IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0353863
(2012-01-19)
|
등록번호 |
US-8300923
(2012-10-30)
|
우선권정보 |
JP-2006-338193 (2006-12-15) |
발명자
/ 주소 |
- Tateyama, Kazuki
- Ogawa, Hideki
- Imi, Satoshi
|
출원인 / 주소 |
|
대리인 / 주소 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
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인용정보 |
피인용 횟수 :
0 인용 특허 :
4 |
초록
▼
A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for
A process control method and data registration program for a surface mount line includes retrieving printing quality data, mounting quality data, and soldering pass/fail data from a primary recorder, recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder, and determining whether the solder printer and the mounter need adjustment by using the data of the components which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer.
대표청구항
▼
1. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate wi
1. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,wherein the determining includes; defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming; and determining whether the solder printer needs adjustment by using the upper control bound and the lower control bound. 2. The process control method according to claim 1, further comprising calculating representative data for each of the components from the printing quality data retrieved from the primary recorder, the recording includes recording the representative data as the printing quality data in the secondary recorder. 3. The process control method according to claim 2, wherein the printing quality data includes numerical data representing a shape of the solder printed on each electrode of the substrate, and the representative data includes statistics obtained by aggregating the numerical data for each of the components. 4. The process control method according to claim 3, wherein the statistics include an average and a standard deviation of the numerical data. 5. The process control method according to claim 1, wherein the determining by using the upper control bound and the lower control bound includes; defining a ratio of instances of which the representative data falls within the range between the upper control bound and the lower control bound versus a total number of the components processed by the solder printer; anddetermining in such a manner that, if the ratio is more than or equal to a target value, it is determined that the solder printer does not need adjustment and, if the ratio is less than the target value, it is determined whether the amount of solder is too large or too small on the basis of the representative data. 6. The process control method according to claim 1, wherein the mounting quality data includes amount of displacement of a mounting position of the component from a scheduled mounting position of the component on the substrate. 7. The process control method according to claim 6, wherein the determining includes determining in such a manner that a maximum and a standard deviation of the amount of displacement are compared with associated reference values for each type of the components and, if both the maximum and the standard deviation exceed the reference values, it is determined that the mounter needs adjustment. 8. The process control method according to claim 7, further comprising calculating representative data for each of the components from the printing quality data retrieved from the primary recorder, the recording includes recording the representative data as the printing quality data in the secondary recorder. 9. A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,wherein the determining includes causing a computer to execute; defining an upper control bound and a lower control bound for each type of the components by using the data of the components with the soldering pass/fail data indicating conforming; and determining whether the solder printer needs adjustment by using the upper control bound and the lower control bound. 10. The data registration program according to claim 9, further causing a computer to execute calculating representative data for each of the components from the printing quality data retrieved from the primary recorder, the recording includes recording the representative data as the printing quality data in the secondary recorder. 11. The data registration program according to claim 10, wherein the printing quality data includes numerical data representing a shape of the solder printed on each electrode of the substrate, and the representative data includes statistics obtained by aggregating the numerical data for each of the components. 12. The data registration program according to claim 11, wherein the statistics include an average and a standard deviation of the numerical data. 13. The data registration program according to claim 9, wherein the determining by using the upper control bound and the lower control bound includes causing a computer to execute; defining a ratio of instances of which the representative data falls within the range between the upper control bound and the lower control bound versus a total number of the components processed by the solder printer; anddetermining in such a manner that, if the ratio is more than or equal to a target value, it is determined that the solder printer does not need adjustment and, if the ratio is less than the target value, it is determined whether the amount of solder is too large or too small on the basis of the representative data. 14. The data registration program according to claim 13, further causing a computer to execute calculating representative data for each of the components from the printing quality data retrieved from the primary recorder, the recording includes recording the representative data as the printing quality data in the secondary recorder. 15. A process control method for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the process control method comprising: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,wherein the determining further includes issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment. 16. A data registration program for a surface mount line including a solder printer configured to print solder on a surface of a substrate, a solder print inspector configured to inspect the printed solder and outputting printing quality data, a mounter configured to mount components on the substrate with the solder printed, a mount inspector configured to inspect a state of the mounted components and outputting mounting quality data, a reflow furnace configured to heat the solder to solder the components to the substrate, and a soldering inspector configured to inspect a state of the soldering and outputting soldering pass/fail data, the data registration program registering each of the data by causing a computer to execute: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein,recording the printing quality data, the mounting quality data, and the soldering pass/fail data for each of the components in a secondary recorder; anddetermining whether the solder printer and the mounter need adjustment by using the data of the components, which are associated with the soldering pass/fail data recorded in the secondary recorder by a computer,wherein the determining further includes causing a computer to execute issuing an operation instruction to adjust the solder printer in response to the determination that the solder printer needs adjustment, and issuing an operation instruction to adjust the mounter in response to the determination that the mounter needs adjustment.
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