초록 ▼

The disclosed technology provides an adhesive article with repositionability and air egress characteristics. The adhesive article comprises an adhesive layer having a surface comprising a plurality of spaced apart non-adhesive forms. The non-adhesive forms are arranged in a pattern comprising one or

The disclosed technology provides an adhesive article with repositionability and air egress characteristics. The adhesive article comprises an adhesive layer having a surface comprising a plurality of spaced apart non-adhesive forms. The non-adhesive forms are arranged in a pattern comprising one or more lanes defined by adjacent rows of non-adhesive forms and a pattern of non-adhesive forms disposed in an area adjacent the lanes. The spacing between the non-adhesive forms in the area adjacent the lanes is larger than the spacing between the non-adhesive forms defining the lanes. The non-adhesive forms disposed within the area adjacent the lanes prevents sticking of the article prior to applying pressure. Upon application of pressure, air entrapped within the areas adjacent the lanes flows to the lanes, and the lanes provide the article with air egress.

대표청구항 ▼

1. A release liner comprising: a moldable layer;a release layer overlying the moldable layer, the release layer having a top surface; anda pattern of discrete, non-adhesive forms at least partially embedded into the release layer, the pattern of non-adhesive forms comprising: a lane comprising a fir

1. A release liner comprising: a moldable layer;a release layer overlying the moldable layer, the release layer having a top surface; anda pattern of discrete, non-adhesive forms at least partially embedded into the release layer, the pattern of non-adhesive forms comprising: a lane comprising a first row of discrete non-adhesive forms and a second row of discrete non-adhesive forms adjacent the first row of non-adhesive forms, the first and second rows being spaced apart from each other by a spacing S1 and individually having a maximum form-to-form spacing S3 between adjacent non-adhesive forms within a given row, at least some adjacent forms within one of the first and second rows are connected to one another; anda pattern of non-adhesive forms disposed in an area adjacent the lane and comprising at least two non-adhesive forms having a second form-to-form spacing S2, wherein S2 is greater than S1 and/or S3; andwherein the non-adhesive forms cover from about 1% to about 35% of the top surface of the release layer. 2. The release liner of claim 1 comprising at least two lanes spaced apart from one another, wherein the pattern of non-adhesive forms disposed adjacent the lane is disposed in an area intermediate the at least two lanes. 3. The release liner of claim 1 comprising two or more lanes disposed substantially parallel to one another. 4. The release liner of claim 1 comprising a plurality of lanes interconnected in a manner so as to define the edges of a polygon or define a curved geometry. 5. The release liner of claim 4, wherein the lanes are interconnected to form an array of polygons. 6. The release liner of claim 4, wherein the polygons are chosen from a triangle, a rectangle, a diamond, a pentagon, a hexagon, a heptagon, an octagon, a trapezoid, or a combination of two or more thereof. 7. The release liner of claim 1, wherein the form-to-form spacing S1 is from about 1 to about 150 μm. 8. The release liner of claim 1, wherein the form-to-form spacing S1 is from about 50 to about 150 μm. 9. The release liner of claim 1, wherein the form-to-form spacing S2 is from about 5 to about 500 μm. 10. The release liner of claim 1, wherein the form-to-form spacing S2 is from about 50 to about 300 μm. 11. The release liner of claim 1, wherein S2 is greater than S1. 12. The release liner of claim 1, wherein S2 is greater than S3. 13. The release liner of claim 1, wherein S2 is greater than S1 and S3. 14. The release liner of claim 1, wherein S3 is from about 1 to about 150 μm. 15. The release liner of claim 1, wherein the non-adhesive forms cover from about 3% to about 20% of the total surface area of the top surface of the release layer.