slot of the chassis;wherein a second mount is coupled to the first wall of the heat sink for providing a second direct mechanical coupling into a second slot of the chassis, at least a portion of the second mount extending from the first wall of the heat sink in a direction parallel to the mount coupled to the second wall of the heat sink and parallel to the circuit board connector of the circuit board, for insertion of the second mount into the second slot of the chassis. 21. The system of claim 20, wherein the processor remains in communication with memory and a display via a bus.
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