IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
|
| 출원번호 |
US-0396051
(2009-03-02)
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| 등록번호 |
US-8282801
(2012-10-09)
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|
발명자
/ 주소 |
- Rakiewicz, Edward F.
- McMillen, Mark W.
- Karabin, Richard F.
- Miles, Michelle
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| 출원인 / 주소 |
- PPG Industries Ohio, Inc.
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| 대리인 / 주소 |
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| 인용정보 |
피인용 횟수 :
0 인용 특허 :
26 |
초록
▼
Disclosed are methods for passivating metal substrates, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The methods comprise the steps of depositing an electropositive metal onto at least a portion of the substrate, followed immediately by electrophoretically dep
Disclosed are methods for passivating metal substrates, including ferrous substrates, such as cold rolled steel and electrogalvanized steel. The methods comprise the steps of depositing an electropositive metal onto at least a portion of the substrate, followed immediately by electrophoretically depositing on the substrate a curable, electrodepositable coating composition. The present invention also relates to coated substrates produced by the above methods.
대표청구항
▼
1. A method for passivating a metal substrate surface comprising: (a) depositing an electropositive metal onto at least a portion of the substrate, wherein the electropositive metal is deposited by contacting the substrate with a plating solution of a soluble metal salt that is essentially free of c
1. A method for passivating a metal substrate surface comprising: (a) depositing an electropositive metal onto at least a portion of the substrate, wherein the electropositive metal is deposited by contacting the substrate with a plating solution of a soluble metal salt that is essentially free of chromates and trication metal phosphates, wherein the electropositive metal is included in the plating solution in an amount from 1 to 50 ppm of total metal, measured as elemental metal; followed immediately by(b) electrophoretically depositing on the substrate a curable, electrodepositable coating composition. 2. The method of claim 1, wherein step (a) includes rinsing the metal substrate after deposition of the electropositive metal. 3. The method of claim 2, wherein the metal substrate is rinsed with deionized water. 4. The method of claim 2, wherein step (a) includes drying the metal substrate after rinsing. 5. The method of claim 1, wherein the electropositive metal is selected from the group consisting of nickel, copper, silver, gold and mixtures thereof. 6. The method of claim 5, wherein the electropositive metal comprises Copper. 7. The method of claim 1, wherein the substrate is immersed in the plating solution. 8. The method of claim 1, wherein the plating solution further comprises at least one mineral acid. 9. The method of claim 8, wherein the pH of the plating solution is less than 6. 10. The method of claim 1, wherein the substrate is not contacted with any pretreatment composition other than the plating solution. 11. The method of claim 1, wherein the electrodepositable composition comprises a resinous phase dispersed in an aqueous medium wherein the resinous phase comprises: (i) an active hydrogen group-containing ionic electrodepositable resin, and(ii) a curing agent having functional groups reactive with the active hydrogen groups of (i). 12. The method of claim 11, wherein the ionic electrodepositable resin is cationic. 13. The method of claim 1, wherein step (b) includes heating the substrate after deposition of the curable, electrodepositable coating composition to a temperature of 250 to 400° F. (121.1 to 204.4° C.) for a time sufficient to effect cure of the electrodepositable composition. 14. The method of claim 1, wherein the soluble metal salt comprises a water soluble copper salt. 15. The method of claim 14, wherein the water soluble copper salt is selected from copper cyanide, copper potassium cyanide, copper sulfate, copper nitrate, copper pyrophosphate, copper thiocyanate, disodium copper ethylenediaminetetraacetate tetrahydrate, copper bromide, copper oxide, copper hydroxide, copper chloride, copper fluoride, copper gluconate, copper citrate, copper lauroyl sarcosinate, copper formate, copper acetate, copper propionate, copper butyrate, copper lactate, copper oxalate, copper phytate, copper tartarate, copper malate, copper succinate, copper malonate, copper maleate, copper benzoate, copper salicylate, copper aspartate, copper glutamate, copper fumarate, copper glycerophosphate, sodium copper chlorophyllin, copper fluorosilicate, copper fluoroborate, copper iodate, copper (II) chloride dihydrate, copper (II) nitrate pentihydrate, copper salts of carboxylic acids in the homologous series formic acid to decanoic acid, copper salts of polybasic acids in the series oxalic acid to suberic acid, and copper salts of hydroxycarboxylic acids. 16. The method of claim 14, wherein the water soluble copper salt is included in the plating solution in an amount from 10 to 50 ppm of total copper, measured as elemental copper.
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