초록 ▼

This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical mic

This invention is directed to a new method of mass-transfer/fabrication of micro-sized features/structures onto the inner diameter (ID) surface of a stent. This new approach is provided by technique of through mask electrical micro-machining. One embodiment discloses an application of electrical micro-machining to the ID of a stent using a customized electrode configured specifically for machining micro-sized features/structures.

대표청구항 ▼

1. A method of mass-transferring a micro-pattern on a stent comprising: providing a metal electrode having an outer diameter capable of accommodating a non-conducting mask thereupon;coating the outer diameter of the metal electrode with the non-conducting mask to form a masked electrode;defining the

1. A method of mass-transferring a micro-pattern on a stent comprising: providing a metal electrode having an outer diameter capable of accommodating a non-conducting mask thereupon;coating the outer diameter of the metal electrode with the non-conducting mask to form a masked electrode;defining the micro-pattern on an outer diameter of the masked electrode;mounting the stent on the masked electrode, wherein an inner diameter of the stent is in contact with the outer diameter of the masked electrode; andtransferring the micro-pattern onto the inner diameter of the stent by electrochemical micromachining. 2. The method of claim 1, wherein the metal electrode is comprised of a metal selected from the group consisting of stainless steel, brass, copper, graphite, molybdenum, silver, tungsten, and platinum. 3. The method of claim 1, wherein the non-conducting mask is comprised of a material selected from the group consisting of a polymer, a ceramic, and an oxide. 4. The method of claim 1, wherein the stent is comprised of a metal selected from the group consisting of stainless steel, cobalt-chromium, nitinol, MP35N, platinum-chromium, and tantalum-titanium. 5. The method of claim 1, wherein the coating step is conducted by vacuum deposition. 6. The method of claim 1, wherein defining the micro-pattern further includes laser ablating the outer diameter of the masked electrode to form the micro-pattern. 7. The method of claim 6, wherein the laser for ablating the outer diameter of the masked electrode is selected from the group consisting of a femto-second laser, an excimer laser, a water assisted laser, and chirped pulse amplification type Ti-sapphire based laser. 8. The method of claim 6, wherein laser ablating further comprises utilizing a cover gas. 9. The method of claim 1, wherein transferring the micro-pattern further includes electrically contacting the stent and the masked electrode; providing an electrolyte solution; and micro-machining the inner diameter of the stent in machining gaps. 10. The method of claim 9, wherein the machining gaps are bounded on one side by the masked electrode and on the other side by the inner diameter of the stent. 11. The method of claim 9, wherein the electrolyte solution is comprised of an electrolyte selected from the group consisting of KCl, unsaturated AgCl, NaCl, LiCl, NaHCO3, NaOH, saline, H2SO4, HF, and H3PO4. 12. The method of claim 9, wherein micro-machining further comprises electrochemical machining utilizing a pulsed current. 13. The method of claim 9, further comprising removing the stent and masked electrode from the electrolyte solution; and washing and drying the stent and masked electrode. 14. The method of claim 1, further comprising removing the stent from the masked electrode. 15. The method of claim 1, wherein the micro-pattern further comprises a cross-sectional configuration selected from the group consisting of square, u-shaped, triangular, v-shaped, rectangular, keyway shaped. 16. The method of claim 1, wherein the metal electrode further comprises a shape selected from the group consisting of circular, tubular, and ellipsoidal. 17. The method of claim 1, wherein the circumference of the metal electrode is at least 95% of the circumference of the stent. 18. The method of claim 1, wherein the depth of the micro-pattern transferred to the inner diameter of the stent is between approximately 0.5 microns to approximately 10 microns. 19. The method of claim 1, wherein non-conducting mask has a thickness, and the depth of the micro-pattern transferred to the inner diameter of the stent is less than the thickness of the non-conducting mask. 20. The method of claim 1, wherein the coating step further comprises dipping, spray coating, air brushing, lamination, or chemical vapor deposition techniques.