IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0964222
(2010-12-09)
|
등록번호 |
US-8309173
(2012-11-13)
|
발명자
/ 주소 |
- Tuominen, Marko
- Shero, Eric
- Verghese, Mohith
|
출원인 / 주소 |
|
대리인 / 주소 |
Knobbe Martens Olson & Bear LLP
|
인용정보 |
피인용 횟수 :
87 인용 특허 :
90 |
초록
▼
An apparatus and method improves heating of a solid precursor inside a sublimation vessel. In one embodiment, inert, thermally conductive elements are interspersed among units of solid precursor. For example the thermally conductive elements can comprise a powder, beads, rods, fibers, etc. In one ar
An apparatus and method improves heating of a solid precursor inside a sublimation vessel. In one embodiment, inert, thermally conductive elements are interspersed among units of solid precursor. For example the thermally conductive elements can comprise a powder, beads, rods, fibers, etc. In one arrangement, microwave energy can directly heat the thermally conductive elements.
대표청구항
▼
1. A method of processing with a vapor produced from a solid precursor, comprising: placing independent solid units of precursor into a vessel;interspersing a plurality of independent units of loose thermally conductive material with the units of precursor, wherein the thermally conductive material
1. A method of processing with a vapor produced from a solid precursor, comprising: placing independent solid units of precursor into a vessel;interspersing a plurality of independent units of loose thermally conductive material with the units of precursor, wherein the thermally conductive material is inert with respect to the precursor and the conditions within the vessel, and wherein the thermally conductive material is selected from the group consisting of a transition metal carbide, boron carbide, silicon carbide and a carbon foam;feeding a carrier gas into the vessel through an inlet of the vessel;forming a vapor through applying heat energy from a separate energy source to both the thermally conductive material and the solid units of precursor; andtransporting the vapor from an outlet of the vessel to a reaction chamber with said carrier gas. 2. The method of claim 1, wherein interspersing comprises mixing the thermally conductive material in the form of fibers with the units of solid precursor. 3. The method of claim 1, wherein interspersing comprises mixing the thermally conductive material in the form of powder with the units of solid precursor. 4. The method of claim 3, wherein interspersing further comprises employing the thermally conductive material in the form of fibers in combination with the powder. 5. The method of claim 1, further comprising inserting a plurality of thermally conductive machined pieces into the vessel. 6. The method of claim 1, wherein forming a vapor through applying heat energy comprises transporting heat from walls of the vessel to the solid units of precursor through the thermally conductive material. 7. The method of claim 1, wherein interspersing comprises mixing the thermally conductive material in the form of irregular pieces with the units of solid precursor. 8. The method of claim 1, wherein interspersing comprises mixing the thermally conductive material in the form of beads with the units of solid precursor. 9. The method of claim 1, further comprising reacting the vapor in the reaction chamber to deposit a layer on a substrate. 10. The method of claim 9, wherein reacting the vapor to deposit the layer comprises atomic layer deposition (ALD). 11. The method of claim 9, wherein reacting the vapor to deposit the layer comprises chemical vapor deposition (CVD). 12. The method of claim 1, wherein interspersing the thermally conductive material with the solid units of precursor comprises forming a solid mixture having about 10% to 80% by volume of thermally conductive material in the mixture. 13. The method of claim 1, wherein the interspersing the thermally conductive material with the solid units of precursor comprises forming a solid mixture having about 30-60% by volume of thermally conductive material in the mixture. 14. The method of claim 1, wherein interspersing comprises mixing the thermally conductive material with the units of solid precursor. 15. The method of claim 1, wherein interspersing comprises providing the thermally conductive material with a thermal conductivity of at least about 50 W/M*K at room temperature. 16. The method of claim 1, wherein interspersing comprises providing the thermally conductive material with a thermal conductivity of at least about 80 W/M*K at room temperature. 17. The method of claim 1, wherein applying heat energy from a separate energy source comprises transmitting microwave energy from outside the vessel. 18. The method of claim 17, wherein applying energy from a separate energy source comprises absorbing the microwave energy in the thermally conductive material and transmitting the energy as heat to the solid units of precursor. 19. A method of processing with a vapor produced from a solid precursor, comprising: placing independent solid units of precursor into a vessel, wherein the precursor is selected from the group consisting of hafnium chloride (HfCl4) and zirconium chloride (ZrCl4);interspersing a plurality of independent units of loose thermally conductive material with the units of precursor, wherein the thermally conductive material is inert with respect to the precursor and the conditions within the vessel and wherein the thermally conductive material is selected from the group consisting of a transition metal carbide, boron carbide, silicon carbide and a carbon foam;feeding a carrier gas into the vessel through an inlet of the vessel;forming a vapor through applying heat energy from a separate energy source to both the thermally conductive material and the solid units of precursor; andtransporting the vapor from an outlet of the vessel to a reaction chamber with said carrier gas.
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