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A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member a

A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals. In the probe card of the present invention, the probe units are independently supported by respective space transformers such that it is possible to reduce thermal distortion of the probe card and simplifying the manufacturing and repairing processes.

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1. A probe card comprising: a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested;a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrical

1. A probe card comprising: a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested;a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes;a frame having a plurality of guide holes for fixedly positioning the respective probe units;an interposer array arranged below the space transformers for supporting the space transformers, the interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; anda printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals,wherein each space transformer comprises measurement devices arranged on an upper surface for enhancing test performance to a device to be tested,wherein the frame comprises a plurality of holes on a bottom surface for receiving the measurement devices, and the frame being made of any of Invar, Kovar, quartz, steel, and ceramic. 2. The probe card of claim 1, wherein each space transformer comprises a multi-layered printed circuit board. 3. The probe card of claim 1, further comprising a plurality of flatness adjustment screws penetrating the frame, space transformers, interposer array, and printed circuit board, for adjusting flatness of an upper surface of the frame. 4. A probe card comprising: a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested;a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes;a frame having a plurality of guide holes for fixedly positioning the respective probe units;an interposer array arranged below the space transformers for supporting the space transformers, the interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; anda printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals, wherein each probe unit comprises:a guide having at least one set of upper hole, lower hole, and middle hole interconnecting the upper and lower holes, the middle hole being greater than the upper and lower holes in size; andat least one probe situated in the set of upper, lower, and middle holes and a tip of the probe contact a chip pad to be tested. 5. The probe card of claim 1, wherein the interposer array comprises a plurality of interposers, each interposer supporting at least one space transformer.