IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0825745
(2010-06-29)
|
등록번호 |
US-8351206
(2013-01-08)
|
발명자
/ 주소 |
- Campbell, Levi A.
- Chu, Richard C.
- Ellsworth, Jr., Michael J.
- Iyengar, Madhusudan K.
- Simons, Robert E.
|
출원인 / 주소 |
- International Business Machines Corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
42 인용 특허 :
157 |
초록
▼
Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized a
Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vertically-oriented, vapor-condensing unit facilitating condensing dielectric fluid vapor egressing from the immersion-cooled subsystems, the vertically-oriented, vapor-condensing unit being sized and configured to reside adjacent to at least one side of the electronics rack; a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump associated with a reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.
대표청구항
▼
1. A liquid-cooled electronics rack comprising: an electronics rack, the electronics rack comprising a plurality of immersion-cooled electronic subsystems, each immersion-cooled electronic subsystem comprising: a housing at least partially surrounding and forming a compartment about the electronic s
1. A liquid-cooled electronics rack comprising: an electronics rack, the electronics rack comprising a plurality of immersion-cooled electronic subsystems, each immersion-cooled electronic subsystem comprising: a housing at least partially surrounding and forming a compartment about the electronic subsystem, the electronic subsystem comprising a plurality of electronic components to be cooled;a dielectric fluid disposed within the compartment, wherein the plurality of electronic components to be cooled are at least partially immersed within the dielectric fluid; anda dielectric fluid inlet and a dielectric fluid vapor outlet in fluid communication with the compartment, wherein dielectric fluid is provided to the compartment via the dielectric fluid inlet and dielectric fluid vapor egresses from the compartment via the dielectric fluid vapor outlet;a vertically-oriented, vapor-condensing unit facilitating condensing of dielectric fluid vapor egressing from the compartments of the plurality of immersion-cooled electronic subsystems, wherein the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems are coupled in fluid communication with the vertically-oriented, vapor-condensing unit, and the vertically-oriented, vapor-condensing unit is sized and configured to reside adjacent to at least one side of the electronics rack;a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit;a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the plurality of immersion-cooled electronic subsystems;a pump associated with the reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the compartments of the plurality of immersion-cooled electronic subsystems; anda vertically-oriented, vapor-condensing heat exchanuer disposed within the vertically-oriented, vapor-condensing, unit, and a facility coolant supply line and a facility coolant return line coupled in fluid communication with the vertically-oriented, vapor-condensing heat exchanger for passing chilled facility coolant therethrough, the chilled faclity coolant being at a temperature below a saturation temperature of the dielectric fluid vapor egressing from the compartments of the plurality of immersion-cooled electronic subsystems. 2. The liquid-cooled electronics rack of claim 1, wherein the vertically-oriented, vapor-condensing unit is disposed within a door mounted to the electronics rack, and wherein the liquid-cooled electronics rack further comprises at least one dielectric fluid vapor hose facilitating coupling in fluid communication the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor- condensing unit disposed within the door, each dielectric fluid vapor hose of the at least one dielectric fluid vapor hose being a flexible hose coupled to the door adjacent to a hinge point of the door relative to the electronics rack. 3. The liquid-cooled electronics rack of claim 1, wherein the vertically-oriented, vapor-condensing unit is disposed with a door mounted to the electronics rack, and wherein the liquid-cooled electronics rack further comprises a dielectric fluid vapor return manifold coupled in fluid communication with the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the at least one dielectric fluid vapor hose, the dielectric fluid vapor return manifold being disposed within the electronics rack, and coupled in fluid communication with the vertically-oriented, vapor-condensing unit disposed within the door via the at least one dielectric fluid vapor hose. 4. The liquid-cooled electronics rack of claim 3, farther comprising a dielectric fluid return hose coupling in fluid communication a lower portion of the vertically-oriented, vapor-condensing unit in the door and the reservoir, wherein the reservoir is disposed within the electronics rack, the lower portion of the vertically-oriented, vapor-condensing unit collecting dielectric fluid condensate from the vertically-oriented, vapor-condensing heat exchanger for transfer via the dielectric fluid return hose to the reservoir. 5. The liquid-cooled electronics rack of claim 3, further comprising a plurality of dielectric fluid vapor hoses coupling in fluid communication the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit disposed within the door, each dielectric fluid vapor hose being a flexible hose coupling in fluid communication a respective dielectric fluid vapor outlet of an immersion-cooled electronic subsystem of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit and each dielectric fluid vapor hose being disposed adjacent to a hinge point of the door relative to the electronics rack. 6. The liquid-cooled electronics rack of claim 5, wherein the reservoir is disposed within the vertically-oriented, vapor-condensing unit below the vertically-oriented, vapor-condensing heat exchanger, and wherein the pump is a submerged pump within the reservoir. 7. The liquid-cooled electronics rack of claim 1, wherein the plurality of immersion-cooled electronic subsystems are horizontally-disposed within the electronics rack, each with the plurality of electronic components thereof being positioned in a lower portion of the compartment and immersed within the dielectric fluid, and wherein at least one immersion-cooled electronic subsystem of the plurality of immersion-cooled electronic subsystems further comprises a baffle disposed within the compartment to facilitate immersion cooling of the electronic components thereof and to facilitate directing dielectric fluid vapor within the compartment towards the dielectric fluid vapor outlet of the compartment. 8. A liquid-cooled electronics rack comprising: an electronics rack, the electronics rack comprising a plurality of immersion-cooled electronic subsystems, each immersion-cooled electronic subsystem comprising: a housing at least partially surrounding and forming a compartment about the electronic subsystem, the electronic subsystem comprising a plurality of electronic components to be cooled;a dielectric fluid disposed within the compartment, wherein the plurality of electronic components to be cooled are at least partially immersed within the dielectric fluid; anda dielectric fluid inlet and a dielectric fluid vapor outlet in fluid communication with the compartment, wherein dielectric fluid is provided to the compartment via the dielectric fluid inlet and dielectric fluid vapor egresses from the compartment via the dielectric fluid vapor outlet;a vertically-oriented, vapor-condensing unit facilitating condensing of dielectric fluid vapor egressing from the compartments of the plurality of immersion-cooled electronic subsystems, wherein the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems are coupled in fluid communication with the vertically-oriented, vapor-condensing unit, and the vertically-oriented, vapor-condensing unit is sized and configured to reside adjacent to at least one side of the electronics rack;a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit;a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the plurality of immersion-cooled electronic subsystems;a pump associated with the reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the compartments of the plurality of immersion-cooled electronic subsystems;multiple flow restrictors associated with multiple immersion-cooled electronic subsystems of the plurality of immersion-cooled electronic subsystems, each flow restrictor of the multiple flow restrictors being associated with a respective immersion-cooled electronic subsystem of the multiple immersion-cooled electronic subsystems and being disposed in fluid communication with the dielectric fluid inlet to the compartment thereof, and wherein the multiple flow restrictors facilitate balancing dielectric fluid flow from the dielectric fluid supply manifold to the multiple immersion-cooled electronic subsystems of the liquid-cooled electronics rack; anda vertically-oriented, vapor-condensing heat exchanger disposed within the Vertically-oriented, vapor-condensing unit, and a facility coolant supply line and a facility coolant return line coupled in fluid communication with the vertically-oriented, vapor-condensing heat exchanger for passing chilled facility coolant therethrowth, the chilled facility coolant being at a temperature below a saturation temperature of the dielectric fluid vapor ezressing from the compartments of the plurality of immersion-cooled electronic subsystems. 9. The liquid-cooled electronics rack of claim 8, wherein the multiple flow restrictors facilitate defining different dielectric fluid flow resistances through at least two immersion-cooled electronic subsystems of the multiple immersion-cooled electronic subsystems. 10. The liquid-cooled electronics rack of claim 8, wherein the vertically-oriented, vapor-condensing unit is disposed within a door mounted to the electronics rack, and wherein the liquid-cooled electronics rack further comprises at least one dielectric fluid vapor hose facilitating coupling in fluid communication the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit disposed within the door, each dielectric fluid vapor hose of the at least one dielectric fluid vapor hose being a flexible hose coupled to the door adjacent to a hinge point of the door relative to the electronics rack. 11. The liquid-cooled electronics rack of claim 8, wherein the vertically-oriented, vapor-condensing unit is disposed with a door mounted to the electronics rack, and wherein the liquid-cooled electronics rack further comprises a dielectric fluid vapor return manifold coupled in fluid communication with the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the at least one dielectric fluid vapor hose, the dielectric fluid vapor return manifold being disposed within the electronics rack, and coupled in fluid communication with the vertically-oriented, vapor-condensing unit disposed within the door via the at least one dielectric fluid vapor hose. 12. The liquid-cooled electronics rack of claim 11, further comprising a dielectric fluid return hose coupling in fluid communication a lower portion of the vertically-oriented, vapor-condensing unit in the door and the reservoir, wherein the reservoir is disposed within the electronics rack, the lower portion of the vertically-oriented, vapor-condensing unit collecting dielectric fluid condensate from the vertically-oriented, vapor-condensing heat exchanger for transfer via the dielectric fluid return hose to the reservoir. 13. The liquid-cooled electronics rack of claim 11, further compriSing a plurality of dielectric fluid vapor hoses coupling in fluid communication the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit disposed within the door, each dielectric fluid vapor hose being a flexible hose coupling in fluid communication a respective dielectric fluid vapor outlet of an immersion-cooled electronic subsystem of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit and each dielectric fluid vapor hose being disposed adjacent to a hinge point of the door relative to the electronics rack. 14. The liquid-cooled electronics rack of claim 13, wherein the reservoir is disposed within the vertically-oriented, vapor-condensing unit below the vertically-oriented, vapor-condensing heat exchanger, and wherein the pump is a submerged pump within the reservoir. 15. A method of facilitating liquid cooling of an electronics rack, the method comprising: providing the electronics rack with a plurality of immersion-cooled electronic subsystems, each immersion-cooled electronic subsystem comprising: a housing at least partially surrounding and forming a compartment about the electronic subsystem, the electronic subsystem comprising a plurality of electronic components to be cooled;a dielectric fluid disposed within the compartment, wherein the plurality of electronic components to he cooled are at least partially immersed within the dielectric fluid; anda dielectric fluid inlet and a dielectric fluid vapor outlet in fluid communication with the compartment, wherein dielectric fluid is provided to the compartment via the dielectric fluid inlet and dielectric fluid vapor egresses from the compartment via the dielectric fluid vapor outlet;proViding a vertically-oriented, vapor-condensing unit facilitating condensing of dielectric fluid vapor egressing from the compartments of the plurality of immersion-cooled electronic subsystems, wherein the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems are coupled in fluid communication with the vertically-oriented, vapor-condensing unit, and the vertically-oriented, vapor-condensing unit is sized and configured to reside adjacent to at least one side of the electronics rack;providing a reservoir for holding dielectric fluid, the reservoir receiving dielectric fluid condensate from the vertically-oriented, vapor-condensing unit;providing a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the plurality of immersion-cooled electronic subsystems;providing a pump associated with the reservoir for pumping under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the compartments of the plurality of immersion-cooled electronic subsystems; andwherein providing, the vertically-oriented vapor-condensing unit comprises providing a vertically-oriented, vapor-condensing heat exchanger disposed within the vertically-oriented, vapor-condensing unit, and the method further comprises providing a facility coolant supply line and a facility coolant return line coupled in fluid communication with the vertically-oriented, vapor-condensing, heat exchanger for passing chilled facility coolant therethrough, the chilled facility coolant being at a temperature below a saturation temperature of the dielectric fluid vapor egressing from the compartments of the plurality of immersion-cooled electronic subsystems. 16. The method of claim 15, wherein providing the vertically-oriented, vapor-condensing unit comprising disposing the vertically-oriented, vapor-condensing unit within a door mounted to the electronics rack, and wherein the method further comprises providing at least one dielectric fluid vapor hose facilitating coupling in fluid communication the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the vertically-oriented, vapor-condensing unit disposed within the door, each dielectric fluid vapor hose of the at least one dielectric fluid vapor hose being a flexible hose coupled to the door adjacent to a hinge point of the door relative to the electronics rack. 17. The method of claim 15, wherein providing the vertically-oriented, vapor-condensing unit further comprises disposing the vertically-oriented, vapor-condensing unit within a door mounted to the electronics rack, and the method further comprises providing a dielectric fluid vapor return manifold coupled in fluid communication with the dielectric fluid vapor outlets of the plurality of immersion-cooled electronic subsystems and the at least one dielectric fluid vapor hose, the dielectric fluid vapor return manifold being disposed within the electronics rack, and coupled in fluid communication with the vertically-oriented, vapor-condensing unit disposed within the door via the at least one dielectric fluid vapor hose.
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