IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0871853
(2010-08-30)
|
등록번호 |
US-8254122
(2012-08-28)
|
우선권정보 |
TW-99125038 A (2010-07-29) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Hon Hai Precision Industry Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
9 |
초록
▼
A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vent
A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan.
대표청구항
▼
1. A data center comprising: a housing comprising a top wall, a bottom wall opposite to the top wall, a front wall, a back wall opposite to the front wall, and opposite left and right sidewalls, wherein the front wall, the back wall, and the bottom wall define a plurality of through holes, the top w
1. A data center comprising: a housing comprising a top wall, a bottom wall opposite to the top wall, a front wall, a back wall opposite to the front wall, and opposite left and right sidewalls, wherein the front wall, the back wall, and the bottom wall define a plurality of through holes, the top wall defines a plurality of vents; anda plurality of heat units arranged in the housing, wherein each heat unit defines a plurality of through holes facing the front wall, the back wall, and left and right sidewalls of the housing, airflow pipes are formed arranged between the plurality of heat units and the left and right sidewalls of the housing; anda plurality of fans mounted in the housing, adjacent to and facing the plurality of vents of the top wall;wherein when the data center runs, cool air comes into the housing through the plurality of through holes of the front wall, the back wall, and the bottom wall, for cooling the heat units, the heated air goes into the airflow pipes and is then vented out of the housing through the plurality of vents of the top wall by the plurality of fans. 2. The data center of claim 1, further comprising two plates arranged on inner surfaces of the front wall and the back wall of the housing to sandwich each airflow pipe, wherein the plates are used for avoiding the heated air in the airflow pipes to go back to the heat units. 3. The data center of claim 1, further comprising a plurality of temperature sensing elements arranged in the housing adjacent to the plurality of fans, for sensing the temperature of the airflow near the plurality of fans.
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