IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0060288
(2008-04-01)
|
등록번호 |
US-8257791
(2012-09-04)
|
우선권정보 |
DE-102 52 863 (2002-11-12) |
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
220 |
초록
▼
A wood fiberboard, in particular floor panel, includes an HDF support board with a top side and an underside, the top side having a decoration, preferably a wood or tile decoration, is distinguished in that the decoration is printed directly onto the top side of the support board and is covered by a
A wood fiberboard, in particular floor panel, includes an HDF support board with a top side and an underside, the top side having a decoration, preferably a wood or tile decoration, is distinguished in that the decoration is printed directly onto the top side of the support board and is covered by at least one layer of a transparent synthetic resin.
대표청구항
▼
1. A process for producing a wood fiberboard comprising: printing a decoration directly onto a surface of a board;spreading one or more synthetic-resin layers onto the board, directly over the decoration printed directly onto a surface of the board; andpressing the synthetic-resin layers. 2. The pro
1. A process for producing a wood fiberboard comprising: printing a decoration directly onto a surface of a board;spreading one or more synthetic-resin layers onto the board, directly over the decoration printed directly onto a surface of the board; andpressing the synthetic-resin layers. 2. The process according to claim 1, wherein the printing is performed directly on a top surface of the board. 3. The process according to claim 2, wherein the printing is performed directly on a bottom surface of the board. 4. The process according to claim 1, further comprising stamping into the synthetic-resin layer which corresponds to the printed decoration. 5. The process according to claim 1, further comprising sawing floor panels from the wood fiberboard. 6. The process according to claim 1, wherein the board is made of one of HDF, MDF, and chipboard, and further comprising covering the top side by a paper free layer of a transparent synthetic resin. 7. The process according to claim 1, wherein the decoration printed on the board is of a wood or tile. 8. A process for producing a wood fiberboard comprising: printing a decoration directly onto a surface of one or two sides of the board;spreading, by use of a screen roller, one or more synthetic-resin layers of melamine-resin or urea-resin layers directly on a side of the board with the decoration and sides located opposite the decoration; andpressing the synthetic-resin layers. 9. The process according to claim 8, wherein a first synthetic-resin layer applied to the decoration is provided with corundum particles. 10. The process according to claim 8, further comprising, in a short cycle press, stamping a relief which corresponds to the decoration on a top side into the synthetic-resin layer. 11. The process according to claim 10, further comprising stamping a relief which corresponds to the decoration on an underside. 12. The process according to claim 10, further comprising sawing floor panels from the wood fiberboard. 13. The process according to claim 8, wherein the decoration is printed directly onto at least one of a top side and underside of the board. 14. The process according to claim 13, further comprising sawing floor panels from the wood fiberboard. 15. The process according to claim 8, further comprising sawing floor panels from the wood fiberboard. 16. The process according to claim 8, wherein the wood fiberboard comprises an HDF support board with a top side and an underside, the top side having the decoration printed thereon and covered by at least one layer of a transparent synthetic resin. 17. The process according to claim 8, wherein the decoration is printed onto an underside of the board. 18. The process according to claim 8, wherein the decoration is printed directly onto a top side of the board and the board is made of one of HDF, MDF, and chipboard, and further comprising covering the top side by a paper free layer of a transparent synthetic resin. 19. The process according to claim 8, wherein the decoration is printed onto a top side of the board and is covered by at least one layer of a transparent synthetic resin, wherein the board is made of one of HDF, MDF, and chipboard, and further comprising forming a relief on the top side which corresponds to the decoration. 20. The process according to claim 8, wherein the decoration printed on the board is of a wood or tile.
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