초록 ▼

The present invention relates to an explosive device comprising an explosive material, and at least one igniting stimulus configured to ignite the explosive material when activated. The explosive device further comprises a sheet of material provided with at least one hole at least partially filled w

The present invention relates to an explosive device comprising an explosive material, and at least one igniting stimulus configured to ignite the explosive material when activated. The explosive device further comprises a sheet of material provided with at least one hole at least partially filled with the explosive material, each hole forms an opening in a first side of said sheet material and said at least one igniting stimuli is arranged on said first side. The invention also relates to a method for manufacturing an explosive device.

대표청구항 ▼

1. An explosive device comprising: at least one circuit board;said at least one circuit board defining at least one hole;said at least one hole forming an opening in a first side of said at least one circuit board;an explosive material filling said at least one hole, said at least one hole in said a

1. An explosive device comprising: at least one circuit board;said at least one circuit board defining at least one hole;said at least one hole forming an opening in a first side of said at least one circuit board;an explosive material filling said at least one hole, said at least one hole in said at least one circuit board being completely filled by said explosive material at least in a plane parallel to said first side of said at least one circuit board; andat least one igniting stimulus configured to ignite said explosive material when activated,said at least one igniting stimulus being arranged on said first side. 2. The explosive device according to claim 1, wherein said at least one circuit board is an energy absorbent material. 3. The explosive device, according to claim 2, wherein said energy absorbent material comprises laminated structure, random fibre or ceramics. 4. The explosive device according to claim 2, wherein said at least one circuit board has a multilayered structure. 5. The explosive device according to claim 4, wherein said at least one circuit board comprises at least one laminated circuit board. 6. The explosive device according to claim 5, wherein said at least one circuit board comprises a plurality of circuit boards arranged to form said multilayered structure. 7. The explosive device according to claim 4, wherein said at least one circuit board is a multilayered circuit board. 8. The explosive device according to claim 1, wherein said at least one hole is completely filled with said explosive material. 9. The explosive device according to claim 1, wherein each hole is a through hole, thereby forming an opening on a second side, opposite to said first side, of said at least one circuit board. 10. The explosive device according to claim 9, wherein a sealing material is provided across the opening on the second side of the at least one circuit board. 11. The explosive device according to claim 1, wherein a first igniting stimulus comprises a conductor connected between two conductive surfaces arranged on said first side of the at least one circuit board. 12. The explosive device according to claim 11, wherein said conductor is a bridge wire, exploding bridge wire or an exploding foil. 13. The explosive device according to claim 11, wherein said conductor is arranged across the opening on said first side and in contact with said explosive material. 14. The explosive device according to claim 11, wherein said igniting stimulus further comprises ignition transfer material arranged between said conductor and said explosive material. 15. A method for manufacturing an explosive device comprising: providing at least one hole in at least one circuit board, said at least one hole forming an opening in a first side of said at least one circuit board;filling said at least one hole in said at least one circuit board with an explosive material, said filling being complete at least in a plane parallel to said first side of said at least one circuit board; andarranging at least one igniting stimulus on said first side of said at least one circuit board, said igniting stimulus being configured to ignite said explosive material when activated. 16. The method according to claim 15, wherein selecting said at least one circuit board to be an energy absorbing material. 17. The method according to claim 15, wherein arranging the at least one igniting stimulus comprises arranging a conductor between two conductive surfaces arranged on the first side of the at least one circuit board. 18. The method according to claim 17, wherein the method further comprises arranging the conductor across the opening on said first side and in contact with said explosive material. 19. The method according to claim 17, wherein the method further comprises arranging ignition transfer material between said conductor and said explosive material. 20. The method according to claim 15, wherein said filling with an explosive material comprises providing said explosive material into said at least one hole in a loose powdered form and compressing said loose powdered explosive material in said at least one hole in a direction perpendicular to said first side of said at least one circuit board.