초록 ▼

A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall.

A chemical mechanical polishing apparatus includes a container, a platen, first and second brushes, a polishing pad, a carrier, and a slurry supplier. The container has a bottom wall and a side wall. The side wall has an inwardly-extending upper portion. The platen is supported over the bottom wall. The platen is positioned lower than the inwardly-extending upper portion. The first brush brushes the side wall. The first brush is fixed to a side surface of the platen. The second brush brushes a side surface of the platen. The second brush is fixed to the bottom wall. The polishing pad is attached to the platen. The carrier presses a workpiece to be polished against the polishing pad. The slurry supplier supplies a slurry onto the polishing pad.

대표청구항 ▼

1. A chemical mechanical polishing apparatus comprising: a container having a bottom wall and a side wall, the side wall having an inwardly-extending upper portion; anda platen supported over the bottom wall,the side wall has a middle portion positioned at substantially the same level as the platen,

1. A chemical mechanical polishing apparatus comprising: a container having a bottom wall and a side wall, the side wall having an inwardly-extending upper portion; anda platen supported over the bottom wall,the side wall has a middle portion positioned at substantially the same level as the platen, anda distance between the inwardly-extending upper portion and the platen is smaller than a distance between the middle portion and the platen. 2. The chemical mechanical polishing apparatus according to claim 1, wherein the inwardly-extending upper portion is inside the middle portion in cross-sectional view. 3. The chemical mechanical polishing apparatus according to claim 1, further comprising: a first brush that brushes the side wall, the first brush being fixed to a side surface of the platen. 4. The chemical mechanical polishing apparatus according to claim 1, further comprising: a second brush that brushes a side surface of the platen, the second brush being fixed to the bottom wall. 5. The chemical mechanical polishing apparatus according to claim 1, further comprising: a first brush that brushes the side wall, the first brush being fixed to a side surface of the platen; anda second brush that brushes the side surface, the second brush being fixed to the bottom wall. 6. The chemical mechanical polishing apparatus according to claim 1, further comprising: a polishing pad attached to the platen;a carrier that presses a workpiece to be polished against the polishing pad; anda slurry supplier that supplies a slurry onto the polishing pad. 7. The chemical mechanical polishing apparatus according to claim 1, wherein the side wall has an outwardly convex shape in vertical cross-sectional view. 8. The chemical mechanical polishing apparatus according to claim 3, wherein the side wall and the first brush have an outwardly convex shape so as to contact each other in vertical cross-sectional view. 9. The chemical mechanical polishing apparatus according to claim 3, wherein the first brush comprises:a first portion having first and second ends, the first end being fixed to the side surface; anda first brush portion fixed to the second end, the first brush portion being pressed by the first portion against the side wall. 10. The chemical mechanical polishing apparatus according to claim 4, wherein the second brush comprises:a second portion vertically extending from the bottom wall;a third portion horizontally extending from the second portion; anda second brush portion attached to the third portion, the second brush portion being pressed by the third portion against the side surface. 11. The chemical mechanical polishing apparatus according to claim 5, wherein the first brush comprises:a first portion having first and second ends, the first end being fixed to the side surface; anda first brush portion fixed to the second end, the first brush portion being pressed by the first portion against the side wall, andthe second brush comprises:a second portion vertically extending from the bottom wall;a third portion horizontally extending from the second portion; anda second brush portion attached to the third portion, the second brush portion being pressed by the third portion against the side surface, and the second brush portion being positioned lower than the first portion. 12. The chemical mechanical polishing apparatus according to claim 1, wherein a distance between an end of the inwardly-extending upper portion and the platen is smaller than the distance between the middle portion and the platen. 13. A chemical mechanical polishing apparatus comprising: a container having a bottom wall and a side wall;a platen supported over the bottom wall, the platen being positioned lower than an upper portion of the side wall; anda brush that brushes the side wall, the brush being fixed to a side surface of the platen. 14. The chemical mechanical polishing apparatus according to claim 13, wherein the upper portion is inwardly extending. 15. The chemical mechanical polishing apparatus according to claim 14, wherein the side wall and the brush have an outwardly convex shape so as to contact each other. 16. The chemical mechanical polishing apparatus according to claim 13, wherein the brush comprises:a first portion having first and second ends, the first end being fixed to the side surface; anda brush portion fixed to the second end, the brush portion being pressed by the first portion against the side wall. 17. A chemical mechanical polishing apparatus comprising: a container having a bottom wall and a side wall;a platen supported over the bottom wall, the platen being positioned lower than an upper portion of the side wall; anda brush that brushes a side surface of the platen, the brush being fixed to the bottom wall. 18. The chemical mechanical polishing apparatus according to claim 17, wherein the upper portion is inwardly extending. 19. The chemical mechanical polishing apparatus according to claim 18, wherein the side wall has an outwardly convex shape in vertical cross-sectional view. 20. The chemical mechanical polishing apparatus according to claim 17, wherein the brush comprises:a first portion vertically extending from the bottom wall;a second portion horizontally extending from the first portion; anda brush portion attached to the second portion, the brush portion being pressed by the second portion against the side surface.