초록 ▼

A thermal valve for controlling heat transfer between two electronic components is disclosed. The thermal valve includes a first thermally conductive strip that is secured to the first electronic component and a second thermally conductive strip that is secured to the second electronic component. Th

A thermal valve for controlling heat transfer between two electronic components is disclosed. The thermal valve includes a first thermally conductive strip that is secured to the first electronic component and a second thermally conductive strip that is secured to the second electronic component. The first strip and the second strip are located between the two electronic components. The first strip changes its shape toward making contact with the second strip in response to a temperature increase of the first electronic component, and the second strip changes its shape away from making contact with the first strip in response to a temperature increase of the second electronic component. Other embodiments are also described and claimed.

대표청구항 ▼

1. A thermal valve, comprising: a first thermally conductive strip secured to a first electronic component and located between the first electronic component and a second electronic component; anda second thermally conductive strip secured to the second electronic component and located between the f

1. A thermal valve, comprising: a first thermally conductive strip secured to a first electronic component and located between the first electronic component and a second electronic component; anda second thermally conductive strip secured to the second electronic component and located between the first electronic component and the second electronic component, the first strip to change its shape toward making contact with the second strip in response to a temperature increase of the first electronic component, the second strip to change its shape away from making contact with the first strip in response to a temperature increase of the second electronic component. 2. The thermal valve of claim 1 wherein the first strip includes two different thermally conductive materials laminated together, wherein the second strip includes the same two different thermally conductive materials laminated together, and wherein the two different thermally conductive materials have different coefficients of thermal expansion. 3. The thermal valve of claim 1 wherein the first strip does not contact the second strip when essentially no heat is being generated by the first electronic component and by the second electronic component. 4. The thermal valve of claim 1 wherein the first strip does not contact the second strip when a temperature of the second electronic component is above a threshold temperature. 5. The thermal valve of claim 1 wherein the first strip does not contact the second strip when a temperature of the first electronic component is below a threshold temperature. 6. The thermal valve of claim 1 wherein the first strip contacts the second strip when a temperature of the first electronic component is above a threshold temperature while a temperature of the second electronic component is below the threshold temperature. 7. The thermal valve of claim 6 wherein the second strip separates from the first strip in response to the temperature of the second electronic component increasing to a temperature that is above the threshold temperature. 8. The thermal valve of claim 6 wherein the first strip separates from the second strip in response to the temperature of the first electronic component decreasing to a temperature that is below the threshold temperature. 9. The thermal valve of claim 1 further comprising a plurality of said first strips arranged in a linear array and a plurality of said second strips arranged in a linear array. 10. A apparatus, comprising: a mobile communications handset housing having integrated thereina camera module,a main logic board having an applications processor and memory installed thereon, anda thermal valve having a plurality of states responsive to a temperature of the camera module and a temperature of the main logic board, the plurality of states including a coupled state where the thermal valve thermally couples the camera module and the main logic board and a decoupled state where the thermal valve thermally decouples the camera module and the main logic board. 11. The apparatus of claim 10 wherein the thermal valve is in the decoupled state when essentially no heat is being generated by the camera module and the main logic board. 12. The apparatus of claim 10 wherein the thermal valve is in the decoupled state when the temperature of the main logic board is above a threshold temperature. 13. The apparatus of claim 10 wherein the thermal valve is in the decoupled state when the temperature of the camera module is below a threshold temperature. 14. The apparatus of claim 10 wherein the thermal valve is in the coupled state when the temperature of the camera module is above a threshold temperature while the temperature of the main logic board is below the threshold temperature. 15. The apparatus of claim 10 wherein the thermal valve includes a first thermally conductive strip secured to the camera module and a second thermally conductive strip secured to the main logic board, the first strip to curve in response to the temperature of the camera module increasing, the second strip to curve in response to the temperature of the main logic board increasing. 16. The apparatus of claim 15 wherein the thermal valve is in the decoupled state when the first strip is straight. 17. The apparatus of claim 15 wherein the thermal valve is in the decoupled state when the second strip curves away from the first strip. 18. The apparatus of claim 15 wherein the thermal valve is in the coupled state when the first strip curves toward the second strip and makes contact with the second strip while the second strip is straight. 19. The apparatus of claim 15 wherein the thermal valve includes a plurality of said first strips arranged in a linear array and a plurality of said second strips arranged in a linear array. 20. A method for modifying a thermal connection between a camera module and an active electronic component inside a housing of an electronic device, comprising: creating increased thermal conductance from the camera module to the active electronic component when a temperature of the camera module is above a threshold temperature while a temperature of the active electronic component is below the threshold temperature; andcreating decreased thermal conductance from the camera module to the active electronic component when the temperature of the active electronic component is above the threshold temperature. 21. The method of claim 20 further comprising creating decreased thermal conductance from the camera module to the active electronic component when essentially no heat is being generated by the camera module and the active electronic component. 22. The method of claim 20 further comprising creating decreased thermal conductance from the camera module and the active electronic component when the temperature of the camera module is below the threshold temperature. 23. The method of claim 20 wherein creating decreased thermal conductance comprises creating a separation between a first thermally conductive strip that is secured to the camera module and a second thermally conductive strip that is secured to the active electronic component. 24. The method of claim 20 wherein creating increased thermal conductance comprises creating contact between a first thermally conductive strip that is secured to the camera module and a second thermally conductive strip that is secured to the active electronic component. 25. The method of claim 24 wherein the first strip includes two different thermally conductive materials laminated together, wherein the second strip includes the same two different thermally conductive materials laminated together, and wherein the two different thermally conductive materials have different coefficients of thermal expansion to allow the first strip and the second strip to curl in response to an increase in temperature.