Solid state light sheet or strip having cavities formed in bottom substrate
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/18
H01L-033/00
출원번호
US-0096814
(2011-04-28)
등록번호
US-8338840
(2012-12-25)
발명자
/ 주소
Lerman, Louis
York, Allan Brent
Henry, Michael David
Steele, Robert
Ogonowsky, Brian D.
출원인 / 주소
Quarkstar LLC
대리인 / 주소
Fish & Richardson P.C.
인용정보
피인용 횟수 :
20인용 특허 :
22
초록▼
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes f
A solid state light sheet and method of fabricating the sheet are disclosed. In one embodiment, bare LED chips have top and bottom electrodes, where the bottom electrode is a large reflective electrode. The bottom electrodes of an array of LEDs (e.g., 500 LEDs) are bonded to an array of electrodes formed on a flexible bottom substrate. Conductive traces are formed on the bottom substrate connected to the electrodes. A transparent top substrate is then formed over the bottom substrate. Various ways to connect the LEDs in series are described along with many embodiments. In one method, the top substrate contains a conductor pattern that connects to LED electrodes and conductors on the bottom substrate.
대표청구항▼
1. A lighting device comprising: a light strip, the light strip comprising: a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light
1. A lighting device comprising: a light strip, the light strip comprising: a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light strip is greater than a transverse dimension of the light strip, and wherein the first surface comprises a plurality of indentations, the indentations being spaced apart from one another and distributed along the longitudinal dimension of the light strip;a cover substrate comprising a rounded surface and a cover surface, the cover substrate being elongated along the longitudinal dimension of the light strip, the cover surface of the cover substrate being in contact with the first surface of the base substrate, and the rounded surface of the cover substrate having a rounded shape;a plurality of non-packaged light emitting diode (LED) dies being disposed between the base substrate and the cover substrate in respective indentations of the plurality of indentations such that during operation of the lighting device a peak intensity of light emitted by the plurality of non-packaged LED dies is output through the rounded surface of the cover substrate; anda first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the first surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors. 2. The device of claim 1 wherein the plurality of non-packaged LED dies are vertical diodes, each vertical diode having a first die electrode on a first surface and a second die electrode on an opposite surface, wherein at least a second portion of the first set of conductors are connected to the first die electrodes and at least a second portion of the second set of conductors are connected to the second die electrodes, such that the second portion of the first set of conductors and the second portion of the second set of conductors provide power to at least a portion of the plurality of non-packaged LED dies. 3. The device of claim 1 further comprising an encapsulant proximate to at least some of the plurality of non-packaged LED dies. 4. The device of claim 3 wherein the encapsulant substantially fills each indentation to encapsulate the non-packaged LED dies. 5. The device of claim 4 wherein the encapsulant further comprises a wavelength conversion material to create an alternative composition of light wavelengths. 6. The device of claim 1 further comprising a reflector coupled to the second surface of the base substrate for reflecting light emitted by the non-packaged LED dies towards the base substrate during operation of the lighting device. 7. The device of claim 1 further comprising a plurality of light strips, wherein the plurality of light strips are connected in parallel, and wherein the lighting device forms a lighting fixture. 8. The device of claim 7 further comprising a plurality of current sources connected to at least a portion of the plurality of the light strips, wherein each of the plurality of current sources is connected to a different light strip of the plurality of light strips. 9. The device of claim 1 wherein the base substrate and cover substrate are preformed prior to sandwiching the plurality of non-packaged LED dies. 10. The device of claim 1 wherein the indentations are distributed along the longitudinal dimension of the light strip in a single line. 11. The device of claim 1 further comprising a wavelength conversion layer in contact with at least a portion of the rounded surface of the cover substrate. 12. The device of claim 11 wherein the wavelength conversion layer comprises to create an alternative composition of light wavelengths. 13. The device of claim 1 wherein the rounded surface of the cover substrate has a hemispherical shape. 14. The device of claim 13 wherein a diameter of the hemispherical shape of the cover substrate is substantially equal to the transverse dimension of the light strip. 15. The device of claim 1 wherein the rounded surface of the cover substrate comprises a lens. 16. The device of claim 1 wherein a transverse cross section of the cover substrate is shaped as a semi-circular segment, and a chord length of the semi-circular segment is substantially equal to the transverse dimension of the light strip. 17. The device of claim 1 wherein the light strip is in a range of 2-10 millimeter wide. 18. The device of claim 1 wherein a length of the strip is defined by a number of non-packaged LED dies included in the plurality of non-packaged LED dies that are connected in series and a distance between each of the non-packaged LED dies. 19. The device of claim 1 wherein some of the plurality of non-packaged LED dies are connected in series by the first set of conductors and the second set of conductors. 20. A lighting device comprising: a light strip, the light strip comprising: a base substrate comprising a first surface and a second surface opposing the first surface, the base substrate being elongated along a longitudinal dimension of the light strip, where the longitudinal dimension of the light strip is greater than a transverse dimension of the light strip, and wherein the first surface comprises a groove along the longitudinal dimension of the light strip;a cover substrate comprising a rounded surface and a cover surface, the cover substrate being elongated along the longitudinal dimension of the light strip, the cover surface of the cover substrate being in contact with the first surface of the base substrate, and the rounded surface of the cover substrate having a rounded shape;a plurality of non-packaged light emitting diode (LED) dies being disposed spaced apart between the base substrate and the cover substrate in the groove such that during operation of the lighting device a peak intensity of light emitted by the plurality of non-packaged LED dies is output through the rounded cover surface of the cover substrate; anda first set of conductors and a second set of conductors configured to provide power to the non-packaged LED dies, where the non-packaged LED dies are connected to the first set of conductors and the second set of conductors without wires, and the first set of conductors is formed on the first surface of the base substrate and the second set of conductors is formed on the cover surface of the cover substrate, wherein at least a first portion of the first set of conductors are physically connected to at least a first portion of the second set of conductors. 21. The device of claim 20 further comprising a wavelength conversion layer in contact with at least a portion of the rounded surface of the cover substrate. 22. The device of claim 20 wherein the rounded surface of the cover substrate has a hemispherical shape. 23. The device of claim 22 wherein a diameter of the hemispherical shape of the cover substrate is substantially equal to the transverse dimension of the light strip. 24. The device of claim 20 wherein the rounded surface of the cover substrate comprises a lens. 25. The device of claim 20 wherein a transverse cross section of the cover substrate is shaped as a semi-circular segment, and a chord length of the semi-circular segment is substantially equal to the transverse dimension of the light strip. 26. The device of claim 20 wherein the light strip is in a range of 2-10 millimeter wide.
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