초록 ▼

A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data p

A method of deploying space-saving, high-density modular data pods is disclosed. The method includes installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; and coupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. A modular data center includes a central cooling device coupled to a central cooling fluid circuit. The central cooling device supports at least a portion of the cooling requirements of the chain of modular data pods. Adjacent common fluid and electrical circuit sections form a common fluid and electrical circuit that connects to the central cooling system.

대표청구항 ▼

1. A method of deploying modular data pods to form a data center, comprising: installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; andcoupling a plura

1. A method of deploying modular data pods to form a data center, comprising: installing a plurality of modular data pods in proximity to one another, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the modular data pod; andcoupling a plurality of the fluid and electrical circuit sections in series with each other to form a fluid and electrical circuit having a first end and a second end. 2. The method according to claim 1, further comprising coupling the fluid and electrical circuit to a central fluid and electrical circuit. 3. The method according to claim 2, further comprising coupling a central cooling device to the central fluid and electrical circuit, the central cooling device configured to satisfy at least a portion of the cooling requirements of the plurality of modular data pods. 4. The method according to claim 3, wherein the plurality of fluid and electrical circuit sections are a plurality of first fluid and electrical circuit sections and the fluid and electrical circuit is a first fluid and electrical circuit, further comprising: coupling a plurality of second fluid and electrical circuit sections of a respective second plurality of modular data pods in series to form a second fluid and electrical circuit having a first end and a second end; andcoupling a second fluid and electrical circuit section at the first end of the second fluid and electrical circuit to a first fluid and electrical circuit section at the second end of the fluid and electrical circuit. 5. The method according to claim 2, further comprising: coupling fluid and electrical circuit sections of a second plurality of modular data pods in series to form a second fluid and electrical circuit having a first end and a second end; andcoupling a second fluid and electrical circuit section of a modular data pod of the second plurality of modular data pods at the first end of the second fluid and electrical circuit to the central fluid and electrical circuit. 6. The method according to claim 5, wherein the central cooling device is a first central cooling device, further comprising coupling a second central cooling device to the central fluid and electrical circuit if the first central cooling device cannot satisfy at least a portion of the cooling requirements of the second plurality of modular data pods. 7. The method according to claim 1, wherein each modular data pod of the plurality of modular data pods includes a data enclosure and an auxiliary enclosure containing a respective fluid and electrical circuit section in fluidic and electrical communication with the data enclosure, and wherein the fluid and electrical circuit section forms a linear path defining at least first and second sides of the fluid and electrical circuit section and the data enclosures are positioned alternately on the at least first and second sides of the fluid and electrical circuit sections, further comprising coupling the data enclosures to the auxiliary enclosures on alternating sides of the fluid and electrical circuit sections. 8. The method according to claim 7, wherein the step of installing a plurality of modular data pods in proximity to one another includes arranging adjacent data enclosures on one of the respective first side of the fluid and electrical circuit section and the second side of the fluid and electrical circuit section to form a pathway providing a user access to the auxiliary enclosure. 9. The method according to claim 1, wherein the step of installing a plurality of modular data pods in proximity to one another includes installing the plurality of modular data pods in proximity to one another, each data pod including the fluid and electrical circuit section in fluidic and electrical communication with the modular data pod and a refrigerant cooling system in fluidic and electrical communication with the modular data pod, the refrigerant cooling system dedicated to cooling electronic equipment enclosed within the respective modular data pod. 10. A modular data center, comprising: a central fluid and electrical circuit;a chain of modular data pods, each data pod including a fluid and electrical circuit section in fluidic and electrical communication with the central fluid and electrical circuit;a plurality of the fluid and electrical circuit sections of each modular data pod coupled in series with each other to form a fluid and electrical circuit having a first end and a second end;the fluid and electrical circuit coupled to a central cooling fluid and electrical circuit; anda central cooling device coupled to the central cooling fluid circuit, the central cooling device configured to support at least a portion of the cooling requirements of the chain of modular data pods. 11. The modular data center according to claim 10, wherein the fluid and electrical circuit includes at least one fluid supply line and at least one fluid return line and wherein the at least one fluid supply line and the at least one fluid return line are in a reverse-return configuration. 12. The modular data center according to claim 10, wherein each modular data pod of the chain of modular data pods includes an auxiliary enclosure that comprises the respective fluid and electrical circuit section. 13. The modular data center according to claim 12, wherein each modular data pod of the chain of modular data pods includes a data enclosure that includes a portion of the respective fluid and electrical circuit sections, and wherein the fluid and electrical circuit sections form a linear path defining at least first and second sides of the fluid and electrical circuit and the data enclosures are positioned alternately on the at least first and second sides of the fluid and electrical circuit. 14. The modular data center according to claim 13, wherein adjacent data enclosures on at least one of the first side of the fluid and electrical circuit and the second side of the fluid and electrical circuit form a pathway providing access to the respective auxiliary enclosure included by the modular data pod. 15. The modular data center according to claim 13, wherein the data enclosure is in the shape of a polygon. 16. The modular data center according to claim 10, further comprising: a second chain of modular data pods, each modular data pod in the second chain of modular data pods including a fluid and electrical circuit section in fluidic and electrical communication with the central fluid and electrical circuit; anda second central cooling device coupled to the central fluid and electrical circuit, the second central cooling device configured to support at least a portion of the cooling requirements of the second chain of modular data pods. 17. The modular data center according to claim 10, the auxiliary enclosure including a fluid and electrical circuit and a refrigerant cooling system in fluidic and electrical communication with the fluid and electrical circuit, the refrigerant cooling system dedicated to cooling electronic equipment enclosed within the data enclosure of the respective modular data pod. 18. A method of deploying modular data pods to form a data center, comprising: installing a plurality of modular data pods in proximity to one another, each data pod including a circuit section in communication with the modular data pod; andcoupling a plurality of the circuit sections in series with each other to form a circuit having a first end and a second end. 19. The method according to claim 18, wherein the step of installing includes installing a plurality of modular data pods in proximity to one another, each data pod including one of a fluid circuit section and an electrical circuit section in communication with the modular data pod, andwherein the step of coupling includes coupling a plurality of the fluid circuit sections in series with each other to form a fluid circuit having a first end and a second end, or coupling a plurality of the electrical circuit sections in series with each other to form an electrical circuit having a first end and a second end. 20. The method according to claim 19, further comprising one of coupling the fluid circuit to a central fluid circuit and coupling the electrical circuit to a central electrical circuit.